A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.

A method of producing a glass substrate having a hole is provided. The method includes preparing the glass substrate having a first surface and a second surface facing each other; forming a hole in the glass substrate with a laser; and annealing the glass substrate placed on a first support substrate having a thermal expansion coefficient whose difference from a thermal expansion coefficient of the glass substrate is less than or equal to 1 ppm/K, where the first support substrate is placed on a second support substrate having a thermal expansion coefficient of less than or equal to 10 ppm/K.

Embodiments of an ultrashort pulse laser marking apparatus for forming indelible identifiers on discreet consumable articles, and corresponding methods, are disclosed. An ultrashort pulse laser transmission element of the apparatus is configured to transmit a beam of laser energy toward a marking zone to form an optically-readable indelible identifier on discrete consumable articles. The beam may have a pulse duration less than 10 picosecond, and a wavelength of less than 1.5 microns. The consumable articles may comprise a photoreactive pigment configured to undergo a color change upon exposure to the beam of laser energy, and the indelible identifier may be defined by the color change. Alternatively or in addition, the optical readability may be at least in part by way of a primary pattern reflected light intensity being distinguishable from a baseline reflected light intensity or from a secondary reflected light intensity from a viewpoint outward of the article.

Methods and systems are provided for using optical interferometry in the context of material modification processes such as surgical laser or welding applications. An imaging optical source that produces imaging light. A feedback controller controls at least one processing parameter of the material modification process based on an interferometry output generated using the imaging light. A method of processing interferograms is provided based on homodyne filtering. A method of generating a record of a material modification process using an interferometry output is provided.

Methods and systems are provided for using optical interferometry in the context of material modification processes such as surgical laser or welding applications. An imaging optical source that produces imaging light. A feedback controller controls at least one processing parameter of the material modification process based on an interferometry output generated using the imaging light. A method of processing interferograms is provided based on homodyne filtering. A method of generating a record of a material modification process using an interferometry output is provided.

An electromagnetic radiation system for directing an electromagnetic radiation beam (11) at a target (28) having a first arrangement (12) in which the radiation beam (11) is directed along a marking beam path that is within a marking range of the electromagnetic radiation system and a second arrangement (12, 15) in which the radiation beam (27) is directed along a different beam path (27) that is not within the marking range of the electromagnetic radiation system, wherein a positional relationship between the marking beam path (11) and the different beam path (27) satisfies a predetermined condition at the target (28) when the electromagnetic radiation system is at a predetermined distance (29) from the target (28).

A tool allows a user to create new designs for apparel and preview these designs in three dimensions before manufacture. Software and lasers are used in finishing apparel to produce a desired wear pattern or other design. Based on a laser input file with a pattern, a laser will burn the pattern onto apparel. With the tool, the user will be able to create, make changes, and view images of a design, in real time, before burning by a laser. The tool can be accessed or executes via a Web browser.

An article includes a ceramic material and features a machined surface that is characteristic of cold ablation laser machining, and the machined surface exhibits no visible oxidation. A laser machining apparatus and technique is based on cold-ablation, but is modified or augmented with an inert assist gas to minimize deleterious surface modifications and mitigate oxide formation associated with laser machining.

An article includes a ceramic material and features a machined surface that is characteristic of cold ablation laser machining, and the machined surface exhibits no visible oxidation. A laser machining apparatus and technique is based on cold-ablation, but is modified or augmented with an inert assist gas to minimize deleterious surface modifications and mitigate oxide formation associated with laser machining.

Separation lines are formed in a glass plate having first and second main surfaces by irradiating with laser light. The separation lines are configured of a product line corresponding to an outline of a glass article to be separated; and a release line. The product line includes a first in-plane void array configured of in-plane voids arranged on the first main surface; and internal void arrays for product line, each having an in-plane void. The release line includes internal void arrays for release line. A maximum length of the internal void array for product line L.sub.1max is equal to a maximum length of the internal void array for release line L.sub.2max, and a minimum length of the internal void array for product line L.sub.1min is greater than a minimum length of the internal void array for release line L.sub.2min; or the length L.sub.1max is greater than the length L.sub.2max.