A laser processing device which irradiates a workpiece while scanning focused laser light and forms molten region on a surface of workpiece includes first optical sensor which has a function of detecting light generated from molten region during irradiation with the laser light, the detecting is performed for first measurement region on the surface of workpiece as a detection target, and second optical sensor which has a function of detecting light generated from molten region during irradiation with the laser light, the detecting is performed for second measurement region narrower than first measurement region on the surface of workpiece as a detection target.

A laser processing device which irradiates a workpiece while scanning focused laser light and forms molten region on a surface of workpiece includes first optical sensor which has a function of detecting light generated from molten region during irradiation with the laser light, the detecting is performed for first measurement region on the surface of workpiece as a detection target, and second optical sensor which has a function of detecting light generated from molten region during irradiation with the laser light, the detecting is performed for second measurement region narrower than first measurement region on the surface of workpiece as a detection target.

A non-metallic media substrate includes a disc-shaped substrate body having at least one media storage surface on a face thereof. The substrate body has a center opening having an inner diameter and an outer diameter surface, and the substrate body has a thickness. The substrate further includes an annular groove at the outer diameter of the media substrate, the annular groove having chamfered edges and an internal concavity extending toward the inner diameter.

A non-metallic media substrate includes a disc-shaped substrate body having at least one media storage surface on a face thereof. The substrate body has a center opening having an inner diameter and an outer diameter surface, and the substrate body has a thickness. The substrate further includes an annular groove at the outer diameter of the media substrate, the annular groove having chamfered edges and an internal concavity extending toward the inner diameter.

A wafer manufacturing apparatus includes an ingot grinding unit for grinding an upper surface of an ingot to planarize the upper surface of the ingot, a laser applying unit for forming peel-off layers in the ingot at a depth therein, which corresponds to the thickness of a wafer to be produced from the ingot, from the upper surface of the ingot, a wafer peeling unit for holding the upper surface of the ingot and peeling off a wafer from the ingot at the peel-off layers, a tray having an ingot support portion and a wafer support portion, and a belt conveyor unit for delivering the ingot supported on the tray between the ingot grinding unit, the laser applying unit, and the wafer peeling unit.

A method of joining electrical connections together includes evaluating at least one weld joint between at least two substrates, determining mismatch between the at least two substrates, and welding the at least two substrates together with a multi-step welding process. The multi-step welding process includes compensating for mismatch between the at least two substrates by welding on both sides but not overlapping a joint line between the at least two substrates with a first welding step and increasing melt volume and penetration depth of a weld between the at least two substrates with a second welding step.

A method of joining electrical connections together includes evaluating at least one weld joint between at least two substrates, determining mismatch between the at least two substrates, and welding the at least two substrates together with a multi-step welding process. The multi-step welding process includes compensating for mismatch between the at least two substrates by welding on both sides but not overlapping a joint line between the at least two substrates with a first welding step and increasing melt volume and penetration depth of a weld between the at least two substrates with a second welding step.

Systems and methods for detecting a material composition of a specimen and for cross-sectioning of the specimen. The system includes an imaging system, a femtosecond laser source, and optionally, a synchronized CO.sub.2 injection system. The imaging system is configured to capture image data of a surface of the specimen that has been etched by the laser. A machine learning model is applied to determine a predicted material composition of the specimen based at least in part on the image data. The machine learning model is trained to receive as input the image data and/or one or more quantified surface texture parameters determined from the image data and to produce as output an indication of a predicted material composition. A laser-based milling system is configured to use these material composition detection mechanisms to automatically determine when the laser system has milled through a first layer of a specimen and reached a second layer, and to adjust the operation of the milling system in response. The CO2 injection system can be used to provide fast, clean, high aspect ratio cross-sectioning of microelectronic parts for providing high-precision and high-throughput machining for material removal (e.g., for intrusive inspection of electronic components).

Systems and methods for detecting a material composition of a specimen and for cross-sectioning of the specimen. The system includes an imaging system, a femtosecond laser source, and optionally, a synchronized CO.sub.2 injection system. The imaging system is configured to capture image data of a surface of the specimen that has been etched by the laser. A machine learning model is applied to determine a predicted material composition of the specimen based at least in part on the image data. The machine learning model is trained to receive as input the image data and/or one or more quantified surface texture parameters determined from the image data and to produce as output an indication of a predicted material composition. A laser-based milling system is configured to use these material composition detection mechanisms to automatically determine when the laser system has milled through a first layer of a specimen and reached a second layer, and to adjust the operation of the milling system in response. The CO2 injection system can be used to provide fast, clean, high aspect ratio cross-sectioning of microelectronic parts for providing high-precision and high-throughput machining for material removal (e.g., for intrusive inspection of electronic components).

A system can include a head of a computer numerically controlled machine configured to deliver electromagnetic energy sufficient to cause a change in a material at least partially contained within an interior space of the computer numerically controlled machine. The system can further include an optical system comprising a plurality of optical elements in the computer numerically controlled machine. The plurality of optical elements can be oriented at a fixed angle to each other to deliver the electromagnetic energy from the head to the material.