A system may include a powder source; a powder delivery device; an energy delivery device; and a computing device. The computing device may be configured to: control the powder source to deliver metal powder to the powder delivery device; control the powder delivery device to deliver the metal powder to a surface of an abrasive coating; and control the energy delivery device to deliver energy to at least one of the abrasive coating or the metal powder to cause the metal powder to be joined to the abrasive coating.

Disclosed are a high-throughput preparation device for metal fiber based on multi powder and a method for preparing a metal fiber using the device. The high-throughput preparation device includes a metal powder conveying system, a metal powder mixing system, a metal powder melting system and a metal fiber forming system which are connected in sequence, where the metal powder melting system includes an induction powder melting device and a laser powder melting device which are independently disposed. The method for preparing a metal fiber using the high-throughput preparation device includes four steps: powder conveying, powder mixing, melting and forming.

Disclosed are a high-throughput preparation device for metal fiber based on multi powder and a method for preparing a metal fiber using the device. The high-throughput preparation device includes a metal powder conveying system, a metal powder mixing system, a metal powder melting system and a metal fiber forming system which are connected in sequence, where the metal powder melting system includes an induction powder melting device and a laser powder melting device which are independently disposed. The method for preparing a metal fiber using the high-throughput preparation device includes four steps: powder conveying, powder mixing, melting and forming.

The present laser processing monitoring device is a monitoring device of a laser processing machine that performs desired laser processing by irradiating a given metal-based workpiece with a laser beam LB and melting the workpiece by means of laser energy, and includes a laser oscillator, a laser power supply, a controller, a guide beam generation unit, delivery optical fibers, a head (an emission unit and a sensor unit, an operation panel, and a monitoring unit. The monitoring unit is a laser monitoring device in the present embodiment, and is configured to mainly include the controller, the operation panel, a sensor signal processing unit, the sensor unit, and the like.

The present laser processing monitoring device is a monitoring device of a laser processing machine that performs desired laser processing by irradiating a given metal-based workpiece with a laser beam LB and melting the workpiece by means of laser energy, and includes a laser oscillator, a laser power supply, a controller, a guide beam generation unit, delivery optical fibers, a head (an emission unit and a sensor unit, an operation panel, and a monitoring unit. The monitoring unit is a laser monitoring device in the present embodiment, and is configured to mainly include the controller, the operation panel, a sensor signal processing unit, the sensor unit, and the like.

A terminal-equipped electric wire manufacturing method includes: an electric wire installation step of inserting a core-wire exposed part between inner wall surfaces of piece parts of a core-wire connection body, the core-wire exposed part having a core-wire diameter smaller than an interval between the inner wall surfaces of the piece parts; a melting step of melting the core-wire exposed part and the core-wire connection body by emitting a laser beam to the core-wire exposed part and the core-wire connection body from a free end side of each piece part; and a fixation step of fixing the core-wire exposed part and the core-wire connection body thus melted, with the emission of the laser beam stopped.

A method for fabrication includes providing a donor sheet, including a donor substrate, which is transparent in a specified spectral range, a sacrificial layer, which absorbs optical radiation within the specified spectral range and is disposed over the donor substrate, and a donor film, which includes a paste and is disposed over the sacrificial layer. The donor sheet is positioned so that the donor film is in proximity to a target location on an acceptor substrate. A pulsed laser beam impinges on the sacrificial layer with a pulse energy and spot size selected so as to ablate the sacrificial layer, thus causing a viscoelastic jet of the paste to be ejected from the donor film and to deposit, at the target location on the acceptor substrate, a dot having a diameter less than the spot size of the laser beam.

Disclosed is a processing method for a workpiece. The processing method includes a holding step of holding the workpiece on a holding table, a grinding step of grinding the workpiece that is held on the holding table at and around its center by a grinding wheel, so that a recess portion is formed at and around the center of the workpiece and an annular projection portion is formed surrounding the recess portion at and along an outer periphery of the workpiece, and a fusion step of applying a laser beam to a surface of the workpiece, the surface having been ground in the grinding step, so that the ground surface is fused. A processing apparatus for a workpiece is also disclosed.

Disclosed is a processing method for a workpiece. The processing method includes a holding step of holding the workpiece on a holding table, a grinding step of grinding the workpiece that is held on the holding table at and around its center by a grinding wheel, so that a recess portion is formed at and around the center of the workpiece and an annular projection portion is formed surrounding the recess portion at and along an outer periphery of the workpiece, and a fusion step of applying a laser beam to a surface of the workpiece, the surface having been ground in the grinding step, so that the ground surface is fused. A processing apparatus for a workpiece is also disclosed.

A leadframe has a die pad area and an outer layer of a first metal having a first oxidation potential. The leadframe is placed in contact with a solution containing a second metal having a second oxidation potential, the second oxidation potential being more negative than the first oxidation potential. Radiation energy is then applied to the die pad area of the leadframe contacted with the solution to cause a local increase in temperature of the leadframe. As a result of the temperature increase, a layer of said second metal is selectively provided at the die pad area of the leadframe by a galvanic displacement reaction. An oxidation of the outer layer of the leadframe is then performed to provide an enhancing layer which counters device package delamination.