A method of processing a metal-ceramic substrate (1), comprising: processing the metal-ceramic substrate (1) by irradiating the metal-ceramic substrate (1) with laser light, in particular for forming a predetermined breaking point (5); wherein a surface topography of the metal-ceramic substrate (1) is measured at least in regions in a first measuring step preceding the irradiation and/or in a second measuring step following the irradiation.

A wafer processing method for processing a wafer with devices formed in regions on a side of a front surface of the wafer, the regions being defined by first scheduled division lines and second scheduled division lines includes a first modified layer forming step and a second modified layer forming step. In the first modified layer forming step, a laser beam is irradiated with its focal point set at a height leveled with a height of a first region located inside the wafer on the side of the front surface of the wafer, whereby first modified layers are formed. In the second modified layer forming step, the laser beam is irradiated with its focal point set at a height leveled with a height of a second region located inside the wafer on a side of a back surface of the wafer, whereby second modified layers are formed.

A wafer processing method for processing a wafer with devices formed in regions on a side of a front surface of the wafer, the regions being defined by first scheduled division lines and second scheduled division lines includes a first modified layer forming step and a second modified layer forming step. In the first modified layer forming step, a laser beam is irradiated with its focal point set at a height leveled with a height of a first region located inside the wafer on the side of the front surface of the wafer, whereby first modified layers are formed. In the second modified layer forming step, the laser beam is irradiated with its focal point set at a height leveled with a height of a second region located inside the wafer on a side of a back surface of the wafer, whereby second modified layers are formed.

The present invention provides methods for optically micropatterning hydrogels, which may be used for, e.g., regenerative medicine, synthetic or cultured foods, and in devices suitable for use in high throughput drug screening assays.

A marking process of an object comprising providing a processing device/unit/member/circuit having a word processing software and a display and operationally connected to an apparatus for the marking of an object having a marking head, entering one data by the word processing software suitable for being engraved on an object, switching on a detecting device/unit/member/circuit which are positioned above a work top of the apparatus to receive the object to be marked, positioning the object to be marked above the work top, acquiring an image of the object to be marked and sending it to the word processing software to show it on the display, checking via the display whether the data entered is at least partly superimposed on the image of the object, and starting the marking of the object.

A marking process of an object comprising providing a processing device/unit/member/circuit having a word processing software and a display and operationally connected to an apparatus for the marking of an object having a marking head, entering one data by the word processing software suitable for being engraved on an object, switching on a detecting device/unit/member/circuit which are positioned above a work top of the apparatus to receive the object to be marked, positioning the object to be marked above the work top, acquiring an image of the object to be marked and sending it to the word processing software to show it on the display, checking via the display whether the data entered is at least partly superimposed on the image of the object, and starting the marking of the object.

A processing apparatus is a processing apparatus that irradiates a surface of an object with processing light to process an object and is provided with: a light irradiation apparatus that emits first processing light to form a first irradiation area on the surface and emits second processing light to form a second irradiation area, at least a part of which overlaps with the first irradiation area, on the surface, and has a change member that is configured to change a state of an overlap between the first and second irradiation areas.

A processing apparatus is a processing apparatus that irradiates a surface of an object with processing light to process an object and is provided with: a light irradiation apparatus that emits first processing light to form a first irradiation area on the surface and emits second processing light to form a second irradiation area, at least a part of which overlaps with the first irradiation area, on the surface, and has a change member that is configured to change a state of an overlap between the first and second irradiation areas.

A minute hand includes an upper surface, a lower surface that is in a front-back relationship with the upper surface, and a first side surface coupling the upper surface and the lower surface, and the first side surface is provided with decoration including a recess and a protrusion.

A minute hand includes an upper surface, a lower surface that is in a front-back relationship with the upper surface, and a first side surface coupling the upper surface and the lower surface, and the first side surface is provided with decoration including a recess and a protrusion.