A processing system is a processing system that is configured to process an object by irradiating the object with an energy beam, and includes: a placing apparatus on which the object is placed; an irradiation apparatus that is configured to irradiate the object with the energy beam; and a light reception apparatus that includes: a beam passing member having an attenuation area in which the energy beam is attenuated and a plurality of passing areas through each of which the energy beam is allowed to pass; and a light reception part that is configured to optically receive the energy beam that has passed through the plurality of passing areas.

A laser head apparatus that enables the use of smaller parallel converging laser beams that create multiple smaller holes in a material followed by a larger parallel diverging laser beams that remove additional material. The laser head apparatus includes laser optics and purging nozzles. A process for removing material using the laser head apparatus includes moving the laser head apparatus to a position to generate parallel converging laser beams at a target location in the material and moving the laser head apparatus to a position to generate parallel diverging laser beams at the target location from the converging laser beams.

A laser head apparatus that enables switching between a laser beam and a purging stream. The laser head apparatus includes a bracket that provides for translation and rotation of the laser optics and purging nozzle. The laser optics and purging nozzle are located on opposite sides of the bracket and may be rotated to different rotational positions around a center axis of the bracket and translated to different linear positions along a length of the bracket. Methods of removing material using the laser head apparatus to between a laser beam and a purging stream are also provided.

A tool arrangement is provided for accommodating portions of an optical tool in a park position, having an optical tool and having a housing with an opening suitable for accommodating portions of the optical tool in a housing interior, with a housing discharge connected to the housing in a fluid-conducting manner, and with a sealing sleeve arranged at the opening of the housing, wherein the sealing sleeve has a fluid-carrying line for adapting a variable fill volume of the sealing sleeve. In addition, a method is provided for accommodating portions of an optical tool in a park position.

A tool arrangement is provided for accommodating portions of an optical tool in a park position, having an optical tool and having a housing with an opening suitable for accommodating portions of the optical tool in a housing interior, with a housing discharge connected to the housing in a fluid-conducting manner, and with a sealing sleeve arranged at the opening of the housing, wherein the sealing sleeve has a fluid-carrying line for adapting a variable fill volume of the sealing sleeve. In addition, a method is provided for accommodating portions of an optical tool in a park position.

A process for removing a material that is adhered to an underlying surface includes using a laser beam to heat the material to reduce the strength of adhesion between the material and the underlying surface. A stream of gas is directed at the heated material to displace the heated material from the underlying surface.

A process for removing a material that is adhered to an underlying surface includes using a laser beam to heat the material to reduce the strength of adhesion between the material and the underlying surface. A stream of gas is directed at the heated material to displace the heated material from the underlying surface.

A system and a method for manufacturing a sapphire part. A sapphire substrate is obtained for performing a laser cutting operation. The sapphire substrate is cut along a cut profile using a laser and a first gas medium. The first gas medium is substantially comprised of an inert gas. The sapphire substrate is then irradiated at or near the cut profile using the laser and a second gas medium. The second gas medium is different than the first gas medium comprising oxygen.

A system and a method for manufacturing a sapphire part. A sapphire substrate is obtained for performing a laser cutting operation. The sapphire substrate is cut along a cut profile using a laser and a first gas medium. The first gas medium is substantially comprised of an inert gas. The sapphire substrate is then irradiated at or near the cut profile using the laser and a second gas medium. The second gas medium is different than the first gas medium comprising oxygen.

A fume evacuation system is designed to remove smoke, fumes, and particulate from a metal-working or other application. The system may include a cart-type base unit or may be incorporated into a fixed or semi-fixed installation that uses suction to draw air (e.g., containing smoke, fumes, and particulate) away from the metal-working application. The fume evacuation system includes a hood that creates an arduous flow path and varying velocity profile, which cools and separates any particulate matter in the suctioned air. The arduous flow path may include multiple sharp turns created by an inner deflector component and an inlet tube. The inlet tube may further contain baffles to cool particulates from the suctioned air.