A method and an apparatus for collecting powder samples in real-time in powder bed fusion additive manufacturing may involves an ingester system for in-process collection and characterizations of powder samples. The collection may be performed periodically and uses the results of characterizations for adjustments in the powder bed fusion process. The ingester system of the present disclosure is capable of packaging powder samples collected in real-time into storage containers serving a multitude purposes of audit, process adjustments or actions.

A laser processing device and a laser processing method that are capable of forming a high-quality semiconductor film are provided. An ELA device (excimer laser annealing device) (1) includes a laser oscillator (10) that generates laser light for forming a polysilicon film by irradiating an amorphous silicon film over a substrate to be processed with the laser light, a pulse measuring instrument (100) for detecting first partial light and second partial light contained in the laser light, and a monitoring device (60) for comparing a detection result of the first partial light with a detection result of the second partial light.

A computer-numerically-controlled (CNC) machine is configured to (i) measure a power of a beam of electromagnetic energy at a location between a source of the electromagnetic energy and a destination in the CNC machine, the beam of electromagnetic energy traveling from the source to the destination being susceptible to one or more interferences, and the one or more interferences being capable of altering the power of the beam of electromagnetic energy by at least diverting, away from an intended path for the beam of electromagnetic energy, at least a portion of the beam of electromagnetic energy, (ii) detect, based at least on the measured power of the beam of electromagnetic energy being less than a threshold value, an interference of the beam of electromagnetic energy, and (iii) in response to detecting the interference of the beam of electromagnetic energy, perform one or more actions.

The present invention is related to a thermal laser evaporation system (10), the thermal laser evaporation system (10) comprising: a laser light source (30) for providing a thermal laser beam (34) for evaporating one or more materials (22) from a source (20); a thermal laser beam shaping system (40) comprising a collimation lens (42) and a focusing lens (44) for directing the thermal laser beam (34) onto the source (20); a vacuum chamber (12); a vacuum window (14) for conducting the thermal laser beam (34) into the vacuum chamber (12); and an aperture (16) arranged within the vacuum chamber (12) between the vacuum window (14) and the source (20).

Further, the present invention is related to a method of providing a thermal laser beam (34) at a source (20) in order to evaporate one or more materials (22) from the source (20); the method comprising the steps of: providing a thermal laser beam (34); directing the thermal laser beam (34) via a thermal laser beam shaping system (40) comprising a collimation lens (42), a shaping device (60) and a focusing lens (44) into a vacuum chamber (12) comprising a vacuum window (12) for conducting the thermal laser beam (34) into the vacuum chamber (12) and through an aperture (16) arranged within the vacuum chamber (12) at the source (20).

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an electronic component at a first printing unit, and the electronic component is subsequently placed onto a substrate with the portions of viscous material between the electronic component and the substrate. Optionally, a printing unit which prints the dots of material onto the electronic component includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the electronic component by the printing unit. The system may also include imaging units to aid in the overall process.

The present invention relates to pulverulent aluminium alloys having Cu, Zn or Si/Mg as the most relevant alloying element, the alloy further having a content of 1 to 15 wt. % of metals selected from the group M1 comprising Mo, Nb, Zr, Fe, Ti, Ta, V, and lanthanides. Such aluminium alloys can be used in additive manufacturing processes such as selective laser melting for the production of high-strength and hot-crack-free three-dimensional objects. The present invention further relates to methods and devices for producing three-dimensional objects from such aluminium alloys, methods for producing such pulverulent aluminium alloys, three-dimensional objects also produced from such pulverulent aluminium alloys, and specific aluminium alloys.

A laser apparatus includes: a first vacuum chamber, wherein machining is performed on a target substrate in the first vacuum chamber; a laser facing the first vacuum chamber; a carrier disposed in the first vacuum chamber, wherein the target substrate is seated on the carrier; a chamber window disposed in one surface of the first vacuum chamber, wherein a laser beam emitted by the laser passes through the chamber window; a first protection window positioned between the carrier and the chamber window; a second vacuum chamber disposed at a first side of the first vacuum chamber; and a transfer unit configured to transfer the first protection window to the second vacuum chamber.

An additive manufacturing apparatus comprises a processing chamber (100) defining a window (110) for receiving a laser beam and an optical module (10) The optical module is removably-mountable to the processing chamber for delivering the laser beam through the window. The optical module contains optical components for focusing and steering the laser beam and a controlled atmosphere can be maintained within the module.

For allowing a crack to progress between respective lines reliably while shortening a laser beam irradiation time, a method for processing SiC material includes allowing a laser beam to be absorbed in a cutting scheduled plane of an SiC material to form an altered pattern including a plurality of line-shaped altered regions; and cutting the SiC material along the cutting scheduled plane, wherein a plurality of line-shaped main altered regions extending in a predetermined direction, arranged at a first pitch P1 and included in altered region groups is formed, and a plurality of altered region groups is arranged at a second pitch P2 larger than the first pitch P1.

The disclosure relates to processing machines and methods for producing three-dimensional components by irradiating powder with a processing beam, the machines including a container with a moveable support for the powder, as well as an irradiating device with a scanner device for aligning the processing beam on a processing field at an opening of the container. The irradiating device includes a heating device that includes a heating radiation source for generating a heating beam for heating the powder from above and including a beam shaping optical unit configured to convert a first beam profile of the heating beam into a second beam profile, e.g., a ring-shaped beam profile, of the heating beam.