B23K26/146

A METHOD OF FABRICATING PLATES OF SUPER-HARD MATERIAL USING A COLLIMATED CUTTING BEAM

A method of fabricating plates of super-hard material and cutting techniques suitable for such a method. A method of fabricating a plate (14) of super-hard material, the method comprising: • providing a substrate (4) have a lateral dimension of at least 40 mm; • growing a layer of super-hard material on the substrate (4) using a chemical vapour deposition process; and • slicing one or more plates (14) of super-hard material from the substrate using a collimated cutting beam (8), the or each plate of super-hard material (14) having a lateral dimension of at least 40 mm, wherein the collimated cutting beam (8) is collimated with a half angle divergence of no more than 5 degrees.

A METHOD OF FABRICATING PLATES OF SUPER-HARD MATERIAL USING A COLLIMATED CUTTING BEAM

A method of fabricating plates of super-hard material and cutting techniques suitable for such a method. A method of fabricating a plate (14) of super-hard material, the method comprising: • providing a substrate (4) have a lateral dimension of at least 40 mm; • growing a layer of super-hard material on the substrate (4) using a chemical vapour deposition process; and • slicing one or more plates (14) of super-hard material from the substrate using a collimated cutting beam (8), the or each plate of super-hard material (14) having a lateral dimension of at least 40 mm, wherein the collimated cutting beam (8) is collimated with a half angle divergence of no more than 5 degrees.

Method for measuring inclination of waterjet of laser machining device

The purpose of the present invention is to provide a method for measuring the inclination of a waterjet relative to a machine coordinate system of a laser machining device. The present invention provides a method for measuring the inclination of a waterjet of a laser machining device in which a laser beam that has been introduced and guided into a waterjet jetted from an optical head is moved relative to a workpiece fixed to a table so as to machine the workpiece, wherein measured is the inclination of the waterjet relative to the table which is within a stable-length range in which the laser beam passing through the inside of the waterjet can be reflected so as to advance in the axial direction.

Method for measuring inclination of waterjet of laser machining device

The purpose of the present invention is to provide a method for measuring the inclination of a waterjet relative to a machine coordinate system of a laser machining device. The present invention provides a method for measuring the inclination of a waterjet of a laser machining device in which a laser beam that has been introduced and guided into a waterjet jetted from an optical head is moved relative to a workpiece fixed to a table so as to machine the workpiece, wherein measured is the inclination of the waterjet relative to the table which is within a stable-length range in which the laser beam passing through the inside of the waterjet can be reflected so as to advance in the axial direction.

LASER-BASED MODIFICATION OF TRANSPARENT MATERIALS
20170326688 · 2017-11-16 ·

The present disclosure provides examples of a laser-based material processing system for liquid-assisted, ultrashort pulse (USP) laser micromachining An example material processing application includes drilling thru-holes or blind holes in a nearly transparent glass workpiece (substrate) using parallel processing with an n×m array of focused laser beams. Methods and systems are disclosed herein which provide for formation of high aspect ratio holes with low taper in fine pitch arrangements.

LASER-BASED MODIFICATION OF TRANSPARENT MATERIALS
20170326688 · 2017-11-16 ·

The present disclosure provides examples of a laser-based material processing system for liquid-assisted, ultrashort pulse (USP) laser micromachining An example material processing application includes drilling thru-holes or blind holes in a nearly transparent glass workpiece (substrate) using parallel processing with an n×m array of focused laser beams. Methods and systems are disclosed herein which provide for formation of high aspect ratio holes with low taper in fine pitch arrangements.

LASER PEENING PROCESSING DEVICE AND LASER PEENING PROCESSING METHOD
20170282298 · 2017-10-05 ·

According to one implementation, a laser peening processing device includes a laser peening processing device includes a laser oscillator, a nozzle and an inclining structure. The laser oscillator emits laser light. The nozzle condenses and irradiates the laser light toward a surface to be processed of a workpiece, with injecting liquid toward the surface to be processed. The inclining structure inclines at least one of the nozzle and the workpiece to make an injection direction of the liquid be different from a normal direction of the surface to be processed. The air bubbles arising by at least one of collision between the liquid and the surface to be processed and shock by irradiation of the laser light on the surface to be processed are flowed in a direction depending on an inclined direction of the surface to the injection direction of the liquid.

System and method for cutting a passage in an airfoil

A method for cutting passages in an airfoil using a liquid-jet guided laser beam includes positioning a frustoconical tip of the liquid-jet guided laser at a first X, Y and Z location that is defined with respect to the airfoil and at a first standoff distance of greater than 5 mm and less than 20 mm from an outer surface of the airfoil. The method also includes generating a laser beam confined within a fluid column via the liquid jet guided laser, wherein the laser beam is aimed at the outer surface. The method further includes monitoring for breakthrough of the laser beam through an inner surface of an inner cavity of the airfoil, shutting off the laser beam once breakthrough is detected and repositioning the frustoconical tip at a second X, Y and Z location and at a second standoff distance. A system for cutting a passage in an airfoil is also disclosed herein.

System and method for cutting a passage in an airfoil

A method for cutting passages in an airfoil using a liquid-jet guided laser beam includes positioning a frustoconical tip of the liquid-jet guided laser at a first X, Y and Z location that is defined with respect to the airfoil and at a first standoff distance of greater than 5 mm and less than 20 mm from an outer surface of the airfoil. The method also includes generating a laser beam confined within a fluid column via the liquid jet guided laser, wherein the laser beam is aimed at the outer surface. The method further includes monitoring for breakthrough of the laser beam through an inner surface of an inner cavity of the airfoil, shutting off the laser beam once breakthrough is detected and repositioning the frustoconical tip at a second X, Y and Z location and at a second standoff distance. A system for cutting a passage in an airfoil is also disclosed herein.

Device and method for separating a longitudinally-extended cylindrical workpiece

In a device for separating a longitudinally-extended cylindrical workpiece, which has a diameter in the sub-millimeter range, into individual segments, the workpiece is guided in a clamping device. The clamping device includes a first and a second clamping jaw and a feed opening for the workpiece. The feed opening is fitted between the clamping jaws on the side facing the other clamping jaw and a longitudinal groove which defines a direction of advancement of the workpiece for receiving and guiding the workpiece between the clamping jaws. The clamping device has a passage for a laser beam and a cutting gas, which passage defines a working zone, disrupts the longitudinal groove and runs parallel thereto. A cutter head is arranged in the working zone and has an outlet opening for the laser beam and the cutting gas, which outlet opening is aligned with the passage.