A processing apparatus includes a reinforcing portion removing mechanism. The reinforcing portion removing mechanism includes a laser beam irradiating unit configured to form a cutting groove by applying a laser beam to a base of a ring-shaped reinforcing portion formed on a periphery of a wafer, a first raising and lowering table configured to hold and raise a frame unit temporarily placed on a temporary placement table, and position the frame unit at the laser beam irradiating unit, and a separating unit configured to separate the ring-shaped reinforcing portion from the cutting groove. The separating unit includes an ultraviolet ray irradiating unit, a second raising and lowering table, a separator, and a discarding unit.

A laser beam irradiation unit of a laser processing apparatus includes a first splitting unit that causes a laser beam emitted from a laser oscillator to branch into a first optical path and a second optical path, a first beam condenser that focuses the laser beam having been introduced to the first optical path, and a second beam condenser that focuses the laser beam having been introduced to the second optical path. The laser beam irradiation unit further includes a second splitting unit on the first optical path between the first splitting unit and the first beam condenser that splits the laser beam into at least two laser beams, and a laser beam scanning unit on the second optical path between the first splitting unit and the second beam condenser that executes scanning with the laser beam and introduces the laser beam to the second beam condenser.

The present invention relates to a chamfered silicon carbide substrate which is essentially monocrystalline, and to a corresponding method of chamfering a silicon carbide substrate. A silicon carbide substrate according to the invention comprises a main surface (102), wherein an orientation of said main surface (102) is such that a normal vector ({right arrow over (O)}) of the main surface (102) includes a tilt angle with a normal vector ({right arrow over (N)}) of a basal lattice plane (106) of the substrate, and a chamfered peripheral region (110), wherein a surface of the chamfered peripheral region includes a bevel angle with said main surface, wherein said bevel angle is chosen so that, in more than 75% of the peripheral region, normal vectors ({right arrow over (F)}_i) of the chamfered peripheral region (110) differ from the normal vector of the basal lattice plane by less than a difference between the normal vector of the main surface and the normal vector of the basal lattice plane of the substrate.

Embodiments of the present disclosure provide a display substrate motherboard and a manufacturing method and a cutting method thereof, a display substrate and a display device. The display substrate motherboard includes a preset cutting position, a back film and an adhesive layer disposed on the back film, the adhesive layer includes: a first adhesive layer corresponding to the preset cutting position; a second adhesive layer disposed on two sides of the first adhesive layer in a direction parallel to the back film; and a first light blocking layer disposed between the first adhesive layer and the second adhesive layer, wherein the first light blocking layer is configured to reduce light entering the second adhesive layer through the first light blocking layer after being incident from the first adhesive layer.

Embodiments of the present disclosure provide a display substrate motherboard and a manufacturing method and a cutting method thereof, a display substrate and a display device. The display substrate motherboard includes a preset cutting position, a back film and an adhesive layer disposed on the back film, the adhesive layer includes: a first adhesive layer corresponding to the preset cutting position; a second adhesive layer disposed on two sides of the first adhesive layer in a direction parallel to the back film; and a first light blocking layer disposed between the first adhesive layer and the second adhesive layer, wherein the first light blocking layer is configured to reduce light entering the second adhesive layer through the first light blocking layer after being incident from the first adhesive layer.

An electromagnetic radiation system (100) for directing an electromagnetic radiation beam at a target (130). The electromagnetic radiation system comprises an electromagnetic radiation source (110) for providing the electromagnetic radiation beam, a head (120) for projecting the electromagnetic radiation beam on to the target (130); and an umbilical assembly (140) connecting the electromagnetic radiation source (110) to the head (120) and configured to transmit the electromagnetic radiation beam to the head. The electromagnetic radiation system further comprises an optical isolator (150) positioned between the electromagnetic radiation source (110) and the umbilical assembly (140).

A machine arrangement for manufacturing sheet metal includes a workpiece carrier configured to store a sheet metal workpiece and/or a sheet metal manufacturing product, and three spatially separate functional units. The functional units include two manufacturing units and a secondary functional unit. Each manufacturing unit includes a manufacturing apparatus that has a work area. The workpiece carrier is arrangeable in the work area in a manufacturing position. The secondary functional unit has a functional area. The workpiece carrier is arrangeable in the functional area in a functional position. The machine arrangement further includes a transporting unit movable in a driven manner together with the workpiece carrier between the functional units, thereby enabling the workpiece carrier to be transferred between the functional units. The workpiece carrier is a universal workpiece carrier arrangeable at the two manufacturing units in the manufacturing position and at the secondary functional unit in the functional position.

A machine arrangement for manufacturing sheet metal includes a workpiece carrier configured to store a sheet metal workpiece and/or a sheet metal manufacturing product, and three spatially separate functional units. The functional units include two manufacturing units and a secondary functional unit. Each manufacturing unit includes a manufacturing apparatus that has a work area. The workpiece carrier is arrangeable in the work area in a manufacturing position. The secondary functional unit has a functional area. The workpiece carrier is arrangeable in the functional area in a functional position. The machine arrangement further includes a transporting unit movable in a driven manner together with the workpiece carrier between the functional units, thereby enabling the workpiece carrier to be transferred between the functional units. The workpiece carrier is a universal workpiece carrier arrangeable at the two manufacturing units in the manufacturing position and at the secondary functional unit in the functional position.

Discussed is an electrode manufacturing method, in which laser ablation is performed prior to cutting an electrode sheet so that a processing speed of cutting the electrode sheet by using laser is increased, and an electrode forming device for performing same.

Discussed is an electrode manufacturing method, in which laser ablation is performed prior to cutting an electrode sheet so that a processing speed of cutting the electrode sheet by using laser is increased, and an electrode forming device for performing same.