B23K26/38

Machining condition adjustment apparatus and machine learning device
11554448 · 2023-01-17 · ·

Disclosed is a machine learning device of a cutting condition adjustment apparatus including: a state observation section that observes, as state variables indicating a current state of an environment, cutting condition data indicating a laser cutting condition for a laser cutting and oblique rearward temperature rise data indicating a temperature rise value at an oblique rearward part of a cutting front of a workpiece, a determination data acquisition unit that acquires temperature rise value determination data for determining propriety of the temperature rise value during cutting based on the laser cutting condition for the laser cutting as determination data indicating a propriety determination result of the cutting of the workpiece, and a learning unit that learns the temperature rise value and adjustment of the laser cutting condition for the laser cutting in association with each other using the state variables and the determination data.

Machining condition adjustment apparatus and machine learning device
11554448 · 2023-01-17 · ·

Disclosed is a machine learning device of a cutting condition adjustment apparatus including: a state observation section that observes, as state variables indicating a current state of an environment, cutting condition data indicating a laser cutting condition for a laser cutting and oblique rearward temperature rise data indicating a temperature rise value at an oblique rearward part of a cutting front of a workpiece, a determination data acquisition unit that acquires temperature rise value determination data for determining propriety of the temperature rise value during cutting based on the laser cutting condition for the laser cutting as determination data indicating a propriety determination result of the cutting of the workpiece, and a learning unit that learns the temperature rise value and adjustment of the laser cutting condition for the laser cutting in association with each other using the state variables and the determination data.

LASER CUTTING APPARATUS

A laser cutting apparatus includes a lower jig configured to support a lower portion of a first side of a cutting region of an object to be cut by a laser beam, an upper jig configured to support an upper portion of the first side of the cutting region of the object, a laser nozzle configured to emit the laser beam towards the cutting region of the object, and a spatter block jig locatable between a body part of the object and the cutting region of the object.

LASER CUTTING APPARATUS

A laser cutting apparatus includes a lower jig configured to support a lower portion of a first side of a cutting region of an object to be cut by a laser beam, an upper jig configured to support an upper portion of the first side of the cutting region of the object, a laser nozzle configured to emit the laser beam towards the cutting region of the object, and a spatter block jig locatable between a body part of the object and the cutting region of the object.

LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS

A laser processing method of laser processing a workpiece made of at least one sheet of metallic foil includes: generating laser light by supplying pulsed pumping energy to a laser medium, the laser light including an optical pulse component and a continuous light component that is continuous with the optical pulse component and temporally after the optical pulse component; irradiating a surface of the workpiece with the laser light; and limiting duration of the continuous light component such that a ratio of energy of the continuous light component to energy of the optical pulse component is equal to or less than a predetermined value.

METHOD AND APPARATUS OF FORMING ELECTRODE PLATE

Disclosed is method and device for forming an electrode plate. The method includes: performing tab cutting on a substrate so that the substrate forms a body portion, an edge portion connecting to the body portion, and a plurality of tabs that connect to the body portion but are separated from the edge portion; and performing edge portion cutting on the substrate to separate the edge portion from the body portion. The electrode plate is formed in two steps. First, the tab and the edge portion are separated, so that in the process of cutting, impact of vibration of the edge portion on the tab is small, greatly reducing the risk of deformation of the tab caused by vibration of the edge portion and damage to the tab caused by being pulled by the edge portion. Second, edge portion cutting separates the edge portion from the body portion.

METHOD AND APPARATUS OF FORMING ELECTRODE PLATE

Disclosed is method and device for forming an electrode plate. The method includes: performing tab cutting on a substrate so that the substrate forms a body portion, an edge portion connecting to the body portion, and a plurality of tabs that connect to the body portion but are separated from the edge portion; and performing edge portion cutting on the substrate to separate the edge portion from the body portion. The electrode plate is formed in two steps. First, the tab and the edge portion are separated, so that in the process of cutting, impact of vibration of the edge portion on the tab is small, greatly reducing the risk of deformation of the tab caused by vibration of the edge portion and damage to the tab caused by being pulled by the edge portion. Second, edge portion cutting separates the edge portion from the body portion.

WATERJET-GUIDED LASER MACHINE WITH INLINE OPTICAL FEEDBACK CONTROL

A waterjet-guided laser machine includes a laser source, an LED, a waterjet head, and a light sensor. The waterjet head includes a water inlet and a nozzle having an outlet for a discharging a waterjet. There is a laser optical path along which a pulsed laser beam travels to the nozzle outlet. There is also a light beam optical delivery path along which the light beam travels from the LED to the nozzle outlet. The light beam optical delivery path is coincident with the laser optical path in the nozzle. There is a light beam optical return path along which the light beam that is reflected off of a workpiece travels to the light sensor. The light beam optical return path is coincident with the laser optical path inside the nozzle and coincident with the light beam optical delivery path inside the nozzle.

Product Unpackaging System
20230219708 · 2023-07-13 · ·

The present invention describes an automated product unpackaging system that manipulates a target container containing product into an unpackaging work cell area, moves the target container into and through a desired path within the work cell in such a way that lasers or other industrial cutters can cut through the original packaging material so that the package's bottom surface is completely separated from the top and sides of the original package, and then moves the top and sides of the original package, with its product still encapsulated inside, slidingly onward toward a next operation. The invention also describes means for extraction and disposal of the top and sides of the original package, along with the separated bottom of the original package.

Laser machining apparatus and laser machining method

A beam vibrating mechanism vibrates a laser beam in a parallel direction with a cutting advancing direction of a sheet metal. An amplitude amount of the laser beam is Qx, a radius of a first circular region having an area occupying 86% beam energy at a center side of total beam energy in a sectional area of the laser beam on a top surface of the sheet metal is rtop, and a radius of a second circular region having an area occupying 86% beam energy at a center side of total beam energy in a sectional area of the laser beam in a bottom surface of the sheet metal is rbottom. A calculation value Va is expressed by the expression: Va=(Qx+rtop+√{square root over (2)}×rbottom). When a standard deviation of the calculation value Va at a time of cutting sheet metals of a plurality of plate thicknesses is Vasd, a nozzle having a diameter of an opening between a minimum value obtained by 2Va−Vasd, and a maximum value obtained by 2.5 Va+Vasd is used as a nozzle attached to a machining head.