There is provided a laser processing apparatus that processes a workpiece by irradiation with a laser beam. The laser processing apparatus includes a holding unit including a holding surface that holds the workpiece and a laser irradiation unit that irradiates the workpiece held by the holding unit with the laser beam. The laser irradiation unit includes a laser oscillator, a collecting lens that focuses the laser beam emitted from the laser oscillator, and a foreign matter adhesion preventing unit that prevents adhesion of a foreign matter to the collecting lens.

A laser cut-and-machined product made from a plated steel plate. A cut face of the plated steel plate is coated with plating-layer-containing metal of a top surface of the plated steel plate that is melted and/or evaporated at the time of laser cutting and machining.

A laser cut-and-machined product made from a plated steel plate. A cut face of the plated steel plate is coated with plating-layer-containing metal of a top surface of the plated steel plate that is melted and/or evaporated at the time of laser cutting and machining.

Aspects of the invention may be directed to a method of creating a predetermined structure from a diamond bulk. In some embodiments, the method may include: irradiating the diamond bulk with at least one laser having a focal point at a predetermined location, the laser may create graphitization at locations where the focal point of the laser engages the diamond bulk; at least one of: moving the diamond bulk to be positioned with the focal point of the laser within the diamond bulk, and moving the at least one laser such that diamond bulk be positioned with the focal point of the laser, along at least one axis wherein the movement corresponds to a predefined scheme; removing of the graphite from the diamond bulk; and extracting the predetermined structure from the diamond bulk.

Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

A desktop laser cutter configured to cut a cylindrical workpiece includes a laser, a cutting head that receives an electromagnetic beam from the laser and emits a cutting beam, and a gantry that supports the cutting head relative to a base plate of the laser cutter housing. The gantry can be actuated to move the cutting head within a plane that is parallel to the baseplate. The cutting head emits the cutting beam in a direction parallel to the plane. In use, the cutting head is disposed side-by-side with the workpiece and the cutting beam is applied to a side of the workpiece that faces a sidewall of the laser cutter housing. The workpiece is supported by the gantry to rotate an amount that is a function of movement of the cutting head in a direction parallel to the plane.

A method for separating integrated circuit dies from a wafer includes making at least two cutting passes with a laser along a first die street of an integrated circuit die, the first die street extending along a first axis on the wafer. The method also includes making at least two cutting passes with the laser along a second die street of the integrated circuit die, the second die street extending along a second axis on the wafer that is generally perpendicular to the first axis. In one process, three cutting passes are made with the laser alternatingly along the first and second die streets to separate the integrated die circuit along the first and second axes. In another process, two cutting passes are made with the laser along the first die street in opposite directions, and two cutting passes are then made with the laser along the second die street in opposite directions.

Method for producing a precoated steel blank including the successive steps of: —providing a precoated steel strip including a steel substrate having, on at least one of its main faces, a precoating, the precoating including an intermetallic alloy layer and a metallic layer extending atop said intermetallic alloy layer, the metallic layer being a layer of aluminum, a layer of aluminum alloy or a layer of aluminum-based alloy, —laser cutting the precoated steel strip in order to obtain at least one precoated steel blank, the precoated steel blank including a laser cut edge surface resulting from the laser cutting operation, the laser cut edge surface including a substrate portion and a precoating portion, wherein the laser cutting is carried out in such a way that the substrate portion of the laser cut edge directly resulting from the cutting operation has an oxygen content greater than or equal to 15% in weight.

Method for producing a precoated steel blank including the successive steps of: —providing a precoated steel strip including a steel substrate having, on at least one of its main faces, a precoating, the precoating including an intermetallic alloy layer and a metallic layer extending atop said intermetallic alloy layer, the metallic layer being a layer of aluminum, a layer of aluminum alloy or a layer of aluminum-based alloy, —laser cutting the precoated steel strip in order to obtain at least one precoated steel blank, the precoated steel blank including a laser cut edge surface resulting from the laser cutting operation, the laser cut edge surface including a substrate portion and a precoating portion, wherein the laser cutting is carried out in such a way that the substrate portion of the laser cut edge directly resulting from the cutting operation has an oxygen content greater than or equal to 15% in weight.