A device for positioning at least two joining parts during a welding process includes a support element. The support element has a surface on which for the joining parts are positioned, a recess under the joining parts when a joining region of the joining parts are on the surface, and a fluid connection for supplying a fluid to the recess. When fluid in the recess is pressurized, during a welding process to connect the joining parts a weld melt is supported by the positive pressure.

An orientation and guide mechanism for a welding system includes a pair of opposed guide members. A weld wire having a non-round cross-section is fed through a guide passageway formed between the guide members, each of which have recessed channels that combine to define the guide passageway. The guide passageway has a non-round shape corresponding to the non-round shape of the wire. The orientation mechanism and the guide members thereof is adjustable relative to a welding device of the weld system, such that the orientation of the wire can be controlled and maintained by adjusting the orientation mechanism. The wide side of the wire may be adjusted to be presented to a radiant energy source, and/or the non-round wire may be adjusted relative to the desired weld seam.

A processing method includes a holding step of holding a workpiece by a chuck table including a holding surface that holds the workpiece in an upper surface and a sheet covering step of covering the upper surface of the chuck table in addition to the workpiece by a sheet having transmissibility. The processing method also includes a close contact step of generating a suction force for the holding surface of the chuck table and reducing the pressure on a region covered by the sheet to bring the workpiece into close contact with the upper surface of the chuck table by an atmospheric pressure applied to the sheet and a modified layer forming step of positioning the focal point of a laser beam inside the workpiece through the sheet and irradiating the workpiece with the laser beam to form a modified layer.

A method and device for producing a predetermined breaking line in a vehicle interior trim part with a scanning laser beam. An actual position of the vehicle interior trim part held in a working plane relative to a laser scanning device is detected by a camera and the actual position of the predetermined breaking line is derived. A stored desired position for a scan figure corresponding to the predetermined breaking line is corrected to an actual position, whereby the predetermined breaking line is produced at a predetermined position on the vehicle interior trim part during scanning of the scan figure. A positional shift of the scan figure becomes possible because a sensor matrix with an upstream diffuser is used, which can detect transmitted components of the laser beam independently of the position of the laser beam along the scan figure.

Provided is a laser welding apparatus configured to weld an electrode lead of at least one secondary battery of a battery module and a main bus bar configured to electrically connect a plurality of secondary batteries to each other. The laser welding apparatus includes: a laser beam emitting unit including a laser emitting element to irradiate a laser beam to the electrode lead and the main bus bar; a pressing jig including a pressing bar configured to move in a left-and-right direction such that the electrode lead is adhered to the main bus bar; and a blocking block movable to block the laser beam generated in the laser beam emitting unit from reaching the at least one secondary battery or movable to allow the generated laser beam to pass therethrough, according to a position of the pressing bar moved in the left-and-right direction.

A method for separating and releasing a closed-form piece from a workpiece made of a brittle material is disclosed. A first pulsed laser-beam creates defects along the outline of the closed-form piece. A second laser-beam selectively heats the closed-form piece for a first time that is sufficient to initiate cracking between the defects. The heating is stopped for a period sufficiently long for the cracks to propagate completely between the defects. The second laser-beam is applied for a second time that causes melting and deformation of the closed-form piece. The deformation opens a gap between the closed-form piece and the rest of the workpiece, thereby allowing release of the closed-form piece.

A supporting device for supporting a workpiece for processing in a laser processing machine includes a base carrier having a guide body for fastening the supporting device in the laser processing machine, and a guide device provided on the base carrier for guiding the workpiece. The guiding device includes at least two guide elements, which are adjustable in distance to one another and on which the workpiece rests. The guide device has two slides, which are movable relative to the base carrier. At least one of the at least two guide elements is provided on each slide. The two slides are movable in coupled fashion, along two guides that are arranged at an angle to each other and are provided on the base carrier.

A thermal processing machine, for example, a laser processing machine includes a workpiece support table in which a workpiece to be processed is mounted. In the workpiece support table, a plurality of workpiece support members are arranged. Each workpiece support member is formed of carbon fibers in a plurality of different directions and has a long plate shape. The workpiece support member has an upper end part formed with triangular or trapezoidal protrusions. In place of the workpiece support member formed with the triangular or trapezoidal protrusions, a workpiece support member having an upper side formed in a continuous wave shape including a curve may be provided.

A laser machining apparatus includes, a processing chamber, a window disposed in a surface of the processing chamber, a substrate carrier disposed inside the processing chamber and facing the window, a laser irradiator which irradiates a laser onto the substrate carrier through the window, a protector supplier disposed on a side of the processing chamber, a protector retriever disposed on an opposite side of the processing chamber opposite to the side of the processing chamber, and a protector which connects the protector supplier with the protector retriever, where at least a portion of the protector is disposed between the substrate carrier and the window in the processing chamber.

A laser beam applying unit in a laser processing apparatus includes a laser oscillator for emitting a laser beam, a beam condenser for focusing the laser beam emitted from the laser oscillator and applying the focused laser beam to a workpiece held on a holding table, and a scanning unit that is disposed on an optical path of the laser beam between the laser oscillator and the beam condenser and that has scanning mirrors for scanning the laser beam and guiding the scanned laser beam toward the beam condenser. The scanning mirrors are housed in a chamber having a first window for allowing the laser beam emitted from the laser oscillator to pass therethrough to the scanning mirrors and a second window for allowing the laser beam scanned by the scanning mirrors to pass therethrough to the beam condenser.