B23K26/1224

Apparatus and method for directional etch with micron zone beam and angle control

A semiconductor fabrication apparatus includes a source chamber being operable to generate charged particles; and a processing chamber integrated with the source chamber and configured to receive the charged particles from the source chamber. The processing chamber includes a wafer stage being operable to secure and move a wafer, and a laser-charged particles interaction module that further includes a laser source to generate a first laser beam; a beam splitter configured to split the first laser beam into a second laser beam and a third laser beam; and a mirror configured to reflect the third laser beam such that the third laser beam is redirected to intersect with the second laser beam to form a laser interference pattern at a path of the charged particles, and wherein the laser interference pattern modulates the charged particles by in a micron-zone mode for processing the wafer using the modulated charged particles.

Chamber systems for additive manufacturing

An apparatus and a method for powder bed fusion additive manufacturing involve a multiple-chamber design achieving a high efficiency and throughput. The multiple-chamber design features concurrent printing of one or more print jobs inside one or more build chambers, side removals of printed objects from build chambers allowing quick exchanges of powdered materials, and capabilities of elevated process temperature controls of build chambers and post processing heat treatments of printed objects. The multiple-chamber design also includes a height-adjustable optical assembly in combination with a fixed build platform method suitable for large and heavy printed objects. A side removal mechanism of the build chambers of the apparatus improves handling and efficiency for printing large and heavy objects. Use of a wide range of sensors in the apparatus and by the method allows various feedback to improve quality, manufacturing throughput, and energy efficiency.

High hardness 3D printed steel product
11725264 · 2023-08-15 · ·

The present invention relates to a 3D-printed iron based alloy product comprising carbon, tungsten, vanadium, cobalt, chromium and molybdenum with very high hardness and very good high temperature properties thermal properties as well as a method of preparing the 3D-printed product and a powder alloy.

Additive manufacturing of MLD-enhanced drilling tools

Methods, systems, and apparatus for carrying out rapid on-site optical chemical analysis in oil feeds are described. In one aspect, a system for manufacture of a tool includes a deposition reactor configured for molecular layer deposition or atomic layer deposition of metal powder to manufacture coated particles, a fabrication unit configured for 3D printing of the tool, and a controller that controls the deposition reactor and the fabrication unit, wherein the fabrication unit and the deposition reactor are integrated for automated fabrication of the tool using the coated particles from the deposition reactor as building material for the 3D printing.

TITANIUM ALLOY ADDITIVE MANUFACTURING PRODUCT AND METHOD OF MANUFACTURING THE SAME

A titanium alloy additive manufacturing product contains 5.50 to 6.75 wt % of Al, 3.50 to 4.50 wt % of V, 0.20 wt % or less of 0, 0.40 wt % or less of Fe, 0.015 wt % or less of H, 0.08 wt % or less of C, 0.05 wt % or less of N, and inevitable impurities, in which a pore content is 0.05 number/mm.sup.2 or less, and a tensile strength is 855 MPa or more.

Method for Removing Electronic Components Connected to a Circuit Board
20220126398 · 2022-04-28 ·

A device for removing a defective electronic component from a circuit board includes a vacuum suction nozzle, a laser beam emitter and an infrared temperature sensor. The vacuum suction nozzle has a suction opening at which suction is generated. The suction opening is dimensioned to be larger than the defective electronic component. The laser beam emitter is oriented so as to emit a laser beam out the suction opening towards the electronic component on the circuit board. The temperature sensor measures the temperature of the electronic component based on infrared radiation emitted from around the electronic component. A method for removing the defective electronic component from the circuit board includes positioning the suction opening over the electronic component and directing the laser beam through the suction opening and onto the electronic component so as to heat and detach the electronic component, which is then sucked into the vacuum suction nozzle.

LASER WELDING DEVICE

This laser welding device includes a tubular portion. The tubular portion includes a first tubular portion and a second tubular portion. The second tubular portion has a constant cross-sectional shape orthogonal to an irradiation direction along the irradiation direction E. The tubular portion has a predetermined length that is longer than a length of a chamber in the irradiation direction.

Method for Producing a Functional Structure and Component
20210362275 · 2021-11-25 ·

A method includes producing a functional structure on an aluminum surface with a local laser treatment of an aluminum surface. The local laser treatment is carried out with a pulsed laser system having a pulse duration of from 10 ns to 100 ns. The average power of the pulsed laser system is less than 5 kW.

Laser Ablation and Laser Processing Fume and Contaminant Capture System
20210362270 · 2021-11-25 ·

Laser ablation and laser processing fume and contaminant capture systems are disclosed herein. An example system includes a housing forming a partial enclosure that is configured to be placed against a target surface, a transparent window being integrated into a top surface of the housing, the transparent window being configured to allow for the transmission of a laser scan pattern to the target surface, and an outlet port for establishing a negative pressure inside the housing. Air is drawn into the housing through a first inlet port, the air carries contaminants created during ablation of the target surface by the laser scan pattern out of the outlet port.

Additive Manufacturing System And Method

An additive manufacturing system including a two-dimensional energy patterning system for imaging a powder bed is disclosed. Improved structure formation, part creation and manipulation, use of multiple additive manufacturing systems, and high throughput manufacturing methods suitable for automated or semi-automated factories are also disclosed.