Patent classifications
B23K35/38
Displacement welding chamber
Various welding chambers are disclosed herein. A welding chamber body has a glove tube attached to its sidewall. A windowed hood structure is attached to the welding chamber body using a hinge assembly. A manifold assembly has a main branch and perforated secondary branches. A cross sectional area of the main branch is greater than a second cross sectional area of one of the secondary branches.
Displacement welding chamber
Various welding chambers are disclosed herein. A welding chamber body has a glove tube attached to its sidewall. A windowed hood structure is attached to the welding chamber body using a hinge assembly. A manifold assembly has a main branch and perforated secondary branches. A cross sectional area of the main branch is greater than a second cross sectional area of one of the secondary branches.
ALUMINUM ALLOY WELDING WIRE
The present disclosure relates generally to the field of welding filler metals, and more particularly to compositions suitable for welding or brazing aluminum alloys. In an embodiment, an aluminum-silicon-magnesium alloy, includes a magnesium content between approximately 0.1 wt % and approximately 0.5 wt %, wherein substantially all of the magnesium content is present as magnesium silicide. The alloy includes a silicon content between approximately 5.0 wt % and approximately 6.0 wt %, wherein at least 4.75 wt % of the silicon content is present as free silicon. The alloy includes one or more of iron, copper, manganese, zinc, and titanium. The alloy further includes a remainder of aluminum and trace components.
Method for welding a case hardened component
A method for producing a welded part from two components, where at least one of the components has a hardened surface. The method can include case hardening the surface of one of the components using a salt bath nitriding process and then welding the case hardened first component to the second component by gas metal arc welding (GMAW).
Joint Manufacturing Method
Provided is a joint manufacturing method including: a step A of preparing a laminate in which two objects to be joined are temporarily adhered with a heat-joining sheet including a pre-sintering layer interposed between the two objects to be joined; a step B of increasing a temperature of the laminate from a temperature equal to or lower than a first temperature defined below to a second temperature; and a step C of holding the temperature of the laminate in a predetermined range after the step B, in which the laminate is pressurized during at least a part of the step B and at least a part of the step C. The first temperature is a temperature at which an organic component contained in the pre-sintering layer is decreased by 10% by weight when the pre-sintering layer is subjected to thermogravimetric measurement.
SYSTEMS AND METHODS FOR WELDING ELECTRODES
The invention relates generally to welding and, more specifically, to welding wires for arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FCAW). In one embodiment, a tubular welding wire includes a sheath and a core, and the core comprises a rare earth silicide component (cerium, lanthanum, or a combination thereof). The core may also comprise an organic stabilizer component, a carbon component, and an agglomerate. The organic stabilizer component may comprise an organic molecule or organic polymer bound to one or more Group I or Group II metals. The carbon component may comprise graphite, graphene, carbon black, lamp black, carbon nanotubes, diamond, or a combination thereof. The agglomerate may comprise oxides of one or more Group I or Group II metals, titanium, and manganese.
SYSTEMS AND METHODS FOR WELDING ELECTRODES
The invention relates generally to welding and, more specifically, to welding wires for arc welding, such as Gas Metal Arc Welding (GMAW) or Flux Core Arc Welding (FCAW). In one embodiment, a tubular welding wire includes a sheath and a core, and the core comprises a rare earth silicide component (cerium, lanthanum, or a combination thereof). The core may also comprise an organic stabilizer component, a carbon component, and an agglomerate. The organic stabilizer component may comprise an organic molecule or organic polymer bound to one or more Group I or Group II metals. The carbon component may comprise graphite, graphene, carbon black, lamp black, carbon nanotubes, diamond, or a combination thereof. The agglomerate may comprise oxides of one or more Group I or Group II metals, titanium, and manganese.
Shielding gas for mag welding, mag welding method, and welded structure
The shielding gas for MAG welding according to an embodiment is a shielding gas for MAG welding to perform narrow gap welding of a high Cr steel containing 8 wt % to 13 wt % of Cr with one layer-one pass by using a solid wire containing 8 wt % to 13 wt % of Cr, and the shielding gas for MAG welding comprises a ternary mixed gas of 5% by volume to 17% by volume of a carbon dioxide gas, 30% by volume to 80% by volume of a helium gas, and a balance of an argon gas.
SOLDER PASTE FOR REDUCTION GAS, AND METHOD FOR PRODUCING SOLDERED PRODUCT
The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.
SOLDER PASTE FOR REDUCTION GAS, AND METHOD FOR PRODUCING SOLDERED PRODUCT
The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.