A bonding body includes: an aluminum member composed of aluminum; and a metal member composed of any one of copper, nickel, and silver, wherein the aluminum member and the metal member are bonded together. In a bonding interface between the aluminum member and the metal member, a Ti layer and an AlTiSi layer are formed, the Ti layer being disposed at the metal member side in the bonding interface, and the AlTiSi layer being disposed between the Ti layer and the aluminum member and containing Si which is solid-solubilized into Al.sub.3Ti. The AlTiSi layer includes: a first AlTiSi layer formed at the Ti layer side; and a second AlTiSi layer formed at the aluminum member side and a Si concentration of which is lower than a Si concentration of the first AlTiSi layer.

A composite material includes: an iron-based alloy layer; an intermediate layer provided on the iron-based alloy layer; and a tungsten-containing layer provided on the intermediate layer, wherein the intermediate layer is composed of pure nickel or is an alloy that contains at least one selected from a group consisting of copper, cobalt, and iron at more than 0 mass % and less than or equal to 71 mass % in total, and that contains nickel at more than or equal to 29 mass % and less than 100 mass %.

An electrostatic chuck includes a ceramic top plate layer made of a beryllium oxide material, a ceramic bottom plate layer made of a beryllium oxide material, a ceramic middle plate layer disposed between the ceramic top plate layer and the ceramic bottom plate layer, an electrode layer disposed between the ceramic top plate layer and the ceramic middle plate layer, and a heater layer disposed between the ceramic middle plate layer and the ceramic bottom plate layer. The electrode layer joins and hermetically seals the ceramic top plate layer to the ceramic middle plate layer, and the heater layer joins and hermetically seals the ceramic middle plate layer to the ceramic bottom plate layer.