The present invention relates to a method of producing a composite rod from a braze material and a sheet of material comprising cermet. The method comprises scoring a surface of the sheet to produce at least one line of localised stress and subsequently causing the sheet to break along the line of localised stress, thereby to produce a plurality of cermet chunks. The cermet chunks can be combined with the braze material to produce the composite rod. In a particular embodiment, the sheet of material may be a used cermet cutting tip.

A method of assembling a substrate with a part is provided. The method includes a step of structuring the substrate by a pulsed laser. In one example, the substrate is metallic and the part is polymer-based. The structuring step engraves grooves into the substrate in a pattern determined by the relative motion of the beam and the substrate. The pattern is configured to provide improved adhesion between the structured substrate and a part after assembling the substrate and the part by laser welding. The method of assembling may further include a pre-treatment step of the structured surface to allow improve laser absorption during the welding assembling.

A method of assembling a substrate with a part is provided. The method includes a step of structuring the substrate by a pulsed laser. In one example, the substrate is metallic and the part is polymer-based. The structuring step engraves grooves into the substrate in a pattern determined by the relative motion of the beam and the substrate. The pattern is configured to provide improved adhesion between the structured substrate and a part after assembling the substrate and the part by laser welding. The method of assembling may further include a pre-treatment step of the structured surface to allow improve laser absorption during the welding assembling.

A method is provided for marking a location on a surface of a component. The location defines a normal extending perpendicularly therefrom. The method includes irradiating the location with a first laser beam to create a first mark having a first color. The first laser beam is disposed at a first angle relative to the normal. The method also includes irradiating the location with a second laser beam to create a second mark having a second color different than the first color. The second laser beam is disposed at a second angle relative to the normal. The second angle is different than the first angle.

A method is provided for marking a location on a surface of a component. The location defines a normal extending perpendicularly therefrom. The method includes irradiating the location with a first laser beam to create a first mark having a first color. The first laser beam is disposed at a first angle relative to the normal. The method also includes irradiating the location with a second laser beam to create a second mark having a second color different than the first color. The second laser beam is disposed at a second angle relative to the normal. The second angle is different than the first angle.

A method includes preparing a wafer including a substrate and a semiconductor structure, and irradiating an inner portion of the substrate at a predetermined depth in a thickness direction a plurality of times with laser pulses at a first time interval and a predetermined distance interval between irradiations. Each irradiation performed at the first time intervals in the step of irradiating the substrate with laser pulses includes irradiating the substrate at a first focal position in the thickness direction with a first laser pulse having a first pulse-energy; and after irradiating with the first laser pulse, irradiating the substrate with a second laser pulse performed after a second time interval, the second time interval being shorter than the first time interval and being in a range of 3 ps to 900 ps, and the second laser pulse having a second pulse-energy 0.5 to 1.5 times the first pulse-energy.

A method includes preparing a wafer including a substrate and a semiconductor structure, and irradiating an inner portion of the substrate at a predetermined depth in a thickness direction a plurality of times with laser pulses at a first time interval and a predetermined distance interval between irradiations. Each irradiation performed at the first time intervals in the step of irradiating the substrate with laser pulses includes irradiating the substrate at a first focal position in the thickness direction with a first laser pulse having a first pulse-energy; and after irradiating with the first laser pulse, irradiating the substrate with a second laser pulse performed after a second time interval, the second time interval being shorter than the first time interval and being in a range of 3 ps to 900 ps, and the second laser pulse having a second pulse-energy 0.5 to 1.5 times the first pulse-energy.

Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.

Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.

A spark plug including an insulator and a metallic member such as a metallic shell. In the spark plug, a mark such as a two-dimensional code is provided on the surface of at least one of the insulator and the metallic member. Also, a protective layer covers the mark. The protective layer is optically transparent and contains a fluorescent substance.