Patent classifications
B23K26/362
TOUCH DISPLAY DEVICE AND FORMATION METHOD THEREOF
A touch display device is provided in some embodiments of the present disclosure, including a transparent cover, a patterned touch sensing film layer, a light-shielding layer, and a UV-blocking layer. The patterned touch sensing film layer covers a first surface of the transparent cover. The light-shielding layer is located between the transparent cover and the patterned touch sensing film layer. The UV-blocking layer prevents UV from irradiating the light-shielding layer. The UV-blocking layer is located between the light-shielding layer and the patterned touch sensing film layer and covers the light-shielding layer. A method of forming a touch display device is also provided. The touch display device and formation method thereof provided in some embodiments avoid the injury of the light-shielding layer caused by the laser by disposing of the UV-blocking layer in the single-side electrode structure, which replaces the wet etching steps and decreases the cost of the etching steps.
TOUCH DISPLAY DEVICE AND FORMATION METHOD THEREOF
A touch display device is provided in some embodiments of the present disclosure, including a transparent cover, a patterned touch sensing film layer, a light-shielding layer, and a UV-blocking layer. The patterned touch sensing film layer covers a first surface of the transparent cover. The light-shielding layer is located between the transparent cover and the patterned touch sensing film layer. The UV-blocking layer prevents UV from irradiating the light-shielding layer. The UV-blocking layer is located between the light-shielding layer and the patterned touch sensing film layer and covers the light-shielding layer. A method of forming a touch display device is also provided. The touch display device and formation method thereof provided in some embodiments avoid the injury of the light-shielding layer caused by the laser by disposing of the UV-blocking layer in the single-side electrode structure, which replaces the wet etching steps and decreases the cost of the etching steps.
Sintered product and laser marking method for sintered product
A method according to one aspect of the present disclosure is a laser marking method for a powder compact containing metal powder, which includes: a first step of scanning with laser light of first power which is weaker over a predetermined area in a surface of the powder compact, to melt and smooth inside of the predetermined area; and a second step of scanning with laser light of second power which is greater, to form a dot formed of a recess of a predetermined depth at a predetermined location in the predetermined area.
Sintered product and laser marking method for sintered product
A method according to one aspect of the present disclosure is a laser marking method for a powder compact containing metal powder, which includes: a first step of scanning with laser light of first power which is weaker over a predetermined area in a surface of the powder compact, to melt and smooth inside of the predetermined area; and a second step of scanning with laser light of second power which is greater, to form a dot formed of a recess of a predetermined depth at a predetermined location in the predetermined area.
Method for microstructuring a glass substrate by means of laser radiation
A method for microstructuring a plate-shaped glass substrate by laser radiation includes: introducing one-sided recesses into the glass substrate, in which a focus of the laser radiation forms a spatial beam along a beam axis and in which the laser radiation creates modifications in the glass substrate along the beam axis so that an action of an etching medium subsequently creates the recesses in the glass substrate through anisotropic removal of material in a respective region of the modifications. A chemical composition of the glass substrate is partially changed and thus at least one region of changed properties is created before the action of the etching medium.
Method for microstructuring a glass substrate by means of laser radiation
A method for microstructuring a plate-shaped glass substrate by laser radiation includes: introducing one-sided recesses into the glass substrate, in which a focus of the laser radiation forms a spatial beam along a beam axis and in which the laser radiation creates modifications in the glass substrate along the beam axis so that an action of an etching medium subsequently creates the recesses in the glass substrate through anisotropic removal of material in a respective region of the modifications. A chemical composition of the glass substrate is partially changed and thus at least one region of changed properties is created before the action of the etching medium.
Fe-BASED AMORPHOUS ALLOY RIBBON, PRODUCTION METHOD THEREOF, IRON CORE, AND TRANSFORMER
An Fe-based amorphous alloy ribbon reduced in iron loss, less deformed, and highly productive in a condition of a magnetic flux density of 1.45 T is provided. One aspect of the present disclosure provides an Fe-based amorphous alloy ribbon having first and second surfaces, and is provided with continuous linear laser irradiation marks on at least the first surface. Each linear laser irradiation mark is formed along a direction orthogonal to a casting direction of the Fe-based amorphous alloy ribbon, and has unevenness on its surface. When the unevenness is evaluated in the casting direction, a height difference HL×width WA calculated from the height difference HL between a highest point and a lowest point in a thickness direction of the Fe-based amorphous alloy ribbon and the width WA which is a length of the linear irradiation mark on the first surface is 6.0 to 180 μm.sup.2.
Wafer Bonding Method
In an embodiment, a device includes: a first wafer including a first substrate and a first interconnect structure, a sidewall of the first interconnect structure forming an obtuse angle with a sidewall of the first substrate; and a second wafer bonded to the first wafer, the second wafer including a second substrate and a second interconnect structure, the sidewall of the first substrate being laterally offset from a sidewall of the second substrate and a sidewall of the second interconnect structure.
Wafer Bonding Method
In an embodiment, a device includes: a first wafer including a first substrate and a first interconnect structure, a sidewall of the first interconnect structure forming an obtuse angle with a sidewall of the first substrate; and a second wafer bonded to the first wafer, the second wafer including a second substrate and a second interconnect structure, the sidewall of the first substrate being laterally offset from a sidewall of the second substrate and a sidewall of the second interconnect structure.
COLORED DIRECT LASER MARKING ON TIRE
A motor vehicle tire includes a sidewall having an inner layer of a first color and an outer layer adjacent the inner layer. The outer layer is of a second color different from the first color. The outer layer has a plurality of throughholes that visually expose the inner layer. The throughholes are in a pattern that encodes information about a history of the motor vehicle tire and/or a unique identifier