The present invention relates to a method for joining at least two metal workpiece parts (2, 8) of a differing metal composition to each other by means of explosion welding, comprising the steps of: •—enclosing an inner workpiece part (2) at least partially with an outer workpiece part (89; •—arranging a mantle of explosive material (14) round the outer workpiece part; and •—detonating the explosive material in order to bring about a metallurgical connection between the two workpiece parts; •—wherein during the detonation of the explosive material the inner workpiece part is substantially wholly filled with and/or is at least partially enclosed by a dilatant non-Newtonian mixture (20). The invention further relates to a workpiece manufactured via this method.

A flux-cored wire for gas-shielded arc welding has a steel outer sheath filled with a flux. The flux-cored wire includes specific amounts, relative to a total mass of the wire, of TiO.sub.2, at least one of Si, an Si oxide and an Si compound, C, Mn, Mo, Ni, at least one of metal Mg and an Mg alloy, an F compound, a K compound, an Na compound, B and a B compound, and Fe, respectively. A total content of each of Ti and a Ti alloy, metal Al and an Al alloy, and V is restricted to the specific range, respectively. A content of Ti is also restricted to the specific range relative to the total mass of the steel outer sheath.

A method of resistance spot welding a workpiece stack-up that includes an aluminum workpiece and an overlapping adjacent steel workpiece so as to minimize the thickness of an intermetallic layer comprising Fe—Al intermetallic compounds involves providing reaction-slowing elements at the faying interface of the aluminum and steel workpieces. The reaction-slowing elements may include at least one of carbon, copper, silicon, nickel, manganese, cobalt, or chromium. Various ways are available for making the one or more reaction-slowing elements available at the faying interface of the aluminum and steel workpieces including being dissolved in a high strength steel or being present in an interlayer that may take on a variety of forms including a rigid shim, a flexible foil, a deposited layer adhered to and metallurgically bonded with a faying surface of the steel workpiece, or an interadjacent organic material layer that includes particles containing the reaction-slowing elements.

The disclosed method relates to manufacturing a heat exchanger which causes no brazing defects, and a heat exchanger manufactured by the method. The method relates to manufacturing a heat exchanger having an aluminum alloy tube defining a cooling-medium flowing passage and a copper alloy tube defining a water flowing passage, wherein a heat exchange is carried out between a cooling medium flowing through the cooling-medium flowing passage and water flowing through the water flowing passage. The aluminum alloy tube and the copper alloy tube are brazed to each other at a temperature of less than 548° C.

An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode.

An aluminum wire body, in which an aluminum or aluminum alloy electric wire and a metal to be joined are joined by solder, wherein the solder includes an oxide glass including vanadium and a conducting particle. Preferably, the conducting particle contained in the solder is 90% by volume or less and the oxide glass is 20% by volume to 90% by volume. Further preferably, the oxide glass includes 40% by mass or more of Ag.sub.2O in terms of oxides and the glass transition point is 180° C. or less.

An electrode (10) is presented including a sheath (14) formed of a ductile material, an outer coating (16) including a flux material, and a core (12) including at least one of flux material and alloying material. The ductile material may be an extrudable subset of elements of a desired superalloy material and the alloying material may include elements that complement the ductile material to form a desired superalloy material when the electrode is melted. The outer coating may be formed of a flexible bonding material or it may be segmented (18, 20) to facilitate bending the electrode onto a spool. Any hygroscopic material of the electrode may be included in the core to protect it from exposure to atmospheric moisture.

Provided are a Cu column, a Cu core column, a solder joint, and a through-silicon via, which have the low Vickers hardness and the small arithmetic mean roughness. For the Cu column 1 according to the present invention, its purity is equal to or higher than 99.9% and equal to or lower than 99.995%, its arithmetic mean roughness is equal to or less than 0.3 μm, and its Vickers hardness is equal to or higher than 20 HV and equal to or less than 60 HV. Since the Cu column 1 is not melted at a melting temperature in the soldering and a definite stand-off height (a space between the substrates) can be maintained, it is preferably applied to the three dimensional mounting or the pitch narrowing mounting.

A solder composition of the invention includes: a flux composition containing a component (A) in a form of a rosin-based resin, a component (B) in a form of an activator, a component (C) in a form of a solvent and a component (D) in a form of a thixotropic agent; and a component (E) in a form of a solder powder. The component (C) in a form of the solvent contains a component (C1) in a form of a isobornyl cyclohexanol and a component (C2) in a form of a solvent whose viscosity at 20 degrees C. is 10 mPa.Math.s or less and whose boiling point ranges from 220 degrees C. to 245 degrees C.

A one-step water soluble (WS) flux process may reduce residue staining and increase yields for bond grid array (BGA) packages. In one example, the WS flux may use increased amounts of bonding polymer (BP) and reduced amounts of amine to increase viscosity. The increased viscosity may eliminate using a second no-clean flux and enable a single WS flux to both clean the associated substrate and provide stable solder ball support during reflow.