B23K35/36

Fusible metal clay, structures formed therefrom, and associated methods

Structures for a tool surface of a downhole tool are constructed from a metal clay molded in a wet state. The wet state clay is a workable combination that can have a braze alloy grain, a tungsten carbide grain, and a binder. Additional cutting inserts can be embedded in the molded clay. Heat treatment applied to the molded metal clay causing the binder to be combusted and consumed. The braze alloy melts and then cools into a fused state with the tungsten carbide grain therein. The structure can affix to the tool surface of the tool by first being fused and then attached by brazing to the tool. Alternatively, the structure can be positioned in a fusible state adjacent the tool surface. When the heat treatment is applied, the structure fuses together and forms a metallurgical bond with the tool surface of the tool.

Wire manufactured by additive manufacturing methods
11691198 · 2023-07-04 · ·

Systems and methods for the manufacture of a solid wire using additive manufacturing techniques are disclosed. In one embodiment, a fine powdery material is sintered or melted or soldered or metallurgically bonded onto a metal strip substrate in a compacted solid form or a near-net shape (e.g., a near-net solid wire shape) before being turned into a final product through forming or drawing dies.

Wire manufactured by additive manufacturing methods
11691198 · 2023-07-04 · ·

Systems and methods for the manufacture of a solid wire using additive manufacturing techniques are disclosed. In one embodiment, a fine powdery material is sintered or melted or soldered or metallurgically bonded onto a metal strip substrate in a compacted solid form or a near-net shape (e.g., a near-net solid wire shape) before being turned into a final product through forming or drawing dies.

Brazing compositions and uses thereof

Described herein are compositions for use in the brazing of metal substrates. Methods of making and using these compositions are also described herein.

Flux, resin flux cored solder, and solder paste

A flux according to the present invention includes a phosphine oxide. It is thereby possible to provide a flux capable of improving solder wettability, a resin flux cored solder including the flux, and a solder paste including the flux.

Mixed composition coating material for brazing

In a mixed composition coating material for brazing, when a total mass of a solid material, an organic solvent, and water is defined as 100 mass %, the solid material are contained in an amount of 30 mass % or greater and 80 mass % or less with respect to the whole coating material, the organic solvent and the water is contained in a total amount of 20 mass % or greater and 70 mass % or less with respect to the whole coating material, and the water is contained in an amount of 0.4 mass % or greater and 2.5 mass % or less with respect to the whole coating material.

Self-shielded flux-cored welding wire with special protective slag coating formed in situ and manufacture method thereof

A self-shielded flux-cored welding wire with a special protective slag coating formed in situ and a manufacture method thereof. The self-shielded flux-cored welding wire includes a low-carbon steel belt and a flux core powder, the flux core powder is filled in the low-carbon steel belt, the flux core powder includes the following ingredients in percentage by mass: 60-80% glass powder, 2-8% zirconium oxide powder, 0.05-0.85% graphene powder, 2-8% potassium carbonate sodium powder, 1-3% potassium titanate powder, 2-5% rutile powder, 1-5% corundum powder, 1-3% sodium fluorosilicate powder, and the balance of iron powder, and a weight of the flux core powder accounts for 13-25% of a total weight of the welding wire.

FLUX AND SOLDER PASTE
20220402079 · 2022-12-22 ·

A flux containing: a rosin; a solvent (S); a thixotropic agent; and an activator is disclosed. The rosin contains a rosin amine. The solvent (S) contains a first solvent (S1) having a boiling point of 250° C. or less, and the amount of the first solvent (S1) relative to the total amount of the solvent (S) is 50% by mass or more and 100% by mass or less.

Solder composition

Provided is a solder composition including a flux, a solder alloy, and a silicone oil. The solder composition can have a kinematic viscosity at 25° C. of 5000 mm.sup.2/s or more and 200,000 mm.sup.2/s or less. The silicone oil can be at least one member selected from the group consisting of dimethyl silicone oil, methylphenyl silicone oil, methylhydrogen silicone oil, reactive silicone oil, and non-reactive silicone oil.

Welding device and welding method

A welding system includes a welding torch that welds a workpiece by using a wire, a suction device that sucks shielding gas, and a sucked shielding gas supply path for allowing the sucked shielding gas to flow, wherein the welding torch includes a contact chip that guides the wire, a shielding gas supply nozzle that supplies the shielding gas to a weld zone, and a suction nozzle that surrounds a periphery of the wire protruding from the contact chip, and is opened toward a tip of the wire to suck the shielding gas.