Patent classifications
B23K26/53
PROCESSING METHOD
A processing method includes a holding step of holding a workpiece by a chuck table including a holding surface that holds the workpiece in an upper surface and a sheet covering step of covering the upper surface of the chuck table in addition to the workpiece by a sheet having transmissibility. The processing method also includes a close contact step of generating a suction force for the holding surface of the chuck table and reducing the pressure on a region covered by the sheet to bring the workpiece into close contact with the upper surface of the chuck table by an atmospheric pressure applied to the sheet and a modified layer forming step of positioning the focal point of a laser beam inside the workpiece through the sheet and irradiating the workpiece with the laser beam to form a modified layer.
PROCESSING METHOD
A processing method includes a holding step of holding a workpiece by a chuck table including a holding surface that holds the workpiece in an upper surface and a sheet covering step of covering the upper surface of the chuck table in addition to the workpiece by a sheet having transmissibility. The processing method also includes a close contact step of generating a suction force for the holding surface of the chuck table and reducing the pressure on a region covered by the sheet to bring the workpiece into close contact with the upper surface of the chuck table by an atmospheric pressure applied to the sheet and a modified layer forming step of positioning the focal point of a laser beam inside the workpiece through the sheet and irradiating the workpiece with the laser beam to form a modified layer.
Joint body of different materials and method for manufacturing the same
The present specification relates to a joint body of different materials, and a method of manufacturing the same. The joint body includes a metal layer; and a resin layer provided on and in contact with one surface of the metal layer. The metal layer comprises two or more etching grooves and two or more burrs provided on a surface of the metal layer adjacent to the etching grooves.
Joint body of different materials and method for manufacturing the same
The present specification relates to a joint body of different materials, and a method of manufacturing the same. The joint body includes a metal layer; and a resin layer provided on and in contact with one surface of the metal layer. The metal layer comprises two or more etching grooves and two or more burrs provided on a surface of the metal layer adjacent to the etching grooves.
Strengthened glass articles with separation features
A method of forming a strengthened glass article is provided. The method includes providing a strengthened glass article. The strengthened glass article is in the form of a container including a sidewall having an exterior surface and an interior surface that encloses an interior volume. The sidewall has an exterior strengthened surface layer that includes the exterior surface, an interior strengthened surface layer that includes the interior surface and a central layer between the exterior strengthened surface layer and the interior strengthened surface layer that is under a tensile stress. A laser-induced intended line of separation is formed in the central layer at a predetermined depth between the exterior strengthened surface layer and the interior strengthened surface layer by irradiating the sidewall with a laser without separating the glass article.
WALL-COOLED GAS-INLET ELEMENT FOR A CVD REACTOR
A gas inlet element for a CVD reactor includes a cylindrical main body, which together with an outer wall, forms a gas outlet face. The outer wall surrounds at least one gas distribution chamber. A plurality of gas outlet openings originating in the gas distribution chamber open out into the gas outlet face. A cooling device includes a plurality of cooling channels running adjacently but separately in the outer wall, and the gas outlet openings extend between the cooling channels.
PROCESSING METHOD AND PROCESSING APPARATUS FOR INGOT
An ingot is processed by applying exciting light, and detecting fluorescence occurring from an upper surface of the ingot. A distribution of the number of photons of the fluorescence on the upper surface of the ingot is stored as two-dimensional data in association with XY coordinate positions, and a Z-coordinate position at which the two-dimensional data is obtained is also stored. A laser beam forms a peeling layer by irradiating the ingot while positioning the condensing point of the laser beam at a depth corresponding to the thickness of a wafer from the upper surface of the ingot. A wafer is separated from the ingot with the peeling layer as a starting point, and three-dimensional data is generated representing the distribution of the number of photons of the fluorescence in the whole of the ingot on the basis of two-dimensional data at each Z-coordinate position of the ingot.
SOLDER TRANSFER INTEGRATED CIRCUIT PACKAGING
An approach for transferring solder to a laminate structure in IC (integrated circuit) packaging is disclosed. The approach comprises of a device and method of applying the device. The device comprises of a substrate, a laser ablation layer and solder layer. The device is made by depositing a laser ablation layer onto a glass/silicon substrate and plenty of solder powder/solder pillar is further deposited onto the laser ablation layer. The laminate packaging substrate includes pads with a pad surface finishing layer made from gold. The solder layer of the device is bonded to the laminate packaging substrate. Once bonded, using laser to irradiate the laser ablation layer, the substrate is removed from the laminate.
Method for producing a detachment area in a solid body
A method for producing a detachment area in a solid body in described. The solid body has a crystal lattice and is at least partially transparent to laser beams emitted by a laser. The method includes: modifying the crystal lattice of the solid by a laser beam, wherein the laser beam penetrates through a main surface of a detachable solid portion of the solid body, wherein a plurality of modifications are produced in the crystal lattice, wherein the modification are formed in a plane parallel to the main surface and at a distance from one another, wherein as a result of the modifications, the crystal lattice cracks the regions surrounding the modifications sub-critically in at least the one portion, and wherein the subcritical cracks are arranged in a plane parallel to the main surface.
Method for producing a detachment area in a solid body
A method for producing a detachment area in a solid body in described. The solid body has a crystal lattice and is at least partially transparent to laser beams emitted by a laser. The method includes: modifying the crystal lattice of the solid by a laser beam, wherein the laser beam penetrates through a main surface of a detachable solid portion of the solid body, wherein a plurality of modifications are produced in the crystal lattice, wherein the modification are formed in a plane parallel to the main surface and at a distance from one another, wherein as a result of the modifications, the crystal lattice cracks the regions surrounding the modifications sub-critically in at least the one portion, and wherein the subcritical cracks are arranged in a plane parallel to the main surface.