A glass plate production method includes (1) preparing a glass material having a first main surface and a second main surface opposite to each other; (2) irradiating the first main surface of the glass material with a laser to form an in-plane void region having a plurality of voids arranged on the first main surface, and forming a plurality of internal void rows each having one void or two or more voids arranged from the in-plane void region toward the second main surface of the glass material; and (3) chemically strengthening the glass material having the internal void rows formed therein.

An apparatus and method regarding forming a cooling hole in a component for a turbine engine, with the component held in a hole-forming machine with a laser carried on a multi-axis carriage and defining an optical path, the method comprising forming a set of cooling holes in the component with a laser mounted to the multi-axis carriage, estimating a total airflow through the set of cooling holes based on a set of data regarding the flow effectiveness of the set of cooling holes, and forming a second set of cooling holes with the laser.

Separation lines are formed in a glass plate having first and second main surfaces by irradiating with laser light. The separation lines are configured of a product line corresponding to an outline of a glass article to be separated from the glass plate; and a release line. The product line includes a first in-plane void array configured of in-plane voids arranged on the first main surface. A maximum distance between centers of the adjacent in-plane voids arranged on the first main surface falls within a range of 1 m to 10 m. The release line includes internal void arrays for release line, which are arranged along lines connecting the first and second main surfaces, respectively. A maximum distance between centers of the adjacent points, at which extension lines extended from the internal void arrays for release line cross the first main surface, is greater than 10 m.

Implementations of methods of forming a plurality of semiconductor die may include forming a damage layer beneath a surface of a die street in a semiconductor substrate, singulating the semiconductor substrate along the die street into a plurality of semiconductor die, and removing one or more particulates in the die street after singulating through applying sonic energy to the plurality of semiconductor die.

A method including the steps of exposing a substrate to focused laser irradiation at a preselected series of locations that trace a subset of the substrate volume that is connected to the surface of the substrate, removing the substrate material from the exposed preselected series of locations to create within the substrate at least one cavity that is connected to the surface of the substrate, immersing the cavity-containing substrate in an appropriate atmosphere such as a selected gas or vacuum and, within this atmosphere, contacting the substrate surface with the molten castable material surface at locations where the cavity or cavities emerges from the substrate, applying pressure to the castable material to cause it to infiltrate the substrate cavities, and solidifying the castable material within the cavities.

A method including the steps of exposing a substrate to focused laser irradiation at a preselected series of locations that trace a subset of the substrate volume that is connected to the surface of the substrate, removing the substrate material from the exposed preselected series of locations to create within the substrate at least one cavity that is connected to the surface of the substrate, immersing the cavity-containing substrate in an appropriate atmosphere such as a selected gas or vacuum and, within this atmosphere, contacting the substrate surface with the molten castable material surface at locations where the cavity or cavities emerges from the substrate, applying pressure to the castable material to cause it to infiltrate the substrate cavities, and solidifying the castable material within the cavities.

A substrate having a first surface with at least one division line and an opposite second surface is processed by attaching a protective sheeting to the first surface and applying a laser beam to the protective sheeting to form a plurality of alignment marks in the protective sheeting. The substrate has a backside layer on the second surface. A laser beam is applied to the substrate from the side of the first surface. The substrate is transparent to the laser beam and the focal point of the laser beam is located inside the substrate which is closer to the second surface than to the first surface, to form a plurality of alignment marks in the backside layer. Substrate material is removed along the division line from the side of the second surface. The alignment marks are used for aligning the substrate material removing means relative to the division line.

A method for processing a transparent workpiece includes forming a closed contour in the transparent workpiece. The closed contour includes a plurality of defects in the transparent workpiece and has a rectilinear shape. Forming the closed contour includes directing a pulsed laser beam through an aspheric optical element and into the transparent workpiece to generate an induced absorption within the transparent workpiece and produce a defect within the transparent workpiece. Forming the closed contour also includes translating the pulsed laser beam focal line along a closed contour line having the rectilinear shape, thereby laser forming the plurality of defects of the closed contour. In addition, the method for processing the transparent workpiece includes etching the transparent workpiece with a chemical etching solution to separate a portion of the transparent workpiece along the closed contour, thereby forming an aperture extending through the transparent workpiece.

A method for laser processing a laminate workpiece stack includes forming a contour line in a first transparent workpiece of the laminate workpiece stack having a resin layer disposed between the first transparent workpiece and a second transparent workpiece. Forming the contour line includes focusing a pulsed laser beam into a pulsed laser beam focal line directed into the first transparent workpiece to generate an induced absorption within the first transparent workpiece and translating the pulsed laser beam focal line along a first workpiece separation line, thereby laser forming the contour line having a plurality of defects. The method also includes separating the resin layer along a resin separation line by focusing the pulsed laser beam into the pulsed laser beam focal line directed into the resin layer and translating the pulsed laser beam focal line along the resin separation line, thereby laser ablating the resin layer.

A method for laser processing a laminate workpiece stack includes forming a contour line in a first transparent workpiece of the laminate workpiece stack having a resin layer disposed between the first transparent workpiece and a second transparent workpiece. Forming the contour line includes focusing a pulsed laser beam into a pulsed laser beam focal line directed into the first transparent workpiece to generate an induced absorption within the first transparent workpiece and translating the pulsed laser beam focal line along a first workpiece separation line, thereby laser forming the contour line having a plurality of defects. The method also includes separating the resin layer along a resin separation line by focusing the pulsed laser beam into the pulsed laser beam focal line directed into the resin layer and translating the pulsed laser beam focal line along the resin separation line, thereby laser ablating the resin layer.