A method for producing workpiece parts from a plate-shaped workpiece in a processing machine or laser processing machine includes positioning and holding the workpiece on a workpiece support by clamping devices. A plurality of workpiece parts are cut out of the workpiece with a process beam. The process beam is moved relative to the workpiece support by a processing head and/or the workpiece is moved relative to the workpiece support by the clamping devices. A cutting process for processing the workpiece to produce the workpiece parts is interrupted at least once by a relaxation step for the workpiece. During the relaxation step at least one clamping device is released to relax the workpiece. The at least one clamping device is closed following the relaxation and before continuing the cutting process. A data processing program and a processing machine for producing the workpiece parts are also provided.

A method for separating a thin glass, in which method the thin glass is progressively heated along a path which forms a parting line, wherein the heating of the glass is realized by way of the energy of at least one energy source within an area of action of the energy source on the thin glass, and, by way of a temperature gradient of the glass heated by way of the at least one energy source in relation to the surrounding glass, a mechanical stress is generated in the glass, by way of which mechanical stress, a crack propagates, following the mechanical stress, along the parting line.

The laser processing apparatus according to this disclosure includes a laser oscillator to generate laser light, a processing table to place a workpiece thereon, the workpiece having a protective sheet on a surface thereof, the protective sheet including a laser light absorbing layer, a laser head to process the workpiece with the laser light, and a control unit to adjust a position of the laser head so that a focal position of the laser light is brought to a position away from the surface of the workpiece toward the laser head, and to control power of the laser light so that marking is provided by causing the laser light absorbing layer to absorb the laser light and thus transforming the inside of the protective sheet.

An apparatus and a method for producing strip wound tube products are disclosed. The apparatus includes a winding machine for winding a strip to a strip wound tube and a finishing machine for cutting off pieces of desired length from the strip wound tube and for connecting strip layers in the end sections of the strip wound tube product by way of an joining operation, the finishing machine having a mobile operating head and/or a force decoupling unit.

A welding or cladding apparatus in which one or more energy beam emitters are used to generate a wide beam spot transverse to a welding or cladding path, and one or more wide feeders feed wire to the spot to create a wide welding or cladding puddle.

A protective film applying apparatus includes a protective film forming and cleaning unit for forming a protective film on a surface of a wafer and cleaning the protective film away. A coverage state detector detects a coverage state of the protective film, and a controller determines whether or not the protective film has a film thickness falling within a predetermined range. If the controller decides that the thickness of the protective film does not fall in the predetermined range, the controller operates the protective film forming and cleaning unit to clean away the protective film, performs a pretreating process selected depending on the film thickness on the surface, and operates the protective film forming and cleaning unit to form a protective film again on the surface of the wafer.

In a laser irradiation apparatus 1 according to one embodiment, each of first and second flotation units 30a, 30b includes a base 31, and a porous plate 32 bonded to an upper surface of the base 31 by an adhesive layer 34, the base 31 includes a rising portion 312 protruding upward at an outer periphery facing at least the gap, and the porous plate 32 includes a cutout portion 321 configured to fit to the rising portion 312, and the adhesive layer 34 is formed along an inner wall of the rising portion 312 having fitted to the cutout portion 321.

Features relating to a laser etching and/or tag writing machine are provided. The machine may include a tray assembly including a tray and a nest. The tray may hold an array of vaporizer cartridges. The tray may allow for a laser-etching operation to be performed by the machine on at least one or two sides of the vaporizer cartridges held by the tray. The tray may allow for the array of vaporizer cartridges to be rotated at the same time between laser etching operations. The tray may additionally and/or alternatively allow for the machine, such as via an antenna, to write data to an NFC tag of a corresponding vaporizer cartridge before, during, and/or after each laser etching operation.

A wafer has a device area on one side with a plurality of devices partitioned by a plurality of division lines. Either side of the wafer is attached to an adhesive tape supported by a first annular frame. A modified region is formed in the wafer along the division lines by a laser. The wafer is placed on a support member whose outer diameter is smaller than an inner diameter of the first annular frame. After applying the laser beam, the adhesive tape is expanded thereby dividing the wafer along the division lines. A second annular frame is attached to a portion of the expanded adhesive tape. An inner diameter of the second annular frame is smaller than the outer diameter of the support member and smaller than the inner diameter of the first annular frame.

Vascular treatment and methods include a plurality of self-expanding bulbs and a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Joints between woven structures and hypotubes include solder. Woven structures include patterns of radiopaque filaments measureable under x-ray. Structures are heat treated to include at least shapes at different temperatures. A catheter includes a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Heat treating systems include a detachable flange. Laser cutting systems include a fluid flow system.