Provided is a connector apparatus including: a circuit board; a connector; and a mold resin portion, wherein the circuit board includes a conductor path, the connector includes a housing with a cylindrical shape and made of a resin, and a terminal projecting outward in an axial direction of the housing from inside the housing, the terminal being configured to connect to the conductor path, the mold resin portion collectively covers the circuit board, the terminal located outside the housing, and a portion of the housing; the housing and the mold resin portion include a welded portion formed by welding together constituent materials of the housing and the mold resin portion, and the welded portion is provided around an entire periphery of the housing and has a difference between a maximum width and a minimum width along a circumferential direction of the housing of 30% or less of the maximum width.

There is provided a processing method of a workpiece including a necessary region and an unnecessary region. The processing method includes a protective wall forming step of irradiating a region that defines the boundary between the necessary region and the unnecessary region with a laser beam with a wavelength that has transmissibility with respect to the workpiece and forming a plurality of shield tunnels composed of a fine pore and a modified tube that surrounds the fine pore, thereby forming a protective wall, and an unnecessary region removal step of removing the unnecessary region after executing the protective wall forming step.

There is provided a processing method of a workpiece including a necessary region and an unnecessary region. The processing method includes a protective wall forming step of irradiating a region that defines the boundary between the necessary region and the unnecessary region with a laser beam with a wavelength that has transmissibility with respect to the workpiece and forming a plurality of shield tunnels composed of a fine pore and a modified tube that surrounds the fine pore, thereby forming a protective wall, and an unnecessary region removal step of removing the unnecessary region after executing the protective wall forming step.

The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (<1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The focal line is directed into the glass composite workpiece, generating induced absorption within the material. The workpiece and the laser beam are translated relative to each other to form a plurality of defect lines along a contour, with adjacent defect lines have a spacing of 0.1-20 microns.

A laser ablation apparatus includes: a laser beam generator including beam sources for generating laser beams, the laser beam generator using a solid-state laser; an output beam generator for generating an output beam using the laser beams; and a substrate stage including at least one stage on which a carrier substrate formed on the front of a panel substrate is disposed. The output beam generator may include: mixers for generating mixed laser beams having two linear-polarizations orthogonal to each other by mixing the laser beams; and a photo molding machine for generating the output beam using the mixed laser beams.

The present invention relates to a method for forming an amorphous layer on one surface of a second substrate through a simple method of performing laser irradiation on a multilayered metal layer provided on a first substrate.

The present invention relates to a method for forming an amorphous layer on one surface of a second substrate through a simple method of performing laser irradiation on a multilayered metal layer provided on a first substrate.

A flexible board is disclosed. The flexible board comprises a flexible baseplate, a scattering structure that is arranged on at least one surface of the flexible baseplate, a buffer layer that is arranged at one side of the scattering structure far from the flexible baseplate, and an active layer that is arranged at one side of the buffer layer far from the flexible baseplate. The flexible board according to the present disclosure has an apparent advantage in protecting the active layer.

A method for joining two joining partners includes applying a coating to at least one of the two joining partners so as to be arranged between the two joining partners before joining and joining the at least two joining partners to one another using ultrashort laser pulses of a laser beam of an ultrashort pulse laser. At least one joining partner is substantially transparent to the ultrashort laser pulses of the ultrashort pulse laser, and the coating comprises physical properties similar to at least one joining partner and/or a chemical constituent similar to at least one joining partner.

A method for joining two joining partners includes applying a coating to at least one of the two joining partners so as to be arranged between the two joining partners before joining and joining the at least two joining partners to one another using ultrashort laser pulses of a laser beam of an ultrashort pulse laser. At least one joining partner is substantially transparent to the ultrashort laser pulses of the ultrashort pulse laser, and the coating comprises physical properties similar to at least one joining partner and/or a chemical constituent similar to at least one joining partner.