There is provided a method of determining whether or not a result of a processing process of a laser processing apparatus is acceptable including a laser processing step of applying a laser beam to predetermined processing regions of a workpiece held on a chuck table, thereby performing a piercing process on the workpiece, an image capturing step of capturing images of all the processing regions while moving the image capturing unit and the workpiece relatively to each other, a detecting step of detecting regions where light is not transmitted through the workpiece among the processing regions in the image captured in the image capturing step, and a determining step of determining that the laser processing apparatus needs to be readjusted if the regions where light is not transmitted through the workpiece is equal to or more than the predetermined quantity.

A processing apparatus includes a chuck table including a plate-shaped holding component having a predetermined region transparent from one surface to the other surface, a processing unit that processes a workpiece, a first imaging unit disposed over the chuck table to acquire a normal image of the back surface side, and a second imaging unit disposed under the chuck table to acquire a normal image of the front surface side, a display device, and a control part that executes image processing of the normal image of either the back or front surface side to cause the normal image subjected to the image processing to be displayed on the display device in the state of being inverted in a predetermined direction in order to allow the orientation of the normal image of the back surface side to correspond with the orientation of the normal image of the front surface side.

A substrate processing method of a combined substrate in which a first substrate and a second substrate are bonded to each other is provided. A separation facilitating layer and a laser absorption layer are formed on the second substrate in this order. The substrate processing method includes forming a separation modification layer by radiating laser beam to the laser absorption layer while generating a stress in the laser absorption layer; and separating the second substrate from the first substrate along a boundary between the second substrate and the separation facilitating layer.

A method for producing an active part (1) for a rotary electric machine (101), comprising the following steps: providing a core (2) for the active part (1) and shaped conductors (6) inserted into the core; joining together, in each case, two of the end areas (9) so that the two end areas (9) form a pair (10); and welding each pair (10) of the end areas (9) by means of a laser beam which is guided on the end areas (9) of the pair (10) along a first trajectory (13).

A processing apparatus using laser according to an embodiment includes a stage configured to hold a plurality of substrates on concentric circles and rotates around a center of the concentric circles, and a laser irradiation apparatus capable of moving in a radial direction of the concentric circles, the laser irradiation apparatus including a control unit configured to control an output of an infrared pulsed laser so that a plurality of laser spots adjacent to each other are separated from each other.

A processing apparatus configured to process a processing target object includes a holder configured to hold the processing target object; a modifying device configured to radiate laser light to an inside of the processing target object to form multiple internal modification layers; and a controller. The controller controls an operation of forming the internal modification layers such that the internal modification layers are formed in a spiral shape from a diametrically outer side of the processing target object toward a diametrically inner side thereof, and such that an eccentric amount between the holder and the processing target object held by the holder in the forming of the internal modification layers toward the diametrically inner side of the processing target object becomes smaller than the eccentric amount in forming the internal modification layers toward the diametrically outer side of the processing target object.

The laser machining device includes an observation image acquiring unit configured to repeatedly acquire an observation image of a machining spot of laser light emitted from a laser optical system to a street on a wafer while a machined groove is being formed, a luminance detector configured to detect a luminance of a plasma generated at the machining spot by emission of the laser light based on the observation image every time the observation image acquiring unit acquires the observation image, a correspondence information obtaining unit configured to obtain correspondence information indicating a correspondence relationship among the luminance, energy of the laser light and a machined state of the machined groove, and a machined state assessing unit configured to assess the machined state with reference to the correspondence information based on the luminance and known energy of the laser light every time the luminance detector detects the luminance.

There is provided a processing method of a workpiece including a necessary region and an unnecessary region. The processing method includes a protective wall forming step of irradiating a region that defines the boundary between the necessary region and the unnecessary region with a laser beam with a wavelength that has transmissibility with respect to the workpiece and forming a plurality of shield tunnels composed of a fine pore and a modified tube that surrounds the fine pore, thereby forming a protective wall, and an unnecessary region removal step of removing the unnecessary region after executing the protective wall forming step.

The present application describes a laser turning system (1) for producing a timepiece component, the system including a rotary spindle (3) for moving a bar of material (50) and a galvanometric scanner (12) capable of emitting a femtosecond laser beam scanning a generating profile of the component to be machined in the bar of material (50).

A laser turning system (1) for producing a component (60) having a length less than 250 mm and/or a diameter less than 10 mm, the system including a rotary spindle (3) for moving a bar of material and a galvanometric scanner (12) capable of emitting a femtosecond laser beam scanning a generating profile of the component to be machined in the bar of material.