A device is provided for determining an orientation of an optical device of a coherence tomograph. The device has an optical reference geometry, a deflection optics configured to direct an optical measuring beam reflected by the optical device onto the optical reference geometry, and an evaluation unit configured to determine a distance between a first reference plane and at least one second reference plane of the optical reference geometry in order to determine the orientation of the optical device.

A machining program generation device that generates a machining program for controlling a 3D printing apparatus to form an object by stacking a plurality of layers, includes: a machining route generation unit that extracts a plurality of support points that are based on an end point, an intersection point, and a bending point of the machining path from machining path data indicating a shape and a position of the machining path for forming each of the plurality of layers, and generates a machining route by adding, to the machining path, an order of shaping indicating that shaping of the support points is to be executed first and then shaping of a gap line segment connecting the plurality of support points shaped is to be executed; and a machining program generation unit that generates a machining program for controlling the 3D printing apparatus according to the machining route.

A method for comparing laser machining systems is provided, wherein a laser machining system comprises a laser machining head and a sensor module having at least one photodiode for detecting process radiation, said method comprising: detecting radiation emitted from a light source by means of the photodiode and generating a corresponding intensity signal, wherein the radiation is guided from the light source to the photodiode by at least one optical element in the laser machining head and/or by at least one optical element of the sensor module; aligning the laser machining head and the light source with one another so that the intensity signal assumes a maximum value; and comparing the intensity signal with at least one predetermined reference value. A method for monitoring a laser machining process and an associated laser machining system are also provided.

An automatic landing method, system, and storage medium for laser processing. The method includes: adjusting the relative position of the microscope objective and the workpiece to be processed along the direction of the optical axis within a preset travel range; during the adjustment process, collecting images of the workpiece to be processed in real-time and detecting the intensity of reflected light or fluorescence in real-time according to the image; determine the position of the strongest reflected light or the fluorescence initiation position according to the intensity detection data of reflected light or fluorescence. By scanning the intensity of reflected light or fluorescence, the invention achieves the purpose of quickly and accurately adjusting the laser focus to land on the surface to be processed, effectively improving the processing success rate, processing quality, and processing accuracy, and the solution is economical and efficient.

A processing apparatus configured to process a processing target object includes a holder configured to hold the processing target object; a modifying device configured to radiate laser light to an inside of the processing target object to form multiple internal modification layers; and a controller. The controller controls an operation of forming the internal modification layers such that the internal modification layers are formed in a spiral shape from a diametrically outer side of the processing target object toward a diametrically inner side thereof, and such that an eccentric amount between the holder and the processing target object held by the holder in the forming of the internal modification layers toward the diametrically inner side of the processing target object becomes smaller than the eccentric amount in forming the internal modification layers toward the diametrically outer side of the processing target object.

The objective of the present invention is to provide a conveyor for discharging scraps of a laser notching machine. The present invention comprises: a conveyor (20); a suction duct (52) which is connected to the conveyor (20) so as to suck, from the conveyor, scraps (2S) generated when a tab (2C) is formed on a pole plate (2) passing through the conveyor (20); and a scrap discharge hole (34) for sucking and discharging the scraps (2S) from the conveyor (20), wherein the conveyor (20) includes: a conveyor body (22); and a conveyor belt (24) for performing a continuous track motion so as to pass the upper and lower surfaces of the conveyor body (22), wherein the conveyor body (22) has a vacuum sector (22VS) and a vacuum release sector (22RS), the vacuum sector (22VS) is configured to have a vacuum suction hole communicating from the inner space portion of the conveyor body (22) to the bottom surface of the conveyor body (22), and the scrap discharge hole (34) is disposed under the vacuum release sector (22RS).

The laser machining device includes an observation image acquiring unit configured to repeatedly acquire an observation image of a machining spot of laser light emitted from a laser optical system to a street on a wafer while a machined groove is being formed, a luminance detector configured to detect a luminance of a plasma generated at the machining spot by emission of the laser light based on the observation image every time the observation image acquiring unit acquires the observation image, a correspondence information obtaining unit configured to obtain correspondence information indicating a correspondence relationship among the luminance, energy of the laser light and a machined state of the machined groove, and a machined state assessing unit configured to assess the machined state with reference to the correspondence information based on the luminance and known energy of the laser light every time the luminance detector detects the luminance.

A directed energy deposition system and method including a set of nozzles for directing material, such in the form of a particle stream, at a part and a set of energy sources for generating a melt pool as the material contacts the part. The system further includes apparatus for generating a sound field that controls characteristics of the particle stream as it passes through the sound field.

A laser pipe cutting device is provided. It includes a cutting head, a lathe bed, a first chuck, a second chuck and a third chuck; the first chuck is a fixed chuck for positioning axially and radially a pipe fitting; the second chuck is a rolling chuck for positioning radially the pipe fitting; and a fixed clamping disc and a rolling clamping disc are arranged on the third chuck at both ends. In the scheme, the third chuck integrates both the rolling clamping function and the fixed clamping function to achieve larger supporting weight and more accurate clamping precision, so that the chucks can drive a thin pipe fitting to rotate at a higher speed, the cutting efficiency is improved, and no-dead-angle and zero-tailing cutting is achieved.

A machine tool arranged to deliver an energy source through a processing head onto a work-piece, wherein; the machine-tool has a clamping mechanism arranged to temporarily receive the processing-head, or another machining or processing-head, to process a work-piece; the processing-head comprising one or more guiding mechanisms arranged to direct the energy source onto a work-piece and a processing-head docking-manifold arranged to have connected thereto one or more media to be, in use, supplied to the processing-head to facilitate processing of the work-piece; wherein the processing-head docking-manifold allows the one or more media to be supplied to the processing-head when the processing-head is connected to the clamping mechanism; and wherein the machine-tool also comprises at least one mechanism arranged to move a supply docking-manifold into and/or out of connection with the processing-head docking-manifold such that when the two manifolds are connected the or each media is supplied to the processing head.