A manufacturing method for a joint body having a first metal member and a second metal member joined together by causing a laser oscillation system to irradiate a surface of the second metal member placed on the first metal member with laser light to form a joint portion including a welded portion where the first metal member and the second metal member are joined together includes continuously supplying the second metal member while pressing the second metal member against the first metal member, the second metal member being a hoop material, and causing the laser oscillation system to emit the laser light.

A laser processing device and a laser processing method that are capable of forming a high-quality semiconductor film are provided. An ELA device (excimer laser annealing device) (1) includes a laser oscillator (10) that generates laser light for forming a polysilicon film by irradiating an amorphous silicon film over a substrate to be processed with the laser light, a pulse measuring instrument (100) for detecting first partial light and second partial light contained in the laser light, and a monitoring device (60) for comparing a detection result of the first partial light with a detection result of the second partial light.

An aspiration system includes a pump and a control system in communication with the pump. The control system includes a microcontroller, an antenna configured to receive a signal, and a pump control board in communication with the microcontroller. The antenna is in communication with the microcontroller. Upon receiving the signal, the pump control board operates the pump to create negative pressure according to the signal.

A substrate processing method of a combined substrate in which a first substrate and a second substrate are bonded to each other is provided. A separation facilitating layer and a laser absorption layer are formed on the second substrate in this order. The substrate processing method includes forming a separation modification layer by radiating laser beam to the laser absorption layer while generating a stress in the laser absorption layer; and separating the second substrate from the first substrate along a boundary between the second substrate and the separation facilitating layer.

A processing apparatus using laser according to an embodiment includes a stage configured to hold a plurality of substrates on concentric circles and rotates around a center of the concentric circles, and a laser irradiation apparatus capable of moving in a radial direction of the concentric circles, the laser irradiation apparatus including a control unit configured to control an output of an infrared pulsed laser so that a plurality of laser spots adjacent to each other are separated from each other.

A processing apparatus configured to process a processing target object includes a holder configured to hold the processing target object; a modifying device configured to radiate laser light to an inside of the processing target object to form multiple internal modification layers; and a controller. The controller controls an operation of forming the internal modification layers such that the internal modification layers are formed in a spiral shape from a diametrically outer side of the processing target object toward a diametrically inner side thereof, and such that an eccentric amount between the holder and the processing target object held by the holder in the forming of the internal modification layers toward the diametrically inner side of the processing target object becomes smaller than the eccentric amount in forming the internal modification layers toward the diametrically outer side of the processing target object.

A metal foil welding method includes: a first step of stacking a plurality of metal foils; and a second step of welding the plurality of stacked metal foils by irradiating the plurality of metal foils with laser light having a wavelength of 400 nm or more and 500 nm or less.

The present invention relates to a method for manufacturing a secondary battery and an apparatus for manufacturing a secondary battery. The method for manufacturing the secondary battery according to the present invention comprises: an electrode supply process of supplying an electrode through an electrode supply part; a first inspection process of detecting the supplied electrode to distinguish a normal electrode portion and an abnormal electrode portion through the first inspection part; and a notching process of notching the electrode, which is subjected to the first inspection process, in the notching part, wherein the notching process perform the notching through a laser so that the normal electrode portion and the abnormal electrode portion, which are detected in the first inspection process, are divided from each other.

Boldface printing having a sufficient line width is more easily implemented as compared with the related art. A laser marking apparatus includes a laser light output section, a laser light scanning section, a storage section, and a marking control section. The marking control section scans UV laser light along an outer scanning line farther from a center line of a line element of a character corresponding to print data for boldface than an inner scanning line prior to the inner scanning line closer to the center line for scanning lines adjacent to each other in a direction in which the line element of the character becomes thick among a plurality of the scanning lines forming the print data for boldface.

A processing system is a processing system that is configured to process an object by irradiating the object with an energy beam, and includes: a placing apparatus on which the object is placed; an irradiation apparatus that is configured to irradiate the object with the energy beam; and a light reception apparatus that includes: a beam passing member having an attenuation area in which the energy beam is attenuated and a plurality of passing areas through each of which the energy beam is allowed to pass; and a light reception part that is configured to optically receive the energy beam that has passed through the plurality of passing areas.