This disclosure relates to weldability of steel alloys that provide weld joints which retain hardness values in a heat affected zone adjacent to a fusion zone and which also have improved resistance to liquid metal embrittlement due to the presence of zinc coatings.

A method of manufacturing a secondary battery according to the disclosure includes an attaching step of attaching a sealing plate to an open end of a case main body including a closed bottom, and a welding step of laser-welding the case main body and the sealing plate together by scanning a laser beam along a peripheral edge portion of the sealing plate. In the welding step, the laser beam applied to the peripheral edge portion of the sealing plate and to an edge of the open end of the case main body may be a pulsed laser beam including a rectangular wave and having a pulse width of from 400 μm to 800 μm and a frequency of from 1.2 kHz to 1.4 kHz, and the laser beam is scanned such that adjacent laser pulses of the pulsed laser beam have an overlap rate of 84.4% to 86.6%.

A method of welding a support on a slide profile, which comprises: a) providing a support having a wall with an inner face, and providing a profile having a wall with an outer face, b) positioning the interface support with the inner face of its wall against the outer face of the wall of the profile, c) creating a welding joint between the wall of the support and the wall of the profile by moving a laser beam relative to the wall of the profile, while keeping the laser beam in a position such that it successively passes through, from an emitting source: the wall of the profile, then the wall of the support, while remaining within the material of the wall of the support.

A fill tool system that fills, seals, and inspects a heat pipe array, which includes one or more heat pipes with heat pipe working fluid.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

A process for room temperature substrate bonding employs a first substrate substantially transparent to a laser wavelength is selected. A second substrate for mating at an interface with the first substrate is then selected. A transmissivity change at the interface is created and the first and second substrates are mated at the interface. The first substrate is then irradiated with a laser of the transparency wavelength substantially focused at the interface and a localized high temperature at the interface from energy supplied by the laser is created. The first and second substrates immediately adjacent the interface are softened with diffusion across the interface to fuse the substrates.

A method for producing a hollow conductor is specified. The hollow conductor has a first hollow-conductor section and a connecting section. The first hollow-conductor section contains a non-weldable aluminium alloy and the connecting section contains a weldable aluminium alloy. The method includes the step of: connecting the first hollow-conductor section to the connecting section by a laser-welding method.

A method for producing a hollow conductor is specified. The hollow conductor has a first hollow-conductor section and a connecting section. The first hollow-conductor section contains a non-weldable aluminium alloy and the connecting section contains a weldable aluminium alloy. The method includes the step of: connecting the first hollow-conductor section to the connecting section by a laser-welding method.

A laser welding method is a method for joining a first member in the shape of a plate and made of a metal material to a second member made of a metal material by laser welding. The laser welding method includes an arranging step and a laser beam irradiation step. In the arranging step, the second member is brought into contact with or brought close to one main surface of the first member. In the laser beam irradiation step, the other main surface of the first member is irradiated with the laser beam, the other surface being a main surface opposite to the one main surface of the first member. In the laser beam irradiation step, the first member and the second member are melted to form a weld portion having a substantially circular or oval shape in a plan view and to form a fillet on a joined portion between the first member and the second member.

A diamond mining core drill bit tool including a cylindrical body with first and second ends and an inner axial opening therethrough, the cylindrical body having a ring groove extending about the second end; the tool further including cutting segments circumferentially spaced about the second end; the tool having a first weld bead between a first portion of the segments and the second end of the cylindrical body; the tool further including at least one weld ring wherein the ring groove is shaped to receive the at least one weld ring such that the at least one weld ring extends about the ring grove; the tool further including at least one second weld bead between a second portion of the segment and the ring groove and a method for the same.