A processing apparatus is equipped with: a first stage system that has a table on which a workpiece is placed and moves the workpiece held by the table; a beam irradiation system that includes a condensing optical system to emit beams; and a controller to control the first stage system and the beam irradiation system, and processing is performed to a target portion of the workpiece while the table and the beams from the condensing optical system are relatively moved, and at least one of an intensity distribution of the beams at a first plane on an exit surface side of the condensing optical system and an intensity distribution of the beams at a second plane whose position in a direction of an optical axis of the condensing optical system is different from the first plane can be changed.

A processing apparatus is equipped with: a first stage system that has a table on which a workpiece is placed and moves the workpiece held by the table; a beam irradiation system that includes a condensing optical system to emit beams; and a controller to control the first stage system and the beam irradiation system, and processing is performed to a target portion of the workpiece while the table and the beams from the condensing optical system are relatively moved, and at least one of an intensity distribution of the beams at a first plane on an exit surface side of the condensing optical system and an intensity distribution of the beams at a second plane whose position in a direction of an optical axis of the condensing optical system is different from the first plane can be changed.

A method includes depositing a plurality of dopant particles within a predetermined region of a transparent material. The method also includes focusing a laser beam along an optical axis to a focal region that overlaps with at least a portion of the predetermined region. The focal region can irradiate at least a first dopant particle of the plurality of dopant particles. The method further includes adjusting a parameter of the laser beam to generate a plasma configured to form an inclusion within the transparent material. The method additionally includes scanning the focal region along a path within the transparent material to elongate the inclusion generally along the path.

Disclosed is a method for an all-laser hybrid additive manufacturing. After a matrix is obtained by means of selective laser melting forming, a subtractive forming is carried out on the matrix by means of a pulse laser to form a cavity, and the cavity is then packaged to obtain a forming material with an internal cavity structure. A laser precision packaging method is used in the method based on the melting of the laser selective region. Also disclosed is the apparatus, comprising a laser unit (2), a control unit (4) and a forming unit (6). The laser unit is in light path connection with the forming unit, and the control unit is electrically connected with the laser unit and the forming unit respectively. The laser unit comprises a first laser light source to and a second laser light source. The forming unit comprises a welding unit (68), and the welding unit is controlled by the control unit and is matched with the laser unit for the additive manufacturing.

Provided is a laser adjustment method including: a first preparation process of acquiring an image including an image of a first damage formed in a first film due to irradiation of a first film wafer including a first wafer and the first film provided in the first wafer with first laser light as a first damage image; a second preparation process of preparing a second film wafer including a second wafer and a second film provided in the second wafer; a processing process of irradiating the second film wafer with second laser light after the first preparation process and the second preparation process to form a second damage in the second film; an imaging process of imaging the second film to acquire an image including an image of the second damage as a second damage image after the processing process; and an adjustment process of adjusting an aberration.

A method of additive manufacture is disclosed. The method may include providing a powder bed and directing a shaped laser beam pulse train consisting of one or more pulses and having a flux greater than 20 kW/cm.sup.2 at a defined two dimensional region of the powder bed. This minimizes adverse laser plasma effects during the process of melting and fusing powder within the defined two dimensional region.

The invention relates to a device for checking for foreign parts and/or deposits on support elements of a worktable, wherein the support elements are provided to support a flat workpiece for cutting with a laser or a water jet, wherein the support elements are arranged parallel to one another and have a first distance from one another, comprising: a sensor for detecting the foreign parts and/or the deposits in the space between two respective support elements.

The laser reflow apparatus of the present invention comprises a laser pressurization head module for pressing a bonding object, which includes a plurality of electronic components arranged on a substrate by a transmissive pressurization member while irradiating a laser beam through the pressurization member, to bond the electronic components to the substrate; and a bonding object transfer module for transferring the bonding object having transferred from one side of the laser pressurization head module to carry the bonding object to the other side thereof after passing through a reflow process of the laser pressurized head module.

A method for checking a connection region formed during a joining process of at least two metal components via a laser. The method includes producing a photographic recording of the connection region being formed, transforming the photographic recording, creating at least two image strips in the photographic recording, and assessing the at least two image strips. An apparatus for carrying out the method is further provided.

A laser soldering system using dynamic light spot and a method thereof are provided. A laser module is controlled to radiate toward multi-lens to form a light spot on a soldering target for soldering, and a lens distance between the multi-lens is adjusted to adjust a light spot size. The disclosure may provide multiple heating densities respectively adequate to different soldering status via adjusting the light spot size when using same laser power, so as to improve the soldering quality.