Patent classifications
B23K26/10
Laser processing method and laser processing device
Provided are a laser processing method and a laser processing device which prevent a laser irradiation unit from colliding with an edge of a plate material when the laser irradiation unit returns to a portion just above the plate material from an outer part of the portion just above the plate material. The laser processing method for cutting a plate material by laser irradiation, the method including: a plate material end portion holding process of holding a position of an end portion of the plate material at a predetermined position when a laser irradiation unit is present outside a portion just above the plate material; and a laser irradiation unit moving process in which the laser irradiation unit moves from an outer part of the portion just above the plate material to the portion just above the plate material.
Laser processing method and laser processing device
Provided are a laser processing method and a laser processing device which prevent a laser irradiation unit from colliding with an edge of a plate material when the laser irradiation unit returns to a portion just above the plate material from an outer part of the portion just above the plate material. The laser processing method for cutting a plate material by laser irradiation, the method including: a plate material end portion holding process of holding a position of an end portion of the plate material at a predetermined position when a laser irradiation unit is present outside a portion just above the plate material; and a laser irradiation unit moving process in which the laser irradiation unit moves from an outer part of the portion just above the plate material to the portion just above the plate material.
Axis calibration of beam processing machines
In a method for determining a deviation of a spatial orientation of a beam axis (S) of a beam processing machine from a spatial nominal orientation (S0) of the beam axis (S), contour sections (KA1, KB2) are cut with a processing beam into a test workpiece from two sides of the workpiece. The contour sections (KA1, KB2) extend parallel to a nominal orientation of a rotation axis (B, C), where the rotation axis is to be calibrated. The contour sections (KA1, KA2) are probed from one side of the test workpiece by a measuring device for determining the spatial position of the contour sections (KA1, KB1). Deviation of the spatial orientation of the beam axis (S) of the beam processing machine from the spatial nominal orientation (S0) is determined based on the spatial positions of the contour sections (KA1, KB1).
Axis calibration of beam processing machines
In a method for determining a deviation of a spatial orientation of a beam axis (S) of a beam processing machine from a spatial nominal orientation (S0) of the beam axis (S), contour sections (KA1, KB2) are cut with a processing beam into a test workpiece from two sides of the workpiece. The contour sections (KA1, KB2) extend parallel to a nominal orientation of a rotation axis (B, C), where the rotation axis is to be calibrated. The contour sections (KA1, KA2) are probed from one side of the test workpiece by a measuring device for determining the spatial position of the contour sections (KA1, KB1). Deviation of the spatial orientation of the beam axis (S) of the beam processing machine from the spatial nominal orientation (S0) is determined based on the spatial positions of the contour sections (KA1, KB1).
LASER PLOTTER
The invention relates to a laser plotter (2) for processing a job for cutting, engraving, marking and/or lettering a preferably flat workpiece (7), which plotter has at least one housing (3) with a preferably closable processing chamber (8) for positioning a workpiece (7) on a processing table (9), at least one irradiation source in the form of a laser (5,6), and a controller (13) for controlling the carriage (14), which is operated by means of preferably a belt drive, with a focusing unit (12) arranged movably thereon, which is designed to deflect a laser beam (10) in the direction of the workpiece (7), wherein an extraction device (1) for extracting the exhaust gases (25) produced during the laser process by generating an air flow (26) is arranged in the processing chamber (8) below the processing table (9), in particular beneath a support surface (27) of the processing table (9). The processing table (9) is designed in such a way that the support surface (27) of the processing table (9) is designed to extend over the entire surface and is in particular airtight, and that, in order to form an air stream (26), an extraction channel (27) is arranged below the support surface (27), preferably parallel to the support surface (27), which extraction channel ends in an exhaust opening (29), wherein the extraction channel (27) is connected via at least one extraction opening (28,29) to the processing chamber (8) for extracting the exhaust gases or vapors, respectively (25), produced during the laser process.
Laser welding system
A shift in position of a laser beam used for welding objects is corrected without need for intervention by a welder. An irradiator performs welding along a welding part of objects to be welded by relatively moving objects to be welded and a nozzle for emitting a laser beam. An arm apparatus movably holds the nozzle while applying a biasing force to the nozzle in a direction toward the welding part such that the nozzle comes into contact with objects to be welded to irradiate the welding part with the laser beam.
Laser welding system
A shift in position of a laser beam used for welding objects is corrected without need for intervention by a welder. An irradiator performs welding along a welding part of objects to be welded by relatively moving objects to be welded and a nozzle for emitting a laser beam. An arm apparatus movably holds the nozzle while applying a biasing force to the nozzle in a direction toward the welding part such that the nozzle comes into contact with objects to be welded to irradiate the welding part with the laser beam.
Laser irradiation apparatus, laser irradiation method, and method of manufacturing semiconductor device
A laser irradiation apparatus (1) according to one embodiment irradiates a workpiece (16) with a laser beam (15) while conveying the workpiece (16) caused to float with the use of a flotation unit (10). The flotation unit (10) includes precision float regions (11a, 11b) and rough float regions (13a to 13j). The precision float regions (11a, 11b) are configured to cause the workpiece (16) to float by utilizing ejection and suction of a gas, and the rough float regions are configured to cause the workpiece (16) to float by utilizing ejection of a gas without suction of a gas.
Laser irradiation apparatus, laser irradiation method, and method of manufacturing semiconductor device
A laser irradiation apparatus (1) according to one embodiment irradiates a workpiece (16) with a laser beam (15) while conveying the workpiece (16) caused to float with the use of a flotation unit (10). The flotation unit (10) includes precision float regions (11a, 11b) and rough float regions (13a to 13j). The precision float regions (11a, 11b) are configured to cause the workpiece (16) to float by utilizing ejection and suction of a gas, and the rough float regions are configured to cause the workpiece (16) to float by utilizing ejection of a gas without suction of a gas.
Method of producing clad layer and device for producing the same
A first metal powder is supplied to a substrate to form a beginning part of a clad layer. After the beginning part is formed, the second metal powder is supplied to the substrate. A concentration of at least one of Si, Ni, Mo, and Al in the first metal powder is lower than a concentration thereof in the second metal powder.