A workpiece-separating device includes: a holding member which detachably holds one of the workpiece and the supporting body; a laser irradiation part which irradiates the separating layer with the laser beam through the other of the supporting body and the workpiece of the laminated body being held by the holding member; and a controlling part which controls an operation of the laser irradiation part, wherein the laser irradiation part has a laser scanner which moves the spot like laser beam along the laminated body, an entire irradiated face of the separating layer in an area of the laser beam irradiated from the laser scanner toward the laminated body is divided into a plurality of irradiation areas each having a band shape that is elongated in one of two directions intersecting a light irradiation direction from the laser irradiation part.

An interpolation parameter calculation unit calculates an interpolation parameter of a predetermined interpolation calculation formula based on a first plurality of coordinate values input by means of a coordinate input unit and constituting a coordinate pattern for determining a locus pattern of one cycle when a laser beam is vibrated. A locus pattern calculation unit calculates a second plurality of coordinate values constituting the locus pattern based on an interpolation parameter, respective amplitudes of the locus pattern in an x-axis direction that is a moving direction of a processing head and a y-axis direction that is a direction orthogonal to the x-axis direction, a frequency of the locus pattern, and a control cycle of a beam vibration mechanism for vibrating the laser beam.

An interpolation parameter calculation unit calculates an interpolation parameter of a predetermined interpolation calculation formula based on a first plurality of coordinate values input by means of a coordinate input unit and constituting a coordinate pattern for determining a locus pattern of one cycle when a laser beam is vibrated. A locus pattern calculation unit calculates a second plurality of coordinate values constituting the locus pattern based on an interpolation parameter, respective amplitudes of the locus pattern in an x-axis direction that is a moving direction of a processing head and a y-axis direction that is a direction orthogonal to the x-axis direction, a frequency of the locus pattern, and a control cycle of a beam vibration mechanism for vibrating the laser beam.

Systems and methods here may be used to support a laser eye surgery device, including a base assembly mounted to an optical scanning assembly via, a horizontal x axis bearing, a horizontal y axis bearing, and a vertical z axis bearing, mounted on the base assembly, configured to limit movement of the optical scanning assembly in an x axis, y axis and z axis respectively, relative to the base assembly, a vertical z axis spring, configured to counteract the forces of gravity on the optical scanning assembly in the z axis, and, mirrors mounted on the base assembly and positioned to reflect an energy beam into the optical scanning assembly no matter where the optical scanning assembly is located on the x axis bearing, the y axis bearing and the z axis bearing.

Systems and methods here may be used to support a laser eye surgery device, including a base assembly mounted to an optical scanning assembly via, a horizontal x axis bearing, a horizontal y axis bearing, and a vertical z axis bearing, mounted on the base assembly, configured to limit movement of the optical scanning assembly in an x axis, y axis and z axis respectively, relative to the base assembly, a vertical z axis spring, configured to counteract the forces of gravity on the optical scanning assembly in the z axis, and, mirrors mounted on the base assembly and positioned to reflect an energy beam into the optical scanning assembly no matter where the optical scanning assembly is located on the x axis bearing, the y axis bearing and the z axis bearing.

A method for separating a temporarily bonded substrate stack by bombardment of a joining layer of the substrate stack by means of laser beams emitted by a laser, characterised in that laser beams of the laser reflected and/or transmitted at the temporarily bonded substrate stack are detected during the bombardment of the joining layer with the laser beams. The invention also relates to a corresponding device.

A method for separating a temporarily bonded substrate stack by bombardment of a joining layer of the substrate stack by means of laser beams emitted by a laser, characterised in that laser beams of the laser reflected and/or transmitted at the temporarily bonded substrate stack are detected during the bombardment of the joining layer with the laser beams. The invention also relates to a corresponding device.

A cutting machine is provided with a machine main body and an NC device. The NC device controls the machine main body and has a tool radius compensation amount calculation unit, a machining path calculation unit, and a drive control unit. The tool radius compensation amount calculation unit generates tool radius compensation information. The machining path calculation unit generates a tool radius compensation control signal. The drive control unit generates a drive control signal. The machine main body has a machining unit and a tool path control unit. The machining unit cuts a workpiece by changing a relative position thereof with respect to the workpiece. Based on the drive control signal, the tool path control unit controls a tool path corresponding to a cutting tool and having a non-circular shape.

A method for treating a surface of a contoured titanium substrate used for adhesively bonded engine components. The method including applying energy from a fiber laser system to a contoured surface of a titanium substrate, the laser energy is distributed to the contoured titanium surface by at least one of direct light of sight, reflection, or scattering of one or more laser beam.

A laser processing apparatus includes two chuck tables for holding workpieces on their holding surfaces, an X-axis feed unit for moving the chuck tables which are being arrayed in an X-axis direction, a laser beam applying unit for applying a laser beam to the workpiece on one at a time of the chuck tables to process the workpiece, and a pair of delivery areas arrayed in the X-axis direction on both sides of the laser beam applying unit, for delivering workpieces to and from the chuck tables. The laser beam applying unit includes a laser oscillator, a beam condenser, and a laser beam scanning unit for displacing a position where the laser beam is applied to the holding surface of the one of the chuck tables.