A fixture for facilitating the serial engraving of a plurality of cylindrical objects such as glasses or mugs mounted on individual serially arranged stations along a master base plate. Each station includes a drive structure and, spaced therefrom, a passive support structure. The two structures in each station can be gang-adjusted for object length. In addition, the support structures can be height-adjusted to level the engraved surfaces of tapered objects. All of the drive structures include drive wheel pairs and all are driven by a single stepper motor via a single shaft and individual belt and pulley systems.

A method of assembling together a first part and at least one second part that are made of materials compatible with bonding by molecular adhesion includes a step of pressing a first surface of the first part against a second surface of the second part so as to create molecular bonds at an interface between the parts, and a step of consolidating the interface bonding as created in this way by heat treatment. The consolidation includes a step of emitting a power laser beam towards an impact point forming a portion of the outline of the interface, and a step of moving the impact point along the outline of the interface.

A feed mechanism moves a workpiece relative to a cylindrical machining region of laser light. A light receiver receives the laser light that has passed through without being used for machining the workpiece. An intensity detector detects light intensity of the laser light thus received. A controller detects the end of machining on the basis of the light intensity thus detected.

This inspection device includes: a laser irradiation unit that irradiates a wafer having a back surface and a front surface with a laser beam from the back surface side of the wafer; an imaging unit that outputs light having permeability to the wafer and detects the light propagating through the wafer; and a control part configured to perform a first process of controlling the laser irradiation unit so that a modified region is formed inside the wafer by irradiating the wafer with the laser beam and a second process of deriving a position of the modified region on the basis of a signal output from the imaging unit that detects the light and deriving a thickness of the wafer on the basis of the derived position of the modified region and a set recipe.

A cleaving assembly and a method for cleaving a glass body having a face at a desired angle greater than 0 degrees are disclosed. The assembly comprises a laser device for emitting a laser beam, a rotating device, and a positioning fixture. The rotating device has a head that rotates about a central axis that is orthogonal to the laser beam. The positioning fixture is operatively mounted to the head and centered axially along the central axis and is also rotatably driven by the rotating device. The positioning fixture has a tapered surface that is transverse to the central axis and that supports the glass body at a predetermined angle relative to the central axis. Rotation of the positioning fixture about the central axis when the glass body is exposed to the laser beam, cleaves the face of the glass body at the desired angle due to the glass body being supported transverse to the central axis.

A method of producing a wafer from a hexagonal single-crystal ingot includes the steps of planarizing an end face of the hexagonal single-crystal ingot, forming a peel-off layer in the hexagonal single-crystal ingot by applying a pulsed laser beam whose wavelength is transmittable through the hexagonal single-crystal ingot while positioning a focal point of the pulsed laser beam in the hexagonal single-crystal ingot at a depth corresponding to a thickness of a wafer to be produced from the planarized end face of the hexagonal single-crystal ingot, recording a fabrication history on the planarized end face of the hexagonal single-crystal ingot by applying a pulsed laser beam to the hexagonal single-crystal ingot while positioning a focal point of the last-mentioned pulsed laser beam in a device-free area of the wafer to be produced.

A laser tool, in particular for the structuring of cylinder running surfaces, that offers the possibility of guiding the laser beam of the laser tool with high process reliability, it is provided that the laser tool has a laser source for producing laser beams that are passed through a lens tube located in a hollow shaft, wherein a lens through which the laser beams are passed is attached to the lens tube, wherein the hollow shaft is designed to be rotatable as a hollow-shaft motor, wherein a spindle, to which is attached an optical device for deflecting the laser beam onto a workpiece surface, is attached to the hollow shaft, wherein the hollow shaft is rotatable independently of the lens.

A process system is a process system performing a processing process on an object by irradiating at least a part of the object with processing light from a processing light source, and includes a combining optical system combining optical path of measurement light from a measurement light source and optical path of the processing light from the processing light source; an irradiation optical system irradiating the object with the processing light and the measurement light from the combining optical system; a position change apparatus changing a relative positional relationship between the object and a light concentration position of the processing light from the irradiation optical system; an light reception apparatus receiving, through the irradiation optical system, light generated by the measurement light with which a surface of the object is irradiated; and a control apparatus controlling the position change apparatus by using output from the light reception apparatus.

A machining program generation device that generates a machining program for controlling a 3D printing apparatus to form an object by stacking a plurality of layers, includes: a machining route generation unit that extracts a plurality of support points that are based on an end point, an intersection point, and a bending point of the machining path from machining path data indicating a shape and a position of the machining path for forming each of the plurality of layers, and generates a machining route by adding, to the machining path, an order of shaping indicating that shaping of the support points is to be executed first and then shaping of a gap line segment connecting the plurality of support points shaped is to be executed; and a machining program generation unit that generates a machining program for controlling the 3D printing apparatus according to the machining route.

A laser processing apparatus includes a chuck table that holds an SiC ingot on a holding surface, a laser beam irradiation unit that positions the focal point of a laser beam to a depth equivalent to the thickness of a wafer to be produced from a first surface and that irradiates the SiC ingot with the laser beam to form a separation layer arising from separation of SiC into Si and C and extension of cracks along a c-plane. A movement unit relatively moves the chuck table and the laser beam irradiation unit, and a separation layer inspecting unit executes irradiation with inspection light with such a wavelength as to have transmissibility with respect to the SiC ingot and be reflected by the separation layer, and inspects the separation layer from the intensity of reflected light. The holding surface has a color that absorbs the inspection light.