A remanufacturing method for a metal part having a damage. The damage groove is divided into a number of levels, and the groove bottom is treated by absorption layer-free laser shock peening to remove surface impurities and to refine surface-layer crystal grains. Then a cladding layer is formed by laser cladding. The process is repeated until the groove is completely filled by the cladding layer to higher than the surface of the metal part and the cladding layer higher than the surface is cut by a mechanical processing and polished, and the upper surface of the laser cladding layer is subjected to large-area overlapped laser shock peening.

The thermal processing device includes a stage, a continuous wave electromagnetic radiation source, a series of lenses, a translation mechanism, a detection module, a three-dimensional auto-focus, and a computer system. The stage is configured to receive a substrate thereon. The continuous wave electromagnetic radiation source is disposed adjacent the stage, and is configured to emit continuous wave electromagnetic radiation along a path towards the substrate. The series of lenses is disposed between the continuous wave electromagnetic radiation source and the stage, and are configured to condense the continuous wave electromagnetic radiation into a line of continuous wave electromagnetic radiation on a surface of the substrate. The translation mechanism is configured to translate the stage and the line of continuous wave electromagnetic radiation relative to one another. The detection module is positioned within the path, and is configured to detect continuous wave electromagnetic radiation.

A device (I) for moving a treatment head (JO) and a tray (20) in relation to a plane P., The tray (20) of any shape is inscribed within a rectangle of width A and length 0.8., and includes a first driver (21) suitable for cooperating with a first actuator (22) so as to move the tray (20) in translation within a plane that is parallel to said plane .P. in a movement zone (30) formed from at least two perpendicular edges associated with a reference frame, Q, y, in a direction that is normally parallel to one of said axes or y, the device. (I) The device includes at least: a mobile arm (11) of length R pivotably mounted on one of its ends about an axis £ that is perpendicular to said plane .P., set in motion by a second actuator.

A welding method for joining workpieces (10) made of hot-crack-sensitive materials at a lap joint by means of a remote laser welding device. A stitched weld seam (11) with the equivalent strength of a continuous weld seam (11) is produced from a plurality of weld seam sections (13). The power input of the laser beam (21) changes periodically between a minimum and a maximum value while the laser spot (22) describes an anharmonically oscillating pendulum motion on the workpiece surface plane (18). The welding and the formation of the weld seam sections (13) take place in the phases of the power input with the maximum value. The anharmonically oscillating pendulum motion takes place with an oscillation frequency of 2 to 25 Hz and an amplitude in the range of 1 to 20 mm. The method is intended for welding of hot-crack-sensitive aluminum materials, e.g. for production of automobile bodies.

A fully automated plasma sheet metal cutter that can be integrated into a HVAC coil-line and which increases the precision of cutting, decreases the time it takes to cut a particular component sheet metal part, and offers flexibility in cutting different sized and shaped holes or openings. Further, since the system is fully automated, it eliminates the error or cost attributed to a portion of the cutting process that heretofore has been associated with a manual laborer.

The present invention describes an apparatus for a first laser scribing (P1) on the front electrode of a thin film solar cell panel and a similar apparatus for subsequent laser scribing (P2,P3) on the semiconductor layer and semiconductor layer/rear electrode. Before starting scribing process (P1), the left hand edge or reference line on the left hand edge on a workpiece is aligned substantively parallel to the linear drive before translating the workpiece on the apparatus. Similarly, the first and second scribed lines (Lp1,Lp2) formed during the P1 and P2 processes are separately aligned parallel to the linear drive before starting the relevant process (P2,P3). Alternatively, parallelism of the workpiece is carried out for each batch of the workpiece. In both apparatuses, the laser sources are mounted on independently motorised axes.

This laser irradiation mechanism includes a control unit which has a function allowing the focal point of a laser beam to describe a circle, performs control such that the focal point describes a spiral, and performs control such that the central axis of the spiral moves along a curved surface.

Welding-apparatus configured to weld base-material through wire-material melted by welding-laser, includes: laser-applicator configured to apply welding-laser to welding-area; wire-feeder configured to feed wire-material to welding-area; detector provided on wire-feeder and configured to detect feed-amount of wire-material or reaction-force from wire-material; moving-unit configured to move welding-area or wire-material; controller configured to respectively control laser-applicator, wire-feeder, and moving-unit. Controller is configured to perform: controlling wire-feeder to stop feeding wire-material to welding-area; then controlling laser-applicator to stop applying welding-laser to welding-area; then controlling moving-unit so that welding-area and wire-material are separated from each other; determining whether wire-material has been welded to base-material based on feed-amount of wire-material or reaction-force from wire-material detected by detector; and controlling laser-applicator to apply cutting-laser when it is determined that wire-material has been welded to base-material.

A laser processing device configured to generally vertically irradiate a laser beam to a workpiece, and having a function for reducing an adverse effect due to a reflected laser beam from the workpiece. The laser processing device includes: a light condensing point moving part configured to move a focal point in an optical axis direction while irradiating the laser beam, by moving at least one of a processing head, an optical component of a light condense optical system, and a workpiece; and a light condensing point distance setting part configured to set a light condensing point distance between the light condensing point and a workpiece surface when the laser beam is started to be irradiated, wherein the light condensing point distance is set so that an amount of the reflected laser beam returned to the processing head through the optical system is not more than an allowable value.

A linear groove formation method including forming a coated resist on a surface of a steel sheet, irradiating two or more laser beams onto the surface of the steel sheet while scanning the laser beams in a direction intersecting the rolling direction of the steel sheet cyclically in a rolling direction of the steel sheet, and forming linear grooves by etching portions of the steel sheet. In the laser irradiating process, the coated resist is removed continuously in a sheet transverse direction of the steel sheet by using the laser beams irradiated from respective ones of two or more laser irradiation devices arranged in the sheet transverse direction, and the laser beams are irradiated by shifting centers of two of the laser beams irradiated from two of the laser two of the laser irradiation devices adjacent to each other in the sheet transverse direction.