A laser shock and supersonic vibration extrusion co-strengthening device and method. The device comprises a laser assembly, a vibration assembly, a hydraulic assembly and a connecting assembly. The method strengthens a hole (7) formed in a metal sheet (5) simultaneously by laser shock strengthening and supersonic vibration extrusion strengthening; a mandrel (1) is in clearance fit with the hole to constrain the hole, so as to avoid distortion of the hole and a hole angle when the laser shock is performed on an outer surface of a workpiece and to improve the strengthening effect of a hole wall; when the laser shock is performed on the outer surface of the metal sheet, supersonic vibration is applied by the mandrel in the hole; and a three-dimensional pressure stress distribution nearby the hole wall at a certain depth is formed under an interaction produced by power ultrasound and laser shock waves having a certain frequency, amplitude and modality, so that an inner surface having higher anti-fatigue performance and being smoother is provided to the hole. Defects of a traditional strengthening process are overcome, and the problem in strengthening the hole separately through the laser shock or supersonic vibration extrusion is solved.

According to one implementation, a laser peening processing apparatus includes a laser oscillator, a condensing lens, an optical element, a liquid tank and a beam expander. The laser oscillator oscillates laser light. The condensing lens condenses the laser light on a surface of an object. The optical element changes a travelling direction of the laser light. The liquid tank inputs the laser light into liquid, and emits and ejects the laser light and the liquid from an exit to the surface. The beam expander adjusts a magnifying ratio of a beam diameter of the laser light entering into the condensing lens. By adjusting the magnifying ratio, a beam diameter of the laser light irradiating the surface becomes a diameter required for laser peening processing of the surface. The adjusting the magnifying ratio also prevents the laser light, having an excess beam diameter, from entering into the optical element.

According to one implementation, a laser peening processing apparatus includes a laser oscillator, a condensing lens, an optical element, a liquid tank and a beam expander. The laser oscillator oscillates laser light. The condensing lens condenses the laser light on a surface of an object. The optical element changes a travelling direction of the laser light. The liquid tank inputs the laser light into liquid, and emits and ejects the laser light and the liquid from an exit to the surface. The beam expander adjusts a magnifying ratio of a beam diameter of the laser light entering into the condensing lens. By adjusting the magnifying ratio, a beam diameter of the laser light irradiating the surface becomes a diameter required for laser peening processing of the surface. The adjusting the magnifying ratio also prevents the laser light, having an excess beam diameter, from entering into the optical element.

A laser processing device according an embodiment is a laser processing device that irradiates a processing region of a workpiece with pulsed laser light through a liquid to subject the processing region to a laser peening process or a laser forming process. The laser processing device includes: a laser irradiation unit including a laser oscillator that outputs the pulsed laser light; and an accommodation unit that includes an injection port through which the liquid is injected to the processing region, and accommodates the laser irradiation unit. A pulse width of the pulsed laser light is 200 ps to 2 ns, and the pulsed laser light output from the laser oscillator is emitted to the processing region through a liquid that is injected from the injection port.

A laser processing device according an embodiment is a laser processing device that irradiates a processing region of a workpiece with pulsed laser light through a liquid to subject the processing region to a laser peening process or a laser forming process. The laser processing device includes: a laser irradiation unit including a laser oscillator that outputs the pulsed laser light; and an accommodation unit that includes an injection port through which the liquid is injected to the processing region, and accommodates the laser irradiation unit. A pulse width of the pulsed laser light is 200 ps to 2 ns, and the pulsed laser light output from the laser oscillator is emitted to the processing region through a liquid that is injected from the injection port.

A metallic product is produced by an additive manufacturing method. A device for practicing has a controller with a stored instruction set for implementing the manufacturing of the metallic product. The metallic product is manufactured in a piece- wise or layer-wise manner on a target platform by a print head that is in two-way communication with the controller. The print head operates on a momentum transfer technique in which pulsed energy from an impulse source is used to launch pieces of metal toward the target platform, the pieces of metal bonding at the target platform to manufacture the metallic product.

In one aspect, an oxygenated hierarchically porous carbon (an “O-HPC”) is provided, the O-HPC comprising: a hierarchically porous carbon (an “HPC”), the HPC comprising a surface, the surface comprising: (A) first order pores having an average diameter of between about 1 μm and about 10 μm; and (B) walls separating the first order pores, the walls comprising: (1) second order pores having a peak diameter between about 7 nm and about 130 nm; and (2) third order pores having an average diameter of less than about 4 nm, wherein at least a portion of the HPC surface has been subjected to O.sub.2 plasma to oxygenate and induce a negative charge to the surface. In one aspect, the O-HPC further comprises metal nanoparticles dispersed within the first, second, and third order pores. Methods for making and using the metal nanoparticle-impregnated O-HPCs are also provided.

In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure. The Sapphire Collector includes a vacuum-enhance collector with a pickup element that lifts each released chip into the collector, and air pushers that direct the chips further into the collection tunnel leading to a discard bin.

In a Sapphire Collector (SC), one or more features, both structural and parametric, are included for capturing the die-size sapphire chips that are removed from a semiconductor structure during die-level laser lift-off (LLO). These features are designed to increase the likelihood that each sapphire chip is securely captured by the Sapphire Collector immediately after it is released from the semiconductor structure. The Sapphire Collector includes a vacuum-enhance collector with a pickup element that lifts each released chip into the collector, and air pushers that direct the chips further into the collection tunnel leading to a discard bin.

A laser shock strengthening method for small-hole components (4) with different thicknesses. In the method, different technological parameters are used for laser shock strengthening of the small-hole components (4) with different thicknesses, statistical analysis is conducted after a large number of tests to obtain an empirical formula; the empirical formula is a relational expression AA of the power density and the thicknesses of the small-hole component (4). The power density of laser shock strengthening of the small-hole components (4) with different thicknesses can be determined according to the relational expression; and a method for selecting and determining related technological parameters is provided. According to the method, after the small-hole components (4) with different thicknesses are subjected to laser shock strengthening by using a proper technology, reasonable residual compressive stress distribution can be obtained, a good strengthening effect can be achieved, effective shock quality control can be conducted on the components, and workpiece deformation is controlled while guaranteeing the fatigue life of the small-hole components (4).