A processing device to form a pattern on a surface of an object to be processed using diffraction of a laser beam emitted from a laser source, the device including: a main body providing a space to process the object using the laser beam emitted from the laser source; a laser transmission unit formed at a first portion of the main body, and configured to diffract the laser beam so that a diffracted laser beam is emitted toward the object; an actuator formed at a second portion of the main body, and connected to the laser transmission unit so as to change an emission pattern of the diffracted laser beam while rotating the laser transmission unit vertically/horizontally or in a set radius; and a controller provided at a third portion of the main body, and connected to the actuator to control an operation of the actuator.

A universally usable device for producing a predetermined breaking line in an equipment part of a vehicle. The device includes a laser beam generator, a laser scanner and a linear or matrix-shaped first sensor arrangement with first individual sensors of an identical first sensitivity and at least one identical linear or matrix-shaped second sensor arrangement of second individual sensor, which is arranged with an offset to the first sensor arrangement of first individual sensors, and the second individual sensors have an identical second sensitivity which differs from the first sensitivity.

A universally usable device for producing a predetermined breaking line in an equipment part of a vehicle. The device includes a laser beam generator, a laser scanner and a linear or matrix-shaped first sensor arrangement with first individual sensors of an identical first sensitivity and at least one identical linear or matrix-shaped second sensor arrangement of second individual sensor, which is arranged with an offset to the first sensor arrangement of first individual sensors, and the second individual sensors have an identical second sensitivity which differs from the first sensitivity.

Thin-film devices, for example, multi-zone electrochromic windows, and methods of manufacturing are described. In certain cases, a multi-zone electrochromic window comprises a monolithic EC device on a transparent substrate and two or more tinting zones, wherein the tinting zones are configured for independent operation.

Thin-film devices, for example, multi-zone electrochromic windows, and methods of manufacturing are described. In certain cases, a multi-zone electrochromic window comprises a monolithic EC device on a transparent substrate and two or more tinting zones, wherein the tinting zones are configured for independent operation.

An adjustment method of a laser processing apparatus includes a spatial light modulator adjustment step of adjusting a spatial light modulator into a state ready for splitting a laser beam emitted from a laser oscillator and applying a plurality of laser beams such that laser beams will have a desired positional relation, a processing mark formation step of operating the laser oscillator to apply the laser beams to a wafer such that a plurality of processing marks is formed, an imaging step of stopping the laser oscillator, and imaging the processing marks formed at the wafer, and an aberration correction step of correcting aberration of the condenser by comparing the desired positional relation and a positional relation among the imaged processing marks, and adjusting the spatial light modulator such that the positional relation among the processing marks conforms to the desired positional relation.

An adjustment method of a laser processing apparatus includes a spatial light modulator adjustment step of adjusting a spatial light modulator into a state ready for splitting a laser beam emitted from a laser oscillator and applying a plurality of laser beams such that laser beams will have a desired positional relation, a processing mark formation step of operating the laser oscillator to apply the laser beams to a wafer such that a plurality of processing marks is formed, an imaging step of stopping the laser oscillator, and imaging the processing marks formed at the wafer, and an aberration correction step of correcting aberration of the condenser by comparing the desired positional relation and a positional relation among the imaged processing marks, and adjusting the spatial light modulator such that the positional relation among the processing marks conforms to the desired positional relation.

Systems and methods here may be used for a laser inscriber or engraver of a gemstone using software feedback loops and multiple cameras to auto focus the system and automate the inscription.

Systems and methods here may be used for a laser inscriber or engraver of a gemstone using software feedback loops and multiple cameras to auto focus the system and automate the inscription.

In one embodiment, a surface has a laser-beam machined area including an array of micro-sized conical pillars that are arranged in orthogonal rows and columns across the surface and that extend upward, the conical pillars defining deep troughs between them that are configured to absorb electrons, electromagnetic radiation, or both, the conical pillars tapering from relatively wide bases to pointed tips, the conical pillars comprising outer surfaces that are covered with a plurality of nanoparticles.