There is provided a laser processing apparatus that processes a workpiece by irradiation with a laser beam. The laser processing apparatus includes a holding unit including a holding surface that holds the workpiece and a laser irradiation unit that irradiates the workpiece held by the holding unit with the laser beam. The laser irradiation unit includes a laser oscillator, a collecting lens that focuses the laser beam emitted from the laser oscillator, and a foreign matter adhesion preventing unit that prevents adhesion of a foreign matter to the collecting lens.

An additive manufacturing system can include at least one laser source and a speckle reduction system that receives light from the at least one laser source. The speckle reduction system provides laser light to an optical homogenizer that increases uniformity of laser light and can provide the light to an area patterning system.

A laser processing head for a laser beam uses actuators engaged with a delivery fiber end to deflect the fiber end relative to an optical axis. The laser beam from the fiber end is collimated by a collimator and is then focused by a focusing component disposed in the head beyond the collimator to a focal point. The focal point of the laser beam is deflected from the optical axis in relation to the deflection of the fiber end. The fiber end and the actuators are housed in a sealed module. Deflection of the laser beam can be sensed by reflecting portion of the laser beam to a sensing element so a control system can monitor and control the fiber end's movement. A mode-stripper in the sealed module removes light from cladding of the delivery fiber, and an actively cooled absorber in the module around the fiber absorbs the energy.

A laser soldering system includes a laser source module, a polarization adjusting assembly, a temperature sensor, and a controller. The laser source module is configured to emit a laser beam. The polarization adjusting assembly includes a plurality of polarization elements and at least one stepping motor. The polarization elements are configured to split the laser beam into a Gaussian beam and a ring-shaped beam. The Gaussian beam illuminates the first element, and the ring-shaped beam is illuminates the second element. The stepping motor is configured to adjust a size of the ring-shaped beam. The temperature sensor is configured to monitor temperatures of the first element and a temperature of the second element. The controller is electrically connected to the temperature sensor, the laser source module, and the polarization adjusting assembly.

A carrier tape hole processing device using laser drilling is provided. The carrier tape hole processing device includes a carrier tape formed in a band shape, a work unit configured to move the carrier tape while supporting the carrier tape, a laser drilling module disposed above the work unit and configured to irradiate a laser beam to the carrier tape placed on the work unit, a position recognition unit configured to detect a position and a moving speed of the carrier tape placed on the work unit, and a control unit configured to adjust a position of the laser beam irradiated by the laser drilling module. The control unit adjusts an irradiation position of the laser beam such that the laser beam follows the carrier tape according to the moving speed of the carrier tape detected by the position recognition unit.

A carrier tape hole processing device using laser drilling is provided. The carrier tape hole processing device includes a carrier tape formed in a band shape, a work unit configured to move the carrier tape while supporting the carrier tape, a laser drilling module disposed above the work unit and configured to irradiate a laser beam to the carrier tape placed on the work unit, a position recognition unit configured to detect a position and a moving speed of the carrier tape placed on the work unit, and a control unit configured to adjust a position of the laser beam irradiated by the laser drilling module. The control unit adjusts an irradiation position of the laser beam such that the laser beam follows the carrier tape according to the moving speed of the carrier tape detected by the position recognition unit.

In various embodiments, the beam parameter product and/or beam shape of a laser beam is adjusted by coupling the laser beam into an optical fiber of a fiber bundle and directing the laser beam onto one or more in-coupling locations on the input end of the optical fiber. The beam emitted at the output end of the optical fiber may be utilized to process a workpiece.

A laser processing head directs laser energy along an optical axis from a fiber to perform brazing or welding operations. A collimating stage collimates a diverging beam of the laser energy from the fiber into a collimated beam, and a focusing stage focuses the collimated beam into a converging beam to a focus spot for the desired operation. At least one of the stages has a changeable effective focal length for zoom functionality. A freeform refractive optic can be positioned in at least one of the diverging and collimated beams. For example, a freeform refractive optic in a first position is placed out of the diverging beam. However, the freeform refractive optic in a second position placed in the diverging beam can field map or intensity map the diverging beam to produce the mapped diverging beam, which increases an image of the fiber tip to the collimating stage.

The present invention discloses a laser scribing device that produces optimal scribing lines within a target substrate based on its thickness. This is accomplished by generating multiple or an optimum number of focal points, and dynamically adjusting the focal lengths of the focal points to create optimal distances between the scribing lines. The resulting scribing lines are efficient in breaking the target substrate. The position of the focal points and the distance between them are determined based on the thickness of the target substrate, and the distance between focal points or scribing lines can be dynamically adjusted by modifying the focal lengths of the focal points.

A laser ablation device includes: a laser irradiation part to emit a plurality of solid-state laser beams; an optical system to convert the plurality of solid-state laser beams into output light; and a stage to receive an irradiation target to be irradiated with the output light. A minor axis of the output light has a semi-super Gaussian profile of order 2 to order 2.4.