Patent classifications
B23K26/1224
LASER PROCESSING APPARATUS
A laser processing apparatus includes a stage configured to transfer a target substrate and including an opening, an electrostatic chuck disposed on the stage and including a plurality of holes, and a laser irradiation unit disposed above the stage and spaced apart from the stage and configured to irradiate a laser beam on the target substrate. A surface of the electrostatic. chuck is in contact with the target substrate, the target substrate includes a plurality of etching regions to be etched by the laser beam and a non-etching region surrounding the plurality of etching regions of the target substrate, and the plurality of holes of the electrostatic chuck overlap the opening of the stage and the plurality of etching regions of the target substrate.
Laser processing apparatus, laser processing method, and method for manufacturing semiconductor apparatus
A laser processing apparatus includes a holder configured to hold a workpiece, a head, a first nozzle, and a driver. The head is configured to irradiate a first portion of a main surface of the workpiece with a laser beam. The first nozzle is configured to supply a first liquid to the first portion. The driver is configured to drive the holder in such a manner that the workpiece can revolve around the optical axis of the laser beam at the first portion. Accordingly, the workpiece can be processed, and debris of the workpiece can be prevented from adhering to the main surface of the workpiece.
Multi-functional ingester system for additive manufacturing
A method and an apparatus for collecting powder samples in real-time in powder bed fusion additive manufacturing may involves an ingester system for in-process collection and characterizations of powder samples. The collection may be performed periodically and uses the results of characterizations for adjustments in the powder bed fusion process. The ingester system of the present disclosure is capable of packaging powder samples collected in real-time into storage containers serving a multitude purposes of audit, process adjustments or actions.
Additive manufacturing system and method
An additive manufacturing system including a two-dimensional energy patterning system for imaging a powder bed is disclosed. Improved chamber designs, multiple chambers, powder handling and re-use systems, and powder characterization methods are disclosed.
Suction device, laser processing machine, and method for suctioning
The present disclosure relates to a suction device configured for a laser processing machine with a laser processing head which can be moved over a workpiece holder, with a fan and several flaps which are to be opened selectively to generate an air flow and which are in communication with the fan, and with a control configured to detect the position and operating state of the laser processing head and to control the flaps as a function of the detected position and the operating state of the laser processing head.
HIGH POWER LASER OFFSHORE DECOMMISSIONING TOOL, SYSTEM AND METHODS OF USE
There is provided high power laser systems, high power laser tools, and methods of using these tools and systems for cutting, sectioning and removing structures objects, and materials, and in particular, for doing so in difficult to access locations and environments, such as offshore, underwater, or in hazardous environments, such as nuclear and chemical facilities. Thus, there is also provided high power laser systems, high power laser tools, and methods of using these systems and tools for removing structures, objects, and materials located offshore, under bodies of water and under the seafloor.
LIFT printing of conductive traces onto a semiconductor substrate
A method for metallization includes providing a transparent donor substrate (34) having deposited thereon a donor film (36) including a metal with a thickness less than 2 μm. The donor substrate is positioned in proximity to an acceptor substrate (22) including a semiconductor material with the donor film facing toward the acceptor substrate and with a gap of at least 0.1 mm between the donor film and the acceptor substrate. A train of laser pulses, having a pulse duration less than 2 ns, is directed to impinge on the donor substrate so as to cause droplets (44) of the metal to be ejected from the donor layer and land on the acceptor substrate, thereby forming a circuit trace (25) in ohmic contact with the semiconductor material.
Method of repairing superalloy components using phase agglomeration
A method of repairing a superalloy component includes subjecting the superalloy component, including a repair area, to a phase agglomeration cycle, which includes stepped heating and controlled cooling of the component. The method further includes applying weld material to the repair area to create a weld surface; and covering the weld surface with brazing material. The component is then subjected to a braze cycle to produce a brazed component. The brazed component is cleaned, and the cleaned component is subjected to a restorative heat treatment to restore the microcrystalline structure and mechanical properties of the component.
METHODS AND SYSTEMS FOR FORMING VACUUM INSULATED CONTAINERS
Methods and systems for forming vacuum insulated containers, such as beverage and food containers, are described. The methods and systems include using a laser to close openings in walls of the container while the container is held at vacuum conditions. The closing of the opening forms the vacuum space within the walls of the container.
Variable Print Chamber Walls For Powder Bed Fusion Additive Manufacturing
Additive manufacturing can involve dispensing a powdered material to form a layer of a powder bed on a support surface of a build platform. A portion of the layer of the powder bed may be selectively melted or fused to form one or more temporary walls out of the fused portion of the layer of the powder bed to contain another portion of the layer of the powder bed on the build platform