A cutting method for a display panel, wherein the cutting method includes: cutting a display motherboard to be cut into a plurality of separate display panels by using a first laser beam, wherein the display panels each include a plurality of leads disposed between conductive connectors and a cutting edge of the display panel formed after cutting by the first laser beam; and severing at least some leads of the display panel by using a second laser beam at a position on the display panel between the conductive connectors and the cutting edge of the display panel, the at least some leads being short-circuited leads.

A cutting method for a display panel, wherein the cutting method includes: cutting a display motherboard to be cut into a plurality of separate display panels by using a first laser beam, wherein the display panels each include a plurality of leads disposed between conductive connectors and a cutting edge of the display panel formed after cutting by the first laser beam; and severing at least some leads of the display panel by using a second laser beam at a position on the display panel between the conductive connectors and the cutting edge of the display panel, the at least some leads being short-circuited leads.

In this laser cutting method and laser cutting device with which a base material is cut by irradiating, with laser, a surface of a base material formed of a composite material, an irradiation step for swinging the laser in a tolerance direction crossing the length direction of a cutting line while moving the laser relative to the base material along the length direction of the cutting line for cutting the base material is repeatedly performed on the cutting line, thereby cutting the base material, and in the irradiation step, a swing width in the width direction of the laser is decreased as the depth in the depth direction from the surface of the base material toward the rear surface increases.

In this laser cutting method and laser cutting device with which a base material is cut by irradiating, with laser, a surface of a base material formed of a composite material, an irradiation step for swinging the laser in a tolerance direction crossing the length direction of a cutting line while moving the laser relative to the base material along the length direction of the cutting line for cutting the base material is repeatedly performed on the cutting line, thereby cutting the base material, and in the irradiation step, a swing width in the width direction of the laser is decreased as the depth in the depth direction from the surface of the base material toward the rear surface increases.

An ingot is processed by applying exciting light, and detecting fluorescence occurring from an upper surface of the ingot. A distribution of the number of photons of the fluorescence on the upper surface of the ingot is stored as two-dimensional data in association with XY coordinate positions, and a Z-coordinate position at which the two-dimensional data is obtained is also stored. A laser beam forms a peeling layer by irradiating the ingot while positioning the condensing point of the laser beam at a depth corresponding to the thickness of a wafer from the upper surface of the ingot. A wafer is separated from the ingot with the peeling layer as a starting point, and three-dimensional data is generated representing the distribution of the number of photons of the fluorescence in the whole of the ingot on the basis of two-dimensional data at each Z-coordinate position of the ingot.

An ingot is processed by applying exciting light, and detecting fluorescence occurring from an upper surface of the ingot. A distribution of the number of photons of the fluorescence on the upper surface of the ingot is stored as two-dimensional data in association with XY coordinate positions, and a Z-coordinate position at which the two-dimensional data is obtained is also stored. A laser beam forms a peeling layer by irradiating the ingot while positioning the condensing point of the laser beam at a depth corresponding to the thickness of a wafer from the upper surface of the ingot. A wafer is separated from the ingot with the peeling layer as a starting point, and three-dimensional data is generated representing the distribution of the number of photons of the fluorescence in the whole of the ingot on the basis of two-dimensional data at each Z-coordinate position of the ingot.

A mask includes a mask sheet including an upper surface and a lower surface facing the upper surface, the mask sheet including an opening passing through the upper surface and the lower surface; and a mask frame that supports the mask sheet, the mask sheet includes a protrusion adjacent to the opening and protruding from the lower surface, and a recess adjacent to the protrusion and recessed from the lower surface toward the upper surface of the mask sheet.

A mask includes a mask sheet including an upper surface and a lower surface facing the upper surface, the mask sheet including an opening passing through the upper surface and the lower surface; and a mask frame that supports the mask sheet, the mask sheet includes a protrusion adjacent to the opening and protruding from the lower surface, and a recess adjacent to the protrusion and recessed from the lower surface toward the upper surface of the mask sheet.

A method for producing a detachment area in a solid body in described. The solid body has a crystal lattice and is at least partially transparent to laser beams emitted by a laser. The method includes: modifying the crystal lattice of the solid by a laser beam, wherein the laser beam penetrates through a main surface of a detachable solid portion of the solid body, wherein a plurality of modifications are produced in the crystal lattice, wherein the modification are formed in a plane parallel to the main surface and at a distance from one another, wherein as a result of the modifications, the crystal lattice cracks the regions surrounding the modifications sub-critically in at least the one portion, and wherein the subcritical cracks are arranged in a plane parallel to the main surface.

A method for producing a detachment area in a solid body in described. The solid body has a crystal lattice and is at least partially transparent to laser beams emitted by a laser. The method includes: modifying the crystal lattice of the solid by a laser beam, wherein the laser beam penetrates through a main surface of a detachable solid portion of the solid body, wherein a plurality of modifications are produced in the crystal lattice, wherein the modification are formed in a plane parallel to the main surface and at a distance from one another, wherein as a result of the modifications, the crystal lattice cracks the regions surrounding the modifications sub-critically in at least the one portion, and wherein the subcritical cracks are arranged in a plane parallel to the main surface.