A dimensional lumber product and method for marking them. The lumber is marked on a side at regular intervals. The marks may be made with laser, paint, or mechanical force. The marks enable a builder to make accurate cuts using the existing marks, without needing to measure and manually mark the lumber.

A grain-oriented silicon steel with low iron loss, wherein the silicon steel is provided with a plurality of grooves on its surface, each of the grooves is 10-60 μm in width and 5-40 μm in depth, and the spacing between adjacent grooves is 1-10 mm. The manufacturing method therefor comprises: scoring the surface of the grain-oriented silicon steel with low iron loss by using a laser in order to form the grooves. The grain-oriented silicon steel with low iron loss can maintain the magnetic domain refining effect in a stress-relief annealing process, and avoid the introduction of more residual stress.

A grain-oriented silicon steel with low iron loss, wherein the silicon steel is provided with a plurality of grooves on its surface, each of the grooves is 10-60 μm in width and 5-40 μm in depth, and the spacing between adjacent grooves is 1-10 mm. The manufacturing method therefor comprises: scoring the surface of the grain-oriented silicon steel with low iron loss by using a laser in order to form the grooves. The grain-oriented silicon steel with low iron loss can maintain the magnetic domain refining effect in a stress-relief annealing process, and avoid the introduction of more residual stress.

A method of processing a wafer having a plurality of devices provided in respective areas demarcated on a face side of the wafer by a plurality of projected dicing lines. The method includes coating the face side with a protective film agent and thereafter drying the protective film agent into a protective film covering the face side, applying a laser beam having a wavelength absorbable by the wafer to the wafer along the projected dicing lines on the face side, thereby producing a plurality of laser-processed slots in the wafer, cleaning away the protective film, applying ultraviolet rays to the face side to remove an organic substance deriving from the protective film and remaining on the face side, and covering coverage areas corresponding to the respective devices on the face side with an encapsulating resin.

A method of processing a wafer having a plurality of devices provided in respective areas demarcated on a face side of the wafer by a plurality of projected dicing lines. The method includes coating the face side with a protective film agent and thereafter drying the protective film agent into a protective film covering the face side, applying a laser beam having a wavelength absorbable by the wafer to the wafer along the projected dicing lines on the face side, thereby producing a plurality of laser-processed slots in the wafer, cleaning away the protective film, applying ultraviolet rays to the face side to remove an organic substance deriving from the protective film and remaining on the face side, and covering coverage areas corresponding to the respective devices on the face side with an encapsulating resin.

The laser processing apparatus according to this disclosure includes a laser oscillator to generate laser light, a processing table to place a workpiece thereon, the workpiece having a protective sheet on a surface thereof, the protective sheet including a laser light absorbing layer, a laser head to process the workpiece with the laser light, and a control unit to adjust a position of the laser head so that a focal position of the laser light is brought to a position away from the surface of the workpiece toward the laser head, and to control power of the laser light so that marking is provided by causing the laser light absorbing layer to absorb the laser light and thus transforming the inside of the protective sheet.

A laser processing method includes: marking multiple concaves on a surface of a preform before blow molding.

A laser processing method includes: marking multiple concaves on a surface of a preform before blow molding.

A method and system for laser pre-cutting a layered material (31) with a laser beam (14) is disclosed. The layered material (31) comprises at least one tensile stress layer (TSL), at least one compression stress layer (CSL1, CSL2), and at least one interface region (IR1, IR2) between the at least one tensile stress layer (TSL) and the at least one compression stress layer (CSL1, CSL2) and is transparent to allow propagation of the laser beam (14) through the layered material (31). The method may comprise setting an optical beam path (8) and a laser characteristic of the laser beam (14) such that an interaction of the laser beam (14) with the layered material (31) generates an elongate damage region (57) in the layered material (31), and, for each of a series of pre-cut positions (X.sub.N−1, X.sub.N, X.sub.N+1) of the layered material (31), pre-cutting the layered material (31) by positioning the layered material (31) and the laser beam (14) with respect to each other and irradiating the laser beam (14) such that the respective elongate damage regions (57) extend across the at least one interface region (IR1, IR2).

A laser conformal manufacturing method of a flexible sensor comprises: obtaining morphology data of a curved surface, and constructing a Standard Triangle Language (STL) model of the curved surface; introducing into a 3D modeling software, and combining the curved surface with a clamper holder; manufacturing to obtain the clamper with the curved surface; coating material to be manufactured on a 3D curved surface of the damper with the curved surface; positioning to a processing platform of a laser device; constructing a model of a pattern to be manufactured by laser based on the STL model of the curved surface, and constructing an STL model or a dwg model of the pattern to be manufactured; introducing into the laser device, turning on the laser device, and running a 3D dynamic focus system; repeating the steps 4-8, and stripping the flexible sensor from the 3D curved surface.