According to one implementation, a laser peening processing device includes a laser peening processing device includes a laser oscillator, a nozzle and an inclining structure. The laser oscillator emits laser light. The nozzle condenses and irradiates the laser light toward a surface to be processed of a workpiece, with injecting liquid toward the surface to be processed. The inclining structure inclines at least one of the nozzle and the workpiece to make an injection direction of the liquid be different from a normal direction of the surface to be processed. The air bubbles arising by at least one of collision between the liquid and the surface to be processed and shock by irradiation of the laser light on the surface to be processed are flowed in a direction depending on an inclined direction of the surface to the injection direction of the liquid.

The present disclosure provides a method for protection against fretting fatigue by compound modification via laser shock peening and coating lubrication, where a group of micro-pits distributed into a regular array is firstly formed in a surface of a metal material by using laser shock peening, with a single micro-pit having a diameter of 1 to 10 mm and a depth of 1 to 20 μm; and the micro-pits are then coated with a lubricant by coating preparation. Based on the micro-pit styling feature and surface residual compressive stress introducing feature of the laser shock peening, with compound modification by surface texturing via the laser shock peening and coating lubrication, the surface of the material can be reinforced by residual compressive stress, coating lubrication and surface micro-pit texturing with a synergistic effect, thus allowing for improved fretting fatigue behavior of the material.

The present disclosure provides a method for protection against fretting fatigue by compound modification via laser shock peening and coating lubrication, where a group of micro-pits distributed into a regular array is firstly formed in a surface of a metal material by using laser shock peening, with a single micro-pit having a diameter of 1 to 10 mm and a depth of 1 to 20 μm; and the micro-pits are then coated with a lubricant by coating preparation. Based on the micro-pit styling feature and surface residual compressive stress introducing feature of the laser shock peening, with compound modification by surface texturing via the laser shock peening and coating lubrication, the surface of the material can be reinforced by residual compressive stress, coating lubrication and surface micro-pit texturing with a synergistic effect, thus allowing for improved fretting fatigue behavior of the material.

In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure. The Sapphire Collector includes a vacuum-enhance collector with a pickup element that lifts each released chip into the collector, and air pushers that direct the chips further into the collection tunnel leading to a discard bin.

Methods, systems, and apparatuses are disclosed for temporal pulse shaping of laser pulses used in laser shock peening applications. In one embodiment, a system for temporal pulse shaping of a laser beam used for laser shock peening comprises a laser; a modulator; a high voltage driver, a waveform generator, a polarizer, and an optical amplifier.

A remanufacturing method for a metal part having a damage. The damage groove is divided into a number of levels, and the groove bottom is treated by absorption layer-free laser shock peening to remove surface impurities and to refine surface-layer crystal grains. Then a cladding layer is formed by laser cladding. The process is repeated until the groove is completely filled by the cladding layer to higher than the surface of the metal part and the cladding layer higher than the surface is cut by a mechanical processing and polished, and the upper surface of the laser cladding layer is subjected to large-area overlapped laser shock peening.

A solid overlay for laser shock peening is described herein. The solid overlay includes a transparent or translucent material, wherein the solid overlay is structured and adapted to a shape of a surface of a component to be treated by the laser shock peening. The solid overlay is configured to confine a plasma plume generated by laser light.

A solid overlay for laser shock peening is described herein. The solid overlay includes a transparent or translucent material, wherein the solid overlay is structured and adapted to a shape of a surface of a component to be treated by the laser shock peening. The solid overlay is configured to confine a plasma plume generated by laser light.

The present invention provides a single-beam double-physical-effect coordinating and distributing method applicable to uniform laser shock and application thereof, and belongs to the technical field of laser shock effect control. The present invention does not stipulate the specific adjusting and distributing mean, and only provides a coordinating principle and method. The present invention gives a universal and systematic method for setting absorption layer feature parameters applicable to mass laser shock uniform peening under a liquid constraint condition, so as to facilitate the relevant technician to quickly obtain the liquid constraint laser shock processing technology conforming to a distribution proportion of its double physical effects, thereby being beneficial to development and application of the laser shock peening treatment, and therefore having the good actual application value.

The present invention provides a single-beam double-physical-effect coordinating and distributing method applicable to uniform laser shock and application thereof, and belongs to the technical field of laser shock effect control. The present invention does not stipulate the specific adjusting and distributing mean, and only provides a coordinating principle and method. The present invention gives a universal and systematic method for setting absorption layer feature parameters applicable to mass laser shock uniform peening under a liquid constraint condition, so as to facilitate the relevant technician to quickly obtain the liquid constraint laser shock processing technology conforming to a distribution proportion of its double physical effects, thereby being beneficial to development and application of the laser shock peening treatment, and therefore having the good actual application value.