The present disclosure discloses a laser cutting method, which relates to the technical field of laser cutting. The laser cutting method first removes the active material on the surface of a preset position of a to-be-cut part; and then performs the laser cutting on the to-be-cut part at the preset position to cut off the to-be-cut part. Compared with the prior art, since the laser cutting method provided by the present disclosure performs the step of removing the active material on the surface of the preset position of the to-be-cut part, the quality of the to-be-cut part can be guaranteed, the occurrence of material splashing can be avoided, the steps are simple, and the cutting efficiency is higher.

The present disclosure discloses a laser cutting method, which relates to the technical field of laser cutting. The laser cutting method first removes the active material on the surface of a preset position of a to-be-cut part; and then performs the laser cutting on the to-be-cut part at the preset position to cut off the to-be-cut part. Compared with the prior art, since the laser cutting method provided by the present disclosure performs the step of removing the active material on the surface of the preset position of the to-be-cut part, the quality of the to-be-cut part can be guaranteed, the occurrence of material splashing can be avoided, the steps are simple, and the cutting efficiency is higher.

An element chip manufacturing method includes a step of preparing a substrate including a semiconductor layer and a wiring layer formed on the semiconductor layer, the substrate having element regions and a dicing region defining the element regions, a laser grooving step of irradiating a laser beam to the wiring layer at the dicing region, to form an aperture exposing the semiconductor layer, and a step of etching the semiconductor layer exposed from the aperture, with plasma, to divide the substrate into a plurality of element chips. The laser grooving step includes a step of irradiating a first laser beam having a first pulse width, to remove the wiring layer in an edge portion of the dicing region, and a step of irradiating a second laser beam having a second pulse width which is longer than the first pulse width, to remove the wiring layer inside from the edge portion.

An element chip manufacturing method includes a step of preparing a substrate including a semiconductor layer and a wiring layer formed on the semiconductor layer, the substrate having element regions and a dicing region defining the element regions, a laser grooving step of irradiating a laser beam to the wiring layer at the dicing region, to form an aperture exposing the semiconductor layer, and a step of etching the semiconductor layer exposed from the aperture, with plasma, to divide the substrate into a plurality of element chips. The laser grooving step includes a step of irradiating a first laser beam having a first pulse width, to remove the wiring layer in an edge portion of the dicing region, and a step of irradiating a second laser beam having a second pulse width which is longer than the first pulse width, to remove the wiring layer inside from the edge portion.

A mask includes a mask sheet including an upper surface and a lower surface facing the upper surface, the mask sheet including an opening passing through the upper surface and the lower surface; and a mask frame that supports the mask sheet, the mask sheet includes a protrusion adjacent to the opening and protruding from the lower surface, and a recess adjacent to the protrusion and recessed from the lower surface toward the upper surface of the mask sheet.

An article includes a ceramic material and features a machined surface that is characteristic of cold ablation laser machining, and the machined surface exhibits no visible oxidation. A laser machining apparatus and technique is based on cold-ablation, but is modified or augmented with an inert assist gas to minimize deleterious surface modifications and mitigate oxide formation associated with laser machining.

An article includes a ceramic material and features a machined surface that is characteristic of cold ablation laser machining, and the machined surface exhibits no visible oxidation. A laser machining apparatus and technique is based on cold-ablation, but is modified or augmented with an inert assist gas to minimize deleterious surface modifications and mitigate oxide formation associated with laser machining.

A system and method is disclosed for forming a graded index (GRIN) on a substrate. In one implementation the method may involve applying a metal layer to the substrate. A fluence profile of optical energy applied to the metal layer may be controlled to substantially ablate the metal layer to create a vaporized metal layer. The fluence profile may be further controlled to control a size of metal nanoparticles created from the vaporized metal layer as the vaporized metal layer condenses and forms metal nanoparticles, the metal nanoparticles being deposited back on the substrate to form a GRIN surface on the substrate.

A process of repairing a component includes identifying a void in a component; determining at least one approximate physical configuration of the void; inserting borescope into the component in order to view the void; providing a repair rod approximately equivalent to at least one of the least one approximate physical configuration of the void; inserting the repair rod into component; confirming insertion of the repair rod in the void; separating the repair rod to leave a repair plug in the void; and depositing braze paste over the repair plug in the void.

A fixture assembly for supporting a plurality of blanks during a shearing and welding operation. The fixture assembly includes a base frame. A rotating frame is rotatably connected to the base frame. A fixed block is fixed to the rotating frame for supporting a first blank. A moveable block is moveably connected to the rotating frame for supporting a second blank. A first clamp is provided for coupling the first blank to the fixed block. A second clamp is provided for coupling the second blank to the moveable block. A vertical actuator is coupled with the rotating frame and configured to move the moveable block in a vertical direction being perpendicular to a plane of the rotating frame for moving the second blank. A horizontal actuator is coupled with the rotating frame and configured to move the moveable block in a horizontal direction.