A fixture used in the manufacture of an eyepiece, to cut the eyepiece to a particular shape, and a method of using the fixture to cut the eyepiece to have a desired shape. Embodiments are directed to a configurable fixture to align, hold, and protect a plastic sheet (e.g., a wafer) while a laser cutting apparatus is cutting one or more eyepieces out of the wafer. During the cutting, the fixture protects the eyepieces from reflected laser light by providing voids around the laser cutting lines, and by supporting each eyepiece near its perimeter. The fixture can be quickly rearranged for different eyepieces, different eyepiece shapes, and/or different plastic sheet sizes.

A laser machining method able to effectively satisfy cutting quality required on one side of a cutting spot of a workpiece. A laser machining method for cutting a workpiece W by using a machining head able to emit a laser beam and an assist gas coaxially and non-coaxially includes: preparing a machining program specifying, for the workpiece W, a cutting line, and a first region and a second region on both sides of the cutting line where cutting quality requirements are different; and maintaining a state in which a center axis of the assist gas is shifted from an optical axis of the laser beam toward the first region in response to the difference in the cutting quality requirements during the cutting between the first region and the second region along the cutting line in accordance with the machining program.

A laser machining method able to effectively satisfy cutting quality required on one side of a cutting spot of a workpiece. A laser machining method for cutting a workpiece W by using a machining head able to emit a laser beam and an assist gas coaxially and non-coaxially includes: preparing a machining program specifying, for the workpiece W, a cutting line, and a first region and a second region on both sides of the cutting line where cutting quality requirements are different; and maintaining a state in which a center axis of the assist gas is shifted from an optical axis of the laser beam toward the first region in response to the difference in the cutting quality requirements during the cutting between the first region and the second region along the cutting line in accordance with the machining program.

Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.

Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.

A method for thermal processing of a workpiece uses a thermal processing machine. The method includes the following steps carried out in an automated manner: setting up the processing machine by producing contact between the processing tool and the workpiece and recording the spatial position of a workpiece surface, positioning the processing tool at a predetermined first and second distance from the workpiece surface and recording the associated signal values of the distance sensor as first and second measured values, and calibrating the distance controller which includes determining a height derivative of the distance sensor signal and an amplification factor for the signal of the distance sensor taking in account the first measured value, the second measured value, the first distance and the second distance; positioning the processing tool at a predetermined working distance from the workpiece surface with the inclusion of the amplification factor; and thermally processing the workpiece.

A method for thermal processing of a workpiece uses a thermal processing machine. The method includes the following steps carried out in an automated manner: setting up the processing machine by producing contact between the processing tool and the workpiece and recording the spatial position of a workpiece surface, positioning the processing tool at a predetermined first and second distance from the workpiece surface and recording the associated signal values of the distance sensor as first and second measured values, and calibrating the distance controller which includes determining a height derivative of the distance sensor signal and an amplification factor for the signal of the distance sensor taking in account the first measured value, the second measured value, the first distance and the second distance; positioning the processing tool at a predetermined working distance from the workpiece surface with the inclusion of the amplification factor; and thermally processing the workpiece.

A glass sheet processing apparatus includes a first gantry assembly that extends across a glass sheet in a cross-machine direction. The first gantry assembly includes a processing head that moves along a length of the first gantry assembly and includes a laser comprising an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement. A second gantry assembly extends across the glass sheet in the cross-machine direction. The second gantry assembly includes a processing head that moves along a length of the second gantry assembly.

A glass sheet processing apparatus includes a first gantry assembly that extends across a glass sheet in a cross-machine direction. The first gantry assembly includes a processing head that moves along a length of the first gantry assembly and includes a laser comprising an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement. A second gantry assembly extends across the glass sheet in the cross-machine direction. The second gantry assembly includes a processing head that moves along a length of the second gantry assembly.

A method for manufacturing a cutting tool according to one embodiment is a method for manufacturing a cutting tool, the cutting tool including a base material and a diamond single crystal material fixed to the base material, the diamond single crystal material having a rake face, a flank face continuous with the rake face, and a cutting edge formed by a ridgeline serving as a boundary between the rake face and the flank face. The method for manufacturing a cutting tool according to one form of the present disclosure includes a flank face irradiation step of applying a laser to the diamond single crystal material along the cutting edge from a side of the flank face. The laser has a pulse width of 1×10.sup.−12 seconds or less and a peak output of less than 1 W in the flank face irradiation step.