An integrated welding and thermal processing method includes heating adjoining surfaces, at least one of which is a creep strength enhanced ferritic (CSEF) steel alloy, to a sufficiently high temperature above their melting points to form a weld. The weld is allowed cool below the martensitic start temperature of one or both CSEF alloys. Thereafter, a supplemental heat source tempers the CSEF alloys by reheating the weld area at a rate of 10° C. per second or greater to above the CSEF alloys’ martensitic start temperatures, but not above the austenitization temperature of the CSEF alloys. After the weld’s heat affected zone is maintained at a temperature between the CSEF alloys’ martensitic finish temperature and martensitic start temperature, the weld is allowed to cool at a rate of 15° C. per minute or greater.

The present disclosure provides a printer system based on high power, high brightness visible laser source for improved resolution and printing speeds. Visible laser devices based on high power visible laser diodes can be scaled using the stimulated Raman scattering process to create a high power, high brightness visible laser source.

The present disclosure provides a printer system based on high power, high brightness visible laser source for improved resolution and printing speeds. Visible laser devices based on high power visible laser diodes can be scaled using the stimulated Raman scattering process to create a high power, high brightness visible laser source.

Various teachings of the present disclosure include a method for welding an attachment piece to a semiconductor metallization using laser welding. The method may include: arranging an attachment piece having a flat side with a thin point so the flat side faces the semiconductor metallization; and welding the flat side to the semiconductor metallization. The flat side rests against a flat side of the semiconductor metallization over an entire surface area of the flat side. The thin point is formed with a cup shape of the attachment piece. The cup shape is open in the direction away from the semiconductor metallization.

Various teachings of the present disclosure include a method for welding an attachment piece to a semiconductor metallization using laser welding. The method may include: arranging an attachment piece having a flat side with a thin point so the flat side faces the semiconductor metallization; and welding the flat side to the semiconductor metallization. The flat side rests against a flat side of the semiconductor metallization over an entire surface area of the flat side. The thin point is formed with a cup shape of the attachment piece. The cup shape is open in the direction away from the semiconductor metallization.

A method for monitoring and/or controlling in a closed loop a laser welding process for welding together two workpieces of metallic material includes, during the laser welding process, scanning a melt pool and/or a melt bead using an optical coherence tomography (OCT) measurement beam in at least one line scan, determining an actual geometry of the melt pool and/or the melt bead based on the at least one line scan, and setting at least one welding parameter controlled in the closed loop based on a deviation of the actual geometry from a target geometry of the melt pool and/or the melt bead.

In a method for preparing a workpiece for subsequent laser welding, a recessed structure in the form of at least two grooved line elements is formed by a laser beam in a surface of the workplace, with the line elements having a common starting point from which the laser beam moves onwards to produce the line elements. Solidifying material melt of the workpiece is hereby accumulated in an area of the starting point to produce a nub-like elevation sized to extend out beyond the surface of the workpiece.

It is an object of the present invention to provide a method of producing a vacuum thermal insulation panel capable of reducing the occurrence probability of poor welding of a metal outer wrapping material. The method of producing the vacuum thermal insulation panels 100, 100A to 100 D, 101, 101A according to the present invention includes a “covering step of covering a core material 110 or 110B with a metal foil 130 or 131” and a “welding step of welding a metal foil portion on an outer side of the core material”, and the core material is at least partially covered with a cover 120, 120A, or 120D at a timing when the covering step is to be started. Note that when the entire surface of the core material is covered with the cover, it is preferable to reduce the inside of the cover to seal the cover before the covering step, and when a part of the core material is covered with the cover, it is preferable to simultaneously reduce a pressure inside the metal foil and a pressure inside the cover to seal the metal foil.

A process for producing a crack-free and dense three-dimensional article of a gamma-prime precipitation-strengthened nickel-base superalloy, with more than 6 wt. % of [2 Al (wt. %)+Ti (wt. %)], which involves: (a) preparing a powder layer of a gamma-prime precipitation-strengthened nickel-based alloy material, with uniform thickness on a SLM apparatus substrate plate, or on a previously processed powder layer; (b) melting the prepared powder layer by scanning with a focused laser beam an article cross section area according to a three-dimensional sliced model with calculated cross sections, stored in the SLM control unit; (c) lowering the substrate plate by one layer thickness; and (d) repeating (a) to (c) until reaching a final cross section according to the three-dimensional sliced model, wherein, for (b), the laser power, focus diameter of the focal spot, and scan speed of the focused laser beam are adjusted to obtain heat dissipation welding.

This disclosure relates to a method for manufacturing a battery module that includes the following steps: providing a plurality of battery units; providing a collector plate and an insulation layer disposed on the collect plate; contacting the insulation layer to a plurality of terminals of the plurality of battery units; and performing laser welding on a portion of the insulation layer that is in contact with the plurality of terminals to make the collector plate electrically connect the plurality of terminals.