Energy is locally supplied to a cutting surface that is formed in an outer circumferential region of a wafer in a trimming step, before a grinding step of grinding the wafer. This can remove or repair at least part of a damage layer formed in the outer circumferential region of the wafer due to the trimming step. As a result, breakage of the wafer that originates from the outer circumferential region in the grinding of the wafer which has been subjected to the edge trimming and generation of dust in a step after this grinding can be suppressed.

Energy is locally supplied to a cutting surface that is formed in an outer circumferential region of a wafer in a trimming step, before a grinding step of grinding the wafer. This can remove or repair at least part of a damage layer formed in the outer circumferential region of the wafer due to the trimming step. As a result, breakage of the wafer that originates from the outer circumferential region in the grinding of the wafer which has been subjected to the edge trimming and generation of dust in a step after this grinding can be suppressed.

In order to cut a plurality of clumps having an approximately uniform shapes and approximately uniform dimensions out of a cell aggregate which has proliferated and appropriately eliminate contamination with fragments of different shapes or dimensions, when cutting the clumps of approximately uniform shape out of the cell aggregate which has proliferated, cutting lines along which the clumps of a specific shape are cut out are set such that the area of a peripheral part of the cell aggregate which is not cut by the cutting line exceeds the surface area of one of the clumps, and the cell aggregate is cut by irradiating with laser light in such a way as to trace the cutting lines.

In order to cut a plurality of clumps having an approximately uniform shapes and approximately uniform dimensions out of a cell aggregate which has proliferated and appropriately eliminate contamination with fragments of different shapes or dimensions, when cutting the clumps of approximately uniform shape out of the cell aggregate which has proliferated, cutting lines along which the clumps of a specific shape are cut out are set such that the area of a peripheral part of the cell aggregate which is not cut by the cutting line exceeds the surface area of one of the clumps, and the cell aggregate is cut by irradiating with laser light in such a way as to trace the cutting lines.

An apparatus and method of improving the stability and repeatability of the laser cutting of an RFID antenna is disclosed. The present invention provides direct feedback from an optical inspection of the cutting process to the control system to determine the shape of the RFID antennas that are being cut and compare the same to the desired RFID antenna shape or pattern. When appropriate, the present invention enables a user to employ both short term and long term feedback data to make modifications to the laser cutting process to improve the same and reduce waste.

An apparatus and method of improving the stability and repeatability of the laser cutting of an RFID antenna is disclosed. The present invention provides direct feedback from an optical inspection of the cutting process to the control system to determine the shape of the RFID antennas that are being cut and compare the same to the desired RFID antenna shape or pattern. When appropriate, the present invention enables a user to employ both short term and long term feedback data to make modifications to the laser cutting process to improve the same and reduce waste.

A method of manufacturing an electronic apparatus includes: providing a work substrate including a preliminary set module including an active area including a hole formation area; and a protective film covering at least one of an upper surface and a rear surface of the preliminary set module; radiating the laser beam to the work substrate from a first start point toward a moving path removing at least a portion of the work substrate to form a first start cutting line in the hole formation area, the moving path of the laser beam defined as a boundary between the hole formation area and the active area; radiating the laser beam along the moving path; and removing the hole formation area from the preliminary set module to form a module hole, wherein the first start cutting line forms a predetermined angle with respect to a tangential line of the moving path.

A method of manufacturing an electronic apparatus includes: providing a work substrate including a preliminary set module including an active area including a hole formation area; and a protective film covering at least one of an upper surface and a rear surface of the preliminary set module; radiating the laser beam to the work substrate from a first start point toward a moving path removing at least a portion of the work substrate to form a first start cutting line in the hole formation area, the moving path of the laser beam defined as a boundary between the hole formation area and the active area; radiating the laser beam along the moving path; and removing the hole formation area from the preliminary set module to form a module hole, wherein the first start cutting line forms a predetermined angle with respect to a tangential line of the moving path.

A support device (10) includes a substrate receiving region. The support device (10) includes a support body (110) shaped as a pattern having an array of openings (130). The support body (110) is a sparse structure wherein a joint area of the openings of the array of openings (130) is 40% or more of the area of the substrate receiving region. The support body (110) includes one or more suction openings (140) configured to be in fluid communication with a vacuum source arrangement.

A support device (10) includes a substrate receiving region. The support device (10) includes a support body (110) shaped as a pattern having an array of openings (130). The support body (110) is a sparse structure wherein a joint area of the openings of the array of openings (130) is 40% or more of the area of the substrate receiving region. The support body (110) includes one or more suction openings (140) configured to be in fluid communication with a vacuum source arrangement.