Methods and systems are provided for using optical interferometry in the context of material modification processes such as surgical laser or welding applications. An imaging optical source that produces imaging light. A feedback controller controls at least one processing parameter of the material modification process based on an interferometry output generated using the imaging light. A method of processing interferograms is provided based on homodyne filtering. A method of generating a record of a material modification process using an interferometry output is provided.

Methods and systems are provided for using optical interferometry in the context of material modification processes such as surgical laser or welding applications. An imaging optical source that produces imaging light. A feedback controller controls at least one processing parameter of the material modification process based on an interferometry output generated using the imaging light. A method of processing interferograms is provided based on homodyne filtering. A method of generating a record of a material modification process using an interferometry output is provided.

The present specification relates to a joint body of different materials, and a method of manufacturing the same. The joint body includes a metal layer; and a resin layer provided on and in contact with one surface of the metal layer. The metal layer comprises two or more etching grooves and two or more burrs provided on a surface of the metal layer adjacent to the etching grooves.

Energy is locally supplied to a cutting surface that is formed in an outer circumferential region of a wafer in a trimming step, before a grinding step of grinding the wafer. This can remove or repair at least part of a damage layer formed in the outer circumferential region of the wafer due to the trimming step. As a result, breakage of the wafer that originates from the outer circumferential region in the grinding of the wafer which has been subjected to the edge trimming and generation of dust in a step after this grinding can be suppressed.

A cutting blade for vegetation is provided for example for use in a straw chopper or rotary mower. The blade body includes a first base material and at least one hard surface bead formed on at least one surface of the base material extending up to a cutting edge of the base material. Beads can be applied longitudinally by the heat energy from the cladding laser system to form pockets so that the blade is serrated by the pockets when supplied with additional wear increasing the pockets to maintain the serrations. The chamfered side face of the blade body forming the cutting edge can also be formed using heat energy from the same laser cutting and cladding system.

A cutting blade for vegetation is provided for example for use in a straw chopper or rotary mower. The blade body includes a first base material and at least one hard surface bead formed on at least one surface of the base material extending up to a cutting edge of the base material. Beads can be applied longitudinally by the heat energy from the cladding laser system to form pockets so that the blade is serrated by the pockets when supplied with additional wear increasing the pockets to maintain the serrations. The chamfered side face of the blade body forming the cutting edge can also be formed using heat energy from the same laser cutting and cladding system.

In some embodiments, the present disclosure relates to a wafer edge trimming apparatus that includes a processing chamber defined by chamber housing. Within the processing chamber is a wafer chuck configured to hold onto a wafer structure. Further, a blade is arranged near an edge of the wafer chuck and configured to remove an edge potion of the wafer structure and to define a new sidewall of the wafer structure. A laser sensor apparatus is configured to direct a laser beam directed toward a top surface of the wafer chuck. The laser sensor apparatus is configured to measure a parameter of an analysis area of the wafer structure. Control circuitry is to the laser sensor apparatus and the blade. The control circuitry is configured to start a damage prevention process when the parameter deviates from a predetermined threshold value by at least a predetermined shift value.

In some embodiments, the present disclosure relates to a wafer edge trimming apparatus that includes a processing chamber defined by chamber housing. Within the processing chamber is a wafer chuck configured to hold onto a wafer structure. Further, a blade is arranged near an edge of the wafer chuck and configured to remove an edge potion of the wafer structure and to define a new sidewall of the wafer structure. A laser sensor apparatus is configured to direct a laser beam directed toward a top surface of the wafer chuck. The laser sensor apparatus is configured to measure a parameter of an analysis area of the wafer structure. Control circuitry is to the laser sensor apparatus and the blade. The control circuitry is configured to start a damage prevention process when the parameter deviates from a predetermined threshold value by at least a predetermined shift value.

The invention relates to a method for producing a roughing tool (1), particularly a circular milling tool, comprising the following steps: fitting a lateral surface of a tool base body (10) that can be rotatably driven about an axis of rotation (2) with a number of cutting element blanks (20′) that are staggered in the axial and/or peripheral direction, such that a free edge of each cutting element blank (20′) protrudes out of the lateral surface in the mounted state; inserting a microtoothing comprising a plurality of axially spaced cutting teeth (21) into the respective free edges of the cutting element blanks (20′) by a material removal method, preferably by thermal machining, particularly preferably by eroding, in the premounted state on the tool base body (10). The invention further relates to a roughing tool produced by means of such a method.

Systems and methods for machining openings of a component are provided. In one exemplary aspect, a laser system includes features for machining an opening into a component, such as a cooling hole for a CMC component of a gas turbine engine. The component can be oriented in a first position and lasered while oriented in the first position to form a portion of the opening. The component is then oriented to a second position and lasered while oriented in the second position to form another portion of the opening. The component is alternated between the first and second positions until the predetermined geometry of the opening is formed. The component is oriented in the first and second positions such that the laser beam can machine the component without clipping areas that are not desired to be machined.