Systems comprising a light source, thin membrane immersed in an aqueous solution and a system to direct and focus light from the light source to a spot on the membrane are provided. Methods of thinning and etching a membrane are also provided, as are membranes comprising a nanopore with a Gaussian curve shaped cross-section.

A pulsed laser apparatus for milling a sample is described. The apparatus includes a pulsed laser, a scan head for scanning a beam from the pulsed laser across the sample and an F-theta lens for focusing the scanned beam onto the sample. The apparatus may also include a liquid bath for milling the sample under the liquid, such as water. Methods of pulsed laser milling are also described.

A pulsed laser apparatus for milling a sample is described. The apparatus includes a pulsed laser, a scan head for scanning a beam from the pulsed laser across the sample and an F-theta lens for focusing the scanned beam onto the sample. The apparatus may also include a liquid bath for milling the sample under the liquid, such as water. Methods of pulsed laser milling are also described.

A pulsed laser apparatus for milling a sample is described. The apparatus includes a pulsed laser, a scan head for scanning a beam from the pulsed laser across the sample an F-theta lens for focusing the scanned beam onto the sample and a confocal detector for detection of ablation depth. Methods of pulsed laser milling are also described.

A pulsed laser apparatus for milling a sample is described. The apparatus includes a pulsed laser, a scan head for scanning a beam from the pulsed laser across the sample an F-theta lens for focusing the scanned beam onto the sample and a confocal detector for detection of ablation depth. Methods of pulsed laser milling are also described.

Methods and systems are provided for breaching a ceramic disk installed in a wellbore during oil and gas well completion and production activities. More specifically, the disclosure relates to breaching a ceramic disk with a high-powered laser. The laser source is lowered into a wellbore, where a laser beam is used to heat the ceramic disk until the ceramic disk breaks or experiences structural failure. Logging information can be gathered by using the laser along with a receiver.

Methods and systems are provided for breaching a ceramic disk installed in a wellbore during oil and gas well completion and production activities. More specifically, the disclosure relates to breaching a ceramic disk with a high-powered laser. The laser source is lowered into a wellbore, where a laser beam is used to heat the ceramic disk until the ceramic disk breaks or experiences structural failure. Logging information can be gathered by using the laser along with a receiver.

Provided is a method of forming an apatite coating, the method including immersing a substrate in an apatite-forming precursor solution including Ca.sup.2+ ions and PO.sub.4.sup.3− ions, emitting a laser beam onto a surface of the substrate immersed in the precursor solution, and forming an apatite coating in a region exposed to the laser beam, wherein an output power of the laser beam is set within a range enabling the surface of the substrate to be melted.

Provided is a method of forming an apatite coating, the method including immersing a substrate in an apatite-forming precursor solution including Ca.sup.2+ ions and PO.sub.4.sup.3− ions, emitting a laser beam onto a surface of the substrate immersed in the precursor solution, and forming an apatite coating in a region exposed to the laser beam, wherein an output power of the laser beam is set within a range enabling the surface of the substrate to be melted.

A laser processing apparatus includes a laser beam applying unit having a focusing unit applying a laser beam to a workpiece held on a chuck table, a feeding mechanism relatively moving the chuck table and the laser beam applying unit, and a chamber having a top wall connected to the focusing unit and a side wall connected to the top wall to define an enclosed space, the top wall having a transparent plate located directly below the focusing unit and allowing the pass of the laser beam applied from the focusing unit. The laser processing apparatus further includes a liquid supplying unit supplying a liquid into the enclosed space to make a condition that the enclosed space is filled with the liquid under a predetermined pressure.