According to the present disclosure, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, so as to contribute in improving the safety property of the secondary battery. The manufacturing method of the electrode plate herein disclosed includes a precursor preparing step for preparing an electrode precursor 20A including an active substance provided area A1 in which an electrode active substance layer 24 is provided on a surface of the electrode substrate 22 and including a substrate exposed area A2 in which the electrode active substance layer 24 is not provided and the electrode substrate 22 is exposed, an active substance provided area cutting step for cutting the active substance provided area A1 by a pulse laser, and a substrate exposed area cutting step for cutting the substrate exposed area A2 by the pulse laser. Then, the frequency of the pulse laser in the substrate exposed area cutting step is made to be larger than the frequency of the pulse laser in the active substance provided area cutting step, and the lap rate of the pulse laser in the substrate exposed area cutting step is made to be equal to or more than 90%. According to the manufacturing method of the electrode plate as described above, it is possible to inhibit the electrically conductive foreign substance from falling off and being peeled off from the electrode plate that has been already manufactured, and thus it is possible to contribute in improving the safety property of the secondary battery.

A through-glass via-hole formation method includes: forming a hole-shaped deformed region extending in a thickness direction of a glass substrate by irradiating the glass substrate with a laser beam at an energy intensity not exceeding an ablation threshold of the glass substrate; and forming a via-hole through the glass substrate along the deformed region by immersing the glass substrate in an etching solution such that the deformed region is etched and removed, wherein an etching solution having a first concentration is used as the etching solution to allow the via-hole to have a first aspect ratio, and an etching solution having a second concentration greater than the first concentration is used as the etching solution to allow the via-hole to have a second aspect ratio smaller than the first aspect ratio.

A through-glass via-hole formation method includes: forming a hole-shaped deformed region extending in a thickness direction of a glass substrate by irradiating the glass substrate with a laser beam at an energy intensity not exceeding an ablation threshold of the glass substrate; and forming a via-hole through the glass substrate along the deformed region by immersing the glass substrate in an etching solution such that the deformed region is etched and removed, wherein an etching solution having a first concentration is used as the etching solution to allow the via-hole to have a first aspect ratio, and an etching solution having a second concentration greater than the first concentration is used as the etching solution to allow the via-hole to have a second aspect ratio smaller than the first aspect ratio.

A workpiece engaging surface that includes a pattern of laser-etched channels and related method of manufacturing is provided. The laser-etched pattern on the surface of the workpiece engaging surface is formed by multiple groupings of closely spaced channels that generate serrated teeth in the surface of the tip. Each grouping of channels is formed by passing a laser over a first location a first number of passes to form a first channel, passing a laser over a second location, spaced apart from the first location by a channel spacing distance, a second number of passes to form a second channel, and passing a laser over a third location, spaced apart from the second location by the channel spacing distance, a third number of passes to form a third channel. In some embodiments the first, second, and third number of passes are the same.

A workpiece engaging surface that includes a pattern of laser-etched channels and related method of manufacturing is provided. The laser-etched pattern on the surface of the workpiece engaging surface is formed by multiple groupings of closely spaced channels that generate serrated teeth in the surface of the tip. Each grouping of channels is formed by passing a laser over a first location a first number of passes to form a first channel, passing a laser over a second location, spaced apart from the first location by a channel spacing distance, a second number of passes to form a second channel, and passing a laser over a third location, spaced apart from the second location by the channel spacing distance, a third number of passes to form a third channel. In some embodiments the first, second, and third number of passes are the same.

A dental appliance having an integrally formed reservoir and/or an ornamental design integrated thereon. The ornamental design can be selected or customized by a patient. The design can be created by directing energy to the dental appliance to alter a material property of at least a portion of the appliance to create the design. Alternatively, a groove or recess can be formed on a surface of the appliance to either mechanically retain an ornamental design or the groove or recess can be filled with ink to form the design. The appliance, including the integrally formed reservoir, can be formed using direct fabrication techniques.

A dental appliance having an integrally formed reservoir and/or an ornamental design integrated thereon. The ornamental design can be selected or customized by a patient. The design can be created by directing energy to the dental appliance to alter a material property of at least a portion of the appliance to create the design. Alternatively, a groove or recess can be formed on a surface of the appliance to either mechanically retain an ornamental design or the groove or recess can be filled with ink to form the design. The appliance, including the integrally formed reservoir, can be formed using direct fabrication techniques.

A laser automatic focusing equipment for a laser engraving machine is provided. It includes a lifting mechanism, a laser assembly disposed at a lower end of a side of the lifting mechanism, and a lifting motor fixedly disposed on an upper end of the side of the lifting mechanism and is in transmission connection with the lifting mechanism. The laser assembly includes a heat sink, a laser disposed in the heat sink, a distance sensor disposed in the heat sink and on a side of the laser, and a contact device disposed in the heat sink and at a bottom of the laser. The whole focusing process is controlled by a program without human intervention, with high accuracy, no manual operation and no laser irradiation risk. It is suitable for focusing of engraving materials with different hardness and different materials by adding the contact device.

A method for machining a material using a pulsed laser includes introducing a sequence of laser pulses into the material for machining the material, and synchronizing a start of each sequence with a fundamental frequency of the laser. The sequence of laser pulses comprises at least two different sequence elements that are offset from one another in space and time. Each sequence element comprises an individual laser pulse, a specific succession of individual laser pulses, or a burst of laser pulses. Specific sequence element properties are impressed on each sequence element. The sequence element properties comprise a position of the laser focus of a respective sequence element. The position of the laser focus of each sequence element of the sequence is adapted for each sequence element.

A system includes a fixture, a laser assembly, and a positioning assembly. The fixture is configured to hold (i) a substrate of a distal-end assembly of a catheter and (ii) a lead placed on a given solder pad disposed on the substrate, the laser assembly is configured to emit a laser beam, and the positioning assembly is configured to move the fixture, with the substrate and the lead, relative to the laser assembly, so as to mark a soldering position, at which the lead is to be attached to the given solder pad, with a laser spot of the laser beam.