A method for cutting a transparent brittle material using pulsed laser-radiation is disclosed. A beam of pulsed laser-radiation having an optical-axis is focused in the material by a variable-focus lens or mirror. The focus is translated along the optical-axis while the material is moved with respect to the beam to create an array of defects along a cutting path.

The present invention relates to a laser material processing system for processing a workpiece by means of a laser beam, comprising an optical system having at least one optical component for focusing the laser beam to form a focal point on the workpiece or in a defined position relative to the workpiece, at least one inertial sensor for detecting a transitional and/or rotational acceleration of the at least one optical component of the optical system and/or the workpiece, and a processing unit connected to the at least one inertial sensor for determining a relative transitional and/or rotational acceleration between the focal point and the workpiece.

A movable table system comprising two identical tables on a common rail arrangement having a linear rail region underneath a detection unit and a processing unit, and therefore the tables can be alternatingly moved in a straight line along the common rail arrangement, in the same table-movement direction, fully underneath the detection unit and processing unit, and can be independently controlled by a computer unit. The movable table system provides a new option for processing planar workpieces, in which a particularly high throughput rate and improved precision can be achieved using merely one processing unit.

An additive manufacturing system including a two-dimensional energy patterning system for imaging a powder bed is disclosed. Improved structure formation, part creation and manipulation, use of multiple additive manufacturing systems, and high throughput manufacturing methods suitable for automated or semi-automated factories are also disclosed.

A laser processing apparatus includes a light source configured to generate a laser beam, and a light converging optical system configured to converge laser beam to a focal point at an object to be processed, the light converging optical system including a through-hole optical element and a composite optical element under the through-hole optical element, wherein the through-hole optical element includes a first recess portion configured as a concave mirror at a lower surface of the through-hole optical element, and wherein an upper surface of the composite optical element is convex and includes a first region configured to reflect the laser beam and a second region configured to transmit the laser beam.

A capacitor and methods of processing an anode metal foil are presented. The capacitor includes a housing, one or more anodes disposed within the housing, one or more cathodes disposed within the housing, one or more separators disposed between an adjacent anode and cathode, and an electrolyte disposed around the one or more anodes, one or more cathodes, and one or more separators within the housing. The one or more anodes each include a metal foil that includes a first plurality of tunnels through a thickness of the metal foil in a first ordered arrangement, the first ordered arrangement being a close packed hexagonal array arrangement, and having a first diameter, and a second plurality of tunnels through the thickness of the metal foil having a second ordered arrangement and a second diameter greater than the first diameter.

The invention relates to a method for the additive manufacture of at least one region (16) of a component. Here, at least the following steps are carried out: a) layer-wise application of at least one powder-form component material onto a component platform in the region of a build-up and joining zone (14); b) layer-wise and local solidifying of the component material by selective exposure of the component material by at least one high-energy beam (12) in the region of the build-up and joining zone (14), with the formation of a component layer (15); c) layer-wise lowering of the component platform by a pre-defined layer thickness; and d) repeating steps a) to c) until the component region (16) or the component has been completely fabricated.

A method of processing a wafer having a plurality of intersecting streets on a face side thereof with protrusions on the streets includes a holding step of holding a protective sheet of a wafer unit on a holding table, an upper surface heightwise position detecting step of detecting a heightwise position of an upper surface of a reverse side of the wafer along the streets, and a laser beam applying step of applying a laser beam having a wavelength transmittable through the wafer to the wafer from the reverse side thereof along the streets while positioning a focused point of the laser beam within the wafer on the basis of the heightwise position, to thereby form modified layers in the wafer along the streets.

A method and apparatus for direct writing of single crystal super alloys and metals. The method including heating a substrate to a predetermined temperature below its melting point; using a laser to form a melt pool on a surface of the substrate, wherein the substrate is positioned on a base plate, and wherein the laser and the base plate are movable relative to each other, the laser being used for direct metal deposition; introducing a superalloy powder to the melt pool; and controlling the temperature of the melt pool to maintain a predetermined thermal gradient on a solid and liquid interface of the melt pool so as to form a single crystal deposit on the substrate. The apparatus configured to generally achieve the aforementioned method.

Provided is a laser processing method including overlapping a plurality of plate-shaped members that include a first plate-shaped member disposed on one end side of an overlapping direction and a second plate-shaped member disposed on the other end side of the overlapping direction; branching a laser beam into a first branched laser beam and a second branched laser beam; irradiating the first plate-shaped member with the first branched laser beam and the second branched laser beam in a state where the first branched laser beam and the second branched laser beam are emitted in parallel; forming line-shaped melting portions on the first plate-shaped member by moving the branched laser beams in a direction intersecting a direction in which the branched laser beams are aligned; and joining overlapped plate-shaped members in a state where the melting portion formed by using the first branched laser beam and the melting portion formed by using the second branched laser beam are connected to each other in the second plate-shaped member and the melting portions do not penetrate the second plate-shaped member.