A method for encoding a plate-like workpiece comprising: defining an encoding area; applying a magnetic layer to the surface of the workpiece; fusing parts of the magnetic layer to the surface of the workpiece by acting on the workpiece with radiation within the encoding area; cooling the workpiece; removing the non-fused parts of the magnetic layer. The method permits the workpieces to be trackable in a simple manner, irrespective of surface treatments that may possibly be carried out or are to be carried out later.

A processing device for film cooling holes on blade of aviation engine includes a working box. A workpiece clamping mechanism is arranged in the working box for holding the workpiece. A cover body having an internal space communicated with an internal space of the working box is connected to an upper part of the working box. A laser processing mechanism is connected to a top end of the cover body and can produce laser rays to carry out laser processing on the workpiece. The cover body is connected to a liquid supply mechanism and an acid gas filtration mechanism. The liquid supply mechanism can spray an acidic solution to the workpiece in the working box, and the working box can collect the acidic solution. The acid gas filtration mechanism can filter acid steam produced during processing. A working method of the processing device is also provided.

A processing device for film cooling holes on blade of aviation engine includes a working box. A workpiece clamping mechanism is arranged in the working box for holding the workpiece. A cover body having an internal space communicated with an internal space of the working box is connected to an upper part of the working box. A laser processing mechanism is connected to a top end of the cover body and can produce laser rays to carry out laser processing on the workpiece. The cover body is connected to a liquid supply mechanism and an acid gas filtration mechanism. The liquid supply mechanism can spray an acidic solution to the workpiece in the working box, and the working box can collect the acidic solution. The acid gas filtration mechanism can filter acid steam produced during processing. A working method of the processing device is also provided.

According to one implementation, a laser peening processing apparatus includes a laser oscillator, a condensing lens, an optical element, a liquid tank and a beam expander. The laser oscillator oscillates laser light. The condensing lens condenses the laser light on a surface of an object. The optical element changes a travelling direction of the laser light. The liquid tank inputs the laser light into liquid, and emits and ejects the laser light and the liquid from an exit to the surface. The beam expander adjusts a magnifying ratio of a beam diameter of the laser light entering into the condensing lens. By adjusting the magnifying ratio, a beam diameter of the laser light irradiating the surface becomes a diameter required for laser peening processing of the surface. The adjusting the magnifying ratio also prevents the laser light, having an excess beam diameter, from entering into the optical element.

According to one implementation, a laser peening processing apparatus includes a laser oscillator, a condensing lens, an optical element, a liquid tank and a beam expander. The laser oscillator oscillates laser light. The condensing lens condenses the laser light on a surface of an object. The optical element changes a travelling direction of the laser light. The liquid tank inputs the laser light into liquid, and emits and ejects the laser light and the liquid from an exit to the surface. The beam expander adjusts a magnifying ratio of a beam diameter of the laser light entering into the condensing lens. By adjusting the magnifying ratio, a beam diameter of the laser light irradiating the surface becomes a diameter required for laser peening processing of the surface. The adjusting the magnifying ratio also prevents the laser light, having an excess beam diameter, from entering into the optical element.

A laser processing device according an embodiment is a laser processing device that irradiates a processing region of a workpiece with pulsed laser light through a liquid to subject the processing region to a laser peening process or a laser forming process. The laser processing device includes: a laser irradiation unit including a laser oscillator that outputs the pulsed laser light; and an accommodation unit that includes an injection port through which the liquid is injected to the processing region, and accommodates the laser irradiation unit. A pulse width of the pulsed laser light is 200 ps to 2 ns, and the pulsed laser light output from the laser oscillator is emitted to the processing region through a liquid that is injected from the injection port.

A laser processing device according an embodiment is a laser processing device that irradiates a processing region of a workpiece with pulsed laser light through a liquid to subject the processing region to a laser peening process or a laser forming process. The laser processing device includes: a laser irradiation unit including a laser oscillator that outputs the pulsed laser light; and an accommodation unit that includes an injection port through which the liquid is injected to the processing region, and accommodates the laser irradiation unit. A pulse width of the pulsed laser light is 200 ps to 2 ns, and the pulsed laser light output from the laser oscillator is emitted to the processing region through a liquid that is injected from the injection port.

A nozzle for laser machining is provided with a flange portion and formed in an annular shape, and includes a first communication hole communicating between a first end portion and a second end portion on a side opposite to the first end portion, a circumferential groove portion provided between the flange portion and the second end portion, and a plurality of second communication holes communicating between a surface of the flange portion on a first end portion side and a side surface of the circumferential groove portion on the first end portion side. A side surface of the circumferential groove portion on a second end portion side extends so that the plurality of second communication holes are invisible from the second end portion side.

The invention relates to a method 100 and an apparatus 300 for cutting or ablating a particular material of the workpiece with a pulsed laser beam coupled into a fluid jet. The method comprises producing the pulsed laser beam with at least one laser source, providing the pressurized fluid jet onto the workpiece, and coupling the pulsed laser beam into the fluid jet towards the workpiece. The pulsed laser beam comprises at least two superimposed pulsations selected based on the particular material of the workpiece. A first pulsation has a different power and frequency than a second pulsation.

The invention relates to a method 100 and an apparatus 300 for cutting or ablating a particular material of the workpiece with a pulsed laser beam coupled into a fluid jet. The method comprises producing the pulsed laser beam with at least one laser source, providing the pressurized fluid jet onto the workpiece, and coupling the pulsed laser beam into the fluid jet towards the workpiece. The pulsed laser beam comprises at least two superimposed pulsations selected based on the particular material of the workpiece. A first pulsation has a different power and frequency than a second pulsation.