B23K35/004

Coating concept
10335881 · 2019-07-02 · ·

The present invention relates to composition comprising a blend of at least one boron source and at least one silicon source, and the composition further comprises particles selected from particles having wear resistance properties, particles having surface enhancing properties, particles having catalytic properties or combinations thereof, wherein the blend comprises boron and silicon in a weight ratio boron to silicon within a range from about 3:100 wt:wt to about 100:3 wt:wt, wherein silicon and boron are present in the blend in at least 25 wt %, and wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the blend is a mechanical blend of particles in and the particles have an average particle size less than 250 m. The present invention relates further to a method for providing a coated product and a coated product obtained by the method.

Method for joining metal parts
10323890 · 2019-06-18 · ·

A method for joining a first metal part with a second metal part, the metal parts having a solidus temperature above 1000 C. The method includes applying a melting depressant composition on a surface of the first metal part, the melting depressant composition including a melting depressant component that includes phosphorus and silicon for decreasing a melting temperature of the first metal part; bringing the second metal part into contact with the melting depressant composition at a contact point on said surface; heating the first and second metal parts to a temperature above 1000 C.; and allowing a melted metal layer of the first metal component to solidify, such that a joint is obtained at the contact point. The melting depressant composition and related products are also described.

ENGINEERED MATERIALS FOR ELECTRONICS ASSEMBLY

A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.

INTERLAYERED STRUCTURES FOR JOINING DISSIMILAR MATERIALS AND METHODS FOR JOINING DISSIMILAR METALS
20190134755 · 2019-05-09 · ·

An interlayered structure for joining of dissimilar materials, includes a first material substrate, a second material substrate having a composition dissimilar from a composition of the first material substrate, and a plurality of interlayers disposed between the first material substrate and the second material substrate, including a first interlayer nearest to the first material substrate and a last interlayer nearest to the second material substrate. The first interlayer has a composition selected to have a maximum solid solubility within the composition of the first material substrate that is greater than or equal to the other interlayers' solubility within the composition of the first material substrate. The last interlayer has a composition selected to have a maximum solid solubility within the composition of the second material substrate that is greater than or equal to the other interlayers' solubility within the composition of the second material substrate. At least one of the plurality of interlayers is a sintered powder interlayer.

Interlayered Structures for Joining Dissimilar Materials and Methods for Joining Dissimilar Metals
20190134756 · 2019-05-09 · ·

An interlayered structure for joining of dissimilar materials includes: a first material substrate; a second material substrate having a composition dissimilar from a composition of the first material substrate; and a plurality of interlayers disposed between the first material substrate and the second material substrate, including a first interlayer nearest to the first material substrate and a last interlayer nearest to the second material substrate. The first interlayer has a composition selected to have a maximum solid solubility within the composition of the first material substrate that is greater than or equal to the other interlayers within the composition of the first material substrate, and the last interlayer has a composition selected to have a maximum solid solubility within the composition of the second material substrate that is greater than or equal to the other interlayers within the composition of the second material substrate.

TIG WELDED JOINT

A TIG welded joint in a high-Mn content steel material that can be formed with reduced occurrence of hot cracking during the welding process and has high strength and excellent cryogenic impact toughness. In the TIG welded joint, the high-Mn content steel material has a chemical composition including, by mass %, C: 0.10 to 0.80%, Si: 0.05 to 1.00%, Mn: 18.0 to 30.0%, P: 0.030% or less, S: 0.0070% or less, Al: 0.010 to 0.070%, Cr: 2.5 to 7.0%, N: 0.0050 to 0.0500%, and O: 0.0050% or less, the balance being Fe and incidental impurities, and a weld metal has a chemical composition including C: 0.10 to 0.80%, Si: 0.05 to 1.00%, Mn: 15.0 to 30.0%, P: 0.030% or less, S: 0.030% or less, Al: 0.100% or less, Cr: 6.0 to 14.0%, and N: 0.100% or less, the balance being Fe and incidental impurities.

Multi-process alloy clad
12030275 · 2024-07-09 ·

A method of creating a clad metal part is provided. The method includes explosion bonding a plate comprised of a base layer and an interlayer. The explosion bonded plate is then cut into bars which are roll bonded with a clad layer. Ultimately a part is fabricated from the roll bonded bar. The solution enables parts to have material combinations and resulting physical properties more optimal for an application than a single bonding process.

Methods and systems for making poison pads

One or more specific embodiments herein includes a method for making a poison pad configured to be coupled to a pipe elbow joint, comprising providing or obtaining a die. The die comprises a first die portion, a second die portion, and an insert die portion providing or obtaining a blank, positioning the insert die portion between the first die portion and the second die portion, positioning the blank between either the first die portion and the insert die portion or the insert die portion and the second die portion, and pressing the blank between the first die portion and the second die portion such that the shape of the blank corresponds to one or more of the first die portion, second die portion, and insert die portion to form the poison pad or a precursor structure to become the poison pad.

Welding material and welding joint

There is provided a welding material used for welding of SUS310 stainless steel base metal that contains at least one of Nb and V and is excellent in intergranular corrosion resistance, the chemical composition of the welding material consisting, by mass percent, of C: 0.02% or less, Si: 2% or less, Mn: 2% or less, Cr: 26 to 50%, N: 0.15% or less, P: 0.02% or less, S: 0.002% or less, and Ni: a content percentage satisfying [5NiCr14], and the balance of Fe and impurities. Also, there is provided a welding joint of an austenitic stainless steel, which consists of the base metal and a weld metal formed by using the welding material.

METHOD FOR WELDING AUSTENITIC STAINLESS STEEL SHEETS

A method for welding austenitic stainless steel sheets, in which welding defects do not easily occur. Austenitic stainless steel sheets each with a sheet thickness of 0.6 to 1.0 mm, which each contain, in terms of mass %, 0.08% or less of C, 1.5 to 4.0% of Si, 2.0% or less of Mn, 0.04% or less of P, 0.01% or less of S, 16.0 to 22.0% of Cr, 10.0 to 14.0% of Ni, and 0.08% or less of N, and contain at least one of Nb and Ti in an amount of 1.0% or less in total, with the rest including Fe and inevitable impurities, are overlapped and the overlapped portion is welded by arc welding. In addition, the back side of a deposited portion is cooled from 1200 C. to 900 C. at a cooling rate of 110 C./sec or higher.