A multi-layered brazing sheet material including an aluminium core alloy layer, a brazing clad layer material on one face of the core layer, an inter-layer between the core layer and brazing clad layer material, and a water-side layer on the other face of the core layer. The core layer made from aluminium alloy having, in wt. %, up to 0.6% Si, up to 0.45% Fe, 0.6% to 1.25% Cu, 0.6% to 1.4% Mn, 0.08% to 0.4% Mg, up to 0.2% Cr, up to 0.25% Zr, up to 0.2% Ti, up to 0.3% Zn, balance aluminium and impurities. The brazing layer made from aluminium alloy having 6% to 14% Si and up to 2% Mg, balance aluminium and impurities. The inter-layer made from 1xxx-series aluminium alloy. The water-side layer made from 3xxx-series aluminium alloy having 0.5% to 1.8% Mn and 1% to 3.5% Zn.

The invention relates to an ingot consisting of an aluminium solder alloy having in percentage by weight 4.5%≦Si≦12%; and optionally one or more of the following alloying constituents in percentage by weight: Ti≦0.2%, Fe≦0.8%, Cu≦0.3%, Mn≦0.10%, Mg≦2.0%, Zn_23 0.20%, Cr≦0.05%, with the remainder aluminium and unavoidable impurities, individually at most 0.05 wt %, in total at most 0.15 wt %, wherein boron is additionally provided as an alloying constituent, wherein the boron content is at least 100 ppm and the aluminium alloy is free from primary Si particles having a size of more than 20 μm. The invention further relates to an aluminium alloy product consisting of an aluminium alloy, to an ingot consisting of an aluminium alloy and to a method for producing an aluminium alloy.

This disclosure includes the description of a braze alloy composition. The braze composition contains nickel, about 5% by weight to about 25% by weight germanium; and about 1% by weight to about 4% by weight boron. The composition has an amorphous structure, and is free of silicon.

An active braze alloy composition is described, including nickel; or a combination of nickel and cobalt; about 2% by weight to about 30% by weight germanium; and about 1% by weight to about 5% by weight boron and about 0.5% by weight to about 5% by weight of at least active element. The composition is free of silicon. Braze alloy joints formed of the braze alloy composition, and located in various devices, structures, and machines, are also described. A related method for repairing a crack or other cavity within a metal component, using the braze composition, is further described.

A lead-free solder ball is provided which suppresses interfacial peeling in a bonding interface of a solder ball, fusion defects which develop between the solder ball and solder paste, and which can be used both with Ni electrodes plated with Au or the like and Cu electrodes having a water-soluble preflux applied atop Cu. The lead-free solder ball for electrodes of BGAs or CSPs consists of 1.6-2.9 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. It has excellent resistance to thermal fatigue and to drop impacts regardless of the type of electrodes of a printed circuit board to which it is bonded, which are Cu electrodes or Ni electrodes having Au plating or Au/Pd plating as surface treatment. The composition may include at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003-0.1 mass %.

A clad material includes a core material, a first skin material covering one side of the core material, and a second skin material covering the other side of the core material. The clad material is brazed in a state in which the first and second skin materials overlap each other. The core material is made of an Al alloy containing Mn (0.6 to 1.5 mass %), Ti (0.05 to 0.25 mass %), Cu (less than 0.05 mass %), Zn (less than 0.05 mass %), Fe (0.2 mass % or less), and Si (0.45 mass % or less) (balance: Al and unavoidable impurities). The first skin material is made of an Al alloy containing Si (6.8 to 11.0 mass %) and Zn (0.05 mass % or less) (balance: Al and unavoidable impurities). The second skin material is made of an Al alloy containing Si (4.0 to 6.0 mass %) and Cu (0.5 to 1.0 mass %) (balance: Al and unavoidable impurities).

Methods of making solder preforms are disclosed. A ribbon of raw material is received, and a first annular solder preform is formed by laser cutting the ribbon. The edges of the first annular solder preform can then be cleaned. The cutout section removed from the middle of the first annular solder preform can then be laser cut to form a second annular solder preform that is smaller than the first annular solder preform.

There is a problem that contact resistance increases due to formation of an oxide film on a contact interface or biting of abrasion powder caused by micro-sliding when a contact connecting portion of a connection terminal including non-noble metal members is exposed to high temperature environment or a repetitious temperature cycle. An object of the present invention is to provide an in-vehicle electronic module that has connection reliability equivalent to that of the conventional in-vehicle electronic module even when being placed in the environment of an engine compartment and can achieve cost reduction by reducing the number of parts and assembly steps. The electronic module includes a mounting board having a circuit board on which an electronic component is mounted, and a case member for accommodating and protecting the mounting board from surrounding environment, The electronic module has a connection structure in which a portion of the circuit board is protruded to the outside through an opening of the case and inserts a board terminal into an external female connector to obtain electrical continuity, and a portion of the case member forms a connector housing that receives the female connector and isolates a space in which the board terminal is present from surrounding environment and an insulating resin member for fixing the circuit board in the case is integrally molded or joined with the circuit board.

A Cu core ball and a method of manufacturing such a Cu core ball. Purity of the Cu internal ball is at least 99.9% and not greater than 99.995%. A total contained amount of Pb and/or Bi in impurity contained in the Cu ball is equal to or larger than 1 ppm. Its sphericity is at least 0.95. A solder plating film coated on the Cu ball is of Sn solder or a lead free solder alloy whose primary component is Sn. In the solder plating film, a contained amount of U is not more than 5 ppb and that of Th is not more than 5 ppb. A total alpha dose of the Cu ball and the solder plating film is not more than 0./0200 cph/cm2. An arithmetic average roughness of the Cu core ball is equal to or less than 0.3 μm.

A method includes disposing a braze material adjacent a first body and a second body; heating the braze material and forming a transient liquid phase; and transforming the transient liquid phase to a solid phase and forming a bond between the first body and the second body. The braze material includes copper, silver, zinc, magnesium, and at least one material selected from the group consisting of nickel, tin, cobalt, iron, phosphorous, indium, lead, antimony, cadmium, and bismuth.