A bonding system for bonding a semiconductor element to a substrate is provided. The bonding system includes a substrate oxide reduction chamber configured to receive a substrate. The substrate includes a plurality of first electrically conductive structures. The substrate oxide reduction chamber is configured to receive a reducing gas to contact each of the plurality of first electrically conductive structures. The bonding system also includes a substrate oxide prevention chamber for receiving the substrate after the reducing gas contacts the plurality of first electrically conductive structures. The substrate oxide prevention chamber has an inert environment when receiving the substrate. The bonding system also includes a reducing gas delivery system for providing a reducing gas environment during bonding of a semiconductor element to the substrate.

An aluminum alloy brazing sheet is formed of a brazing material, an intermediate material, a core material, and a brazing material. The intermediate material contains Mg of 0.40 to 6.00 mass %, and has total of contents of Mn, Cr, and Zr being 0.10 mass % or more. The core material contains Mg of 0.20 to 2.00 mass % and one or two or more of Mn of 1.80 mass % or less, Si of 1.50 mass % or less, Fe of 1.00 mass % or less, Cu of 1.20 mass % or less, Ti of 0.30 mass % or less, Zr of 0.30 mass % or less, and Cr of 0.30 mass % or less. Each of the core material and the intermediate material has a grain size of 20 to 300 μm, and each of the brazing materials contain Si of 4.00 to 13.00 mass %.

A welding method includes providing a first connector having a first end, providing a second connector having a second end for being welded to the first end, overlapping the first end and the second end, applying a contactless heating to a central section of the first end and melting an end section of the first end facing the second connector, and cooling the first end and the second end to form a weld connecting the first connector and the second connector. The first connector and the second connector extend in opposite directions from the weld.

A welding method includes providing a first connector having a first end, providing a second connector having a second end for being welded to the first end, overlapping the first end and the second end, applying a contactless heating to a central section of the first end and melting an end section of the first end facing the second connector, and cooling the first end and the second end to form a weld connecting the first connector and the second connector. The first connector and the second connector extend in opposite directions from the weld.

Disclosed is a different-strength steel welding component with an aluminum or aluminum-alloy plating formed by means of butt welding of a high-strength steel plate and a low-strength steel plate, and each of the high-strength steel plate and the low-strength steel plate comprises a base body and at least one pure aluminum or aluminum-alloy plating on a surface of the base body. The tensile strength of a welding seam of the welding component after hot stamping is greater than the tensile strength of a low-strength steel base metal, and the elongation is greater than 4%, such that application requirements of the welding component in the field of automobile hot stamping are met. The present disclosure also relates to a method for manufacturing a different-strength steel welding component with an aluminum or aluminum-alloy plating and a welding wire used in the method.

A torch for performing TIG welding is disclosed. The torch includes an electrode for a TIG/GTAW welding operation with an inert gas and an active gas. In accordance with at least one embodiment of the present invention, the torch includes a torch body having a first fluid channel and a second fluid channel, an electrode assembly disposed in the torch body, a nozzle concentric with the electrode and a shield cap concentric with the nozzle. An angle between a longitudinal axis of the electrode assembly and an outer surface of at least one of the electrode holder and the electrode is about nine degrees.

A flux for soldering contains 10 to 40 wt % of coumarin, 5 to 30 wt % of a monoamide-based thixotropic agent and 40 to 80 wt % of a solvent. A solder paste contains the flux and a solder powder. A method for producing a soldered product includes supplying the solder paste to a soldering portion of an electronic circuit board, mounting an electronic component onto the soldering portion and heating the soldering portion up to a temperature at which the solder powder melts in a reducing atmosphere containing a reducing gas to join the electronic component and the electronic circuit board.

A method for manufacturing a heat exchanger (1) includes joining an inner fin (3) to a hollow structure (20) formed from at least two clad plates (200a, 200b) by heating and brazing a filler metal layer (B). Each clad plate has a core layer (A) composed of an aluminum alloy that contains Mg: 0.40-1.0 mass %. The filler metal layer is composed of an aluminum alloy that contains Si: 4.0-13.0 mass %, and further contains Li: 0.0040-0.10 mass %, Be: 0.0040-0.10 mass %, and/or Bi: 0.01-0.30 mass %. The inner fin is composed of an aluminum alloy that contains Si: 0.30-0.70 mass % and Mg: 0.35-0.80 mass %. A flux (F) that contains cesium (Cs) is applied along a contact part (201), and the vicinity thereof, of the at least two clad plates prior to the heating. A heat exchanger (1) may be manufactured according to this method.

The provided relates to a method for preparing an anisotropic conductive adhesive for fine pitch and an anisotropic conductive adhesive for fine pitch prepared by the same method. Provided is a method for preparing an anisotropic conductive adhesive for a fine pitch including: (i) removing an oxide film of solder particles having self-fusion and self-orientation functions between metal terminals of a substrate by melting the solder particles at a predetermined temperature using a first reducing agent; (ii) removing moisture generated in step (i); and (iii) preparing an anisotropic conductive adhesive by mixing the solder particles from which the oxide film and the moisture are removed with a binder resin in steps (i) and (ii), in which step (iii) is performed in a state where a contact with oxygen is blocked.

The provided relates to a method for preparing an anisotropic conductive adhesive for fine pitch and an anisotropic conductive adhesive for fine pitch prepared by the same method. Provided is a method for preparing an anisotropic conductive adhesive for a fine pitch including: (i) removing an oxide film of solder particles having self-fusion and self-orientation functions between metal terminals of a substrate by melting the solder particles at a predetermined temperature using a first reducing agent; (ii) removing moisture generated in step (i); and (iii) preparing an anisotropic conductive adhesive by mixing the solder particles from which the oxide film and the moisture are removed with a binder resin in steps (i) and (ii), in which step (iii) is performed in a state where a contact with oxygen is blocked.